...Yuan Peng; Lu Han; Yao Chen; Zheng Huang; Tiantian Tan; Xiaotong Guo Purpose This study aims to systematically investigate the failure mechanisms of plastic ball grid array ( PBGA )-packaged Sn-37Pb/Cu solder joints under extreme thermal shock conditions. It specifically focuses on understanding...

... and economical than the board level test method. With the miniaturization of solder joints, solder joints were more prone to failure under thermal shock and more attention has been paid to the impact reliability of solder joint. But Pb-free solder joints may be paid too much attention and Sn-Pb solder joints may...

... commencement and proliferation in the preheat stage of reflow oven. Moreover, this paper also categorized and suggested important parameters of reflow profile that could be used to eliminate these thermal shock failures. Design/methodology/approach In this paper, two different reflow profiles were studied...

.... Design/methodology/approach Thermal shock test between −55°C and 125 °C was conducted on Sn-37Pb solder bumps in the BGA package to investigate the microstructure evolution and the growth mechanism of interfacial intermetallic compound (IMC) layer. The effects of thermal shock on the mechanical property...