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1-4 of 4
Keywords: Tin‐lead
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Journal Articles
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2004) 16 (1): 35–43.
Published: 01 April 2004
...‐sectioned samples using a scanning electron microscope. Furthermore, the wetting of the leads by the solder and thickness of the IMC layers were studied. © Emerald Group Publishing Limited 2004 Solders Soldering Mechanical properties of materials Drop‐point determination Tin‐lead Surface...
Journal Articles
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2004) 16 (1): 44–47.
Published: 01 April 2004
... in the implementation of lead‐free processes. In this study, the requirements for component placement are discussed from the lead‐free process point of view. Experiments concerning the self‐alignment capability and tack strength of both tin‐lead and lead‐free solder pastes are presented. According to the results...
Journal Articles
John Lau, Walter Dauksher, Joe Smetana, Rob Horsley, Dongkai Shangguan, Todd Castello, Irv Menis, Dave Love, Bob Sullivan
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2004) 16 (1): 12–26.
Published: 01 April 2004
... Group Publishing Limited 2004 Solder Soldering Tin‐lead Design for quality Printed‐circuit boards Finite element analysis On 10 October 2002, the European Union (EU) Parliament and the EU Council of Ministers reached an agreement on a text for the Waste Electrical and Electronic...
Journal Articles
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (1998) 10 (3): 29–37.
Published: 01 December 1998
...Se‐Young Jang; Kyung‐Wook Paik In flip‐chip interconnection on organic substrates using eutectic tin/lead solder bumps, a highly reliable under bump metallurgy (UBM) is required to maintain adhesion and solder wettability. Various UBM systems such as 1μm Al/0.2μm Ti/5μm...
