Issues

Appointments

Pat Mannion appointed as new Sales Manager for Flex-Ability

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New production manager for Teknek

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Assessment of blind via holes – an alternative approach

Bob Willis
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Integrated optical and electronic interconnect printed circuit board manufacturing

David R. Selviah; F. Aníbal Fernández; Ioannis Papakonstantinou; Kai Wang; Hadi Bagshiahi; Andy C. Walker; Aongus McCarthy; Himanshu Suyal; David A. Hutt; Paul P. Conway; John Chappell; Shefiu S. Zakariyah; Dave Milward
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Environmentally friendly assembly of robust electronics without solder

Joseph Fjelstad
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A solution for PCB drilling with strict requirement on hole wall quality

Lianyu Fu; Fan Yang
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Base material selection for reliable lead‐free processing

Bernd Hövel; Tom Verbrugge
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Hybrid modeling of woven fibre reinforced metal matrix composite for multilayer circuit boards

K.H. Low; Yuqi Wang
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Exhibitions and conferences

ICT Evening Seminar

Martin Goosey
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SUMEEP Sustainable Use of Materials for Electronic & Electrical Products Scientific & Technical Conference

J.H. Ling
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ICT Evening Seminar

Martin Goosey
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EIPC Conference Rome

John Ling
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Industry news

Siplace even speedier and more flexible

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New workshop to help assess quality of PCBs

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US patent assigned to ViaForm® leveler copper damascene electroplating chemistry

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ISOLA licence foil technology to China and Taiwan

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Thermal simulation helps overcome challenge of 14U chassis with 1,700W

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Quantum EDS becomes UK'S sole distributor for unique e-collaborative toolset

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Enthone celebrates grand opening of advanced applications laboratory

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International diary

International diary

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New products

Printed electronics gets more ambitious

Dr Peter Harrop
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Orbotech's UCI Technology™ provides superior inkjet printing performance for bare PCB production

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Assessing the impact of contamination in an SMT production environment

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