Issues

Book Review

Handbook of Thick Film Technology – 2nd edition

Brian Ellis
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Silicon‐on‐insulator lateral dual sidewall Schottky (SOI‐LDSS) concept for improved rectifier performance: a two‐dimensional simulation study

M. Jagadesh Kumar; C. Linga Reddy
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Width optimization of global inductive VLSI interconnects

Brajesh Kumar Kaushik; S. Sarkar; R.P. Agarwal
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Numerical analysis of PBG via structures using FDTD algorithm

Ming‐Sze Tong; Yinchao Chen; Yilong Lu; Hyeong‐Seok Kim; Tae‐Gyu Chang; Ronan Sauleau
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Low voltage high performance CCII for analog signal processing applications

S.S. Rajput; S.S. Jamuar
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Thermal analysis of LED package

N. Aizar Abdul Karim; P.A. Aswatha Narayana; K.N. Seetharamu
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Editorial

Introducing the editorial advisory board

John Atkinson
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Exhibitions and conferences

MeasComp/Sensors “Auf Wiedersehen” in Nürnberg

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Industry news

Marconi and Pirelli Broadband Solutions enter into a new partnership

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EMI/RFI shielding cans highlighted

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Orthodyne opens technical support centres in China

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Strategic repositioning accelerated: EPCOS to sell tantalum business

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Electronics KTN is critical to industry's future prosperity, says hi-tech trade body

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Visiprise and HMS software announce merger agreement

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Bookham appoints AMS Technologies as pan-European distributor

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Orthodyne Electronics expands sales and technical support in Europe

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International diary

International diary

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Internet commentary

Internet commentary

Brian Ellis
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New products

New IC wafer fault elimination system

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Power capacitors: power factor correction on site with PoleCap

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ADDC-3960 EP 1.3 megapixel image sensor

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Agilent Technologies announce industry's first 1.3 megapixel CMOS image sensor with enhanced-performance pixel architecture

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Saft's super robust lithium batteries developed for space applications are now available

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Inductors: space-saving power transformers

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Reports

World Electronics Forum

John Ling
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The future is full of surprises – massive potential for organic electronics

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