Issues

Appointments

NPL appointment offers UK manufacturers lead-free support

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The effect of PCB surface finish on lead‐free solder joints

Sami T. Nurmi; Janne J. Sundelin; Eero O. Ristolainen; Toivo K. Lepistö
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Microstructural features contributing to enhanced behaviour of Sn‐Ag based solder joints

J.G. Lee; K.N. Subramanian
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Sub process challenges in ultra fine pitch stencil printing of type‐6 and type‐7 Pb‐free solder pastes for flip chip assembly applications

G.J. Jackson; M.W. Hendriksen; R.W. Kay; M. Desmulliez; R.K. Durairaj; N.N. Ekere
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Modelling the effect of voids in anisotropic conductive adhesive joints

K.K. Lee; N.H. Yeung; Y.C. Chan
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Improving the reliability of a plastic IC package in the reflow soldering process by DOE

Geun Woo Kim; Kang Yong Lee
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Company news

NPL develop new instrument for measuring solder properties

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New laser fan width control from Asymtek provides closed-loop monitoring for consistent conformal coating

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DEK machines add interface to Aegis CircuitCAM™ and Monitor™

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Editorial

Editorial

David Whalley
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Exhibitions and conferences

SMART Group 6th European Surface Mount Conference

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Industry news

Indium Corporation Division awarded ISO-9001:2000 certification

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Contax confirms Sibos AG now rebranded as Komax Systems

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SMT Lab formalises knowledge-based services

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Finding common ground in Central Europe

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Embedded passive component technology masterclass well received

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Contax helps Lema Electronics quadruple their production capacity

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Indium corporation opens china facility

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FEINFOCUS partners with IslandTek in Taiwan

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EID assembly solution of the year award for DEK's micron-class

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Contax exhibits at Autosport show,featuring automotive electronics

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ELFNET – a new era in European lead-free soldering technology

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Re-born CEM achieves instant success with assembléon

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Universal celebrates 15 years of high-speed co-operation

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International diary

International diary

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Internet commentary

Internet commentary

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New products

The £100M Failure

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DEK extends VectorGuard to 29 in. by 29 in.

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New laser fan width control from Asymtek provides closed-loop monitoring for consistent conformal coating

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NPL develops new instrument for measuring solder properties

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PCB rework stencils deliver repeatable accuracy

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DEK machines add interface to Aegis CircuitCAM™ and iMonitor™

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AIM introduces 270WR VOC-free lead-free compatible wave solder flux

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Henkel's Multicore® MP218 solder paste formulation delivers robust performance across a wide range of process conditions

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New Master Bond Polymer System EP41S-4

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UV curable compound has extended service capability of - 80 to + 300°F

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Note from the publisher

Note from the publisher

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