Issues

Characterization of SnAgCu and SnPb solder joints on low‐temperature co‐fired ceramic substrate

Z.W. Zhong; P. Arulvanan; Hla Phone Maw; C.W.A. Lu
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Hydrocarbon fluxes for ionic compound free soldering

Toshihiro Miyake; Masaru Ishida; Satoshi Inagaki
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Assembly issues with Sn/Ag/Cu bumped flip chips

Sunil Gopakumar; Peter Borgesen; K. Srihari
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Low cycle isothermal fatigue properties of lead‐free solders

Miloš Dušek; Christopher Hunt
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Industry news

RFTRAQ purchases Contax equipment to manufacture active RFID hardware

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A-Series Assembléon Manufacturing Suite (AMS) optimises SMT production line performance

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Military certification for HumiSeal's UV40 range

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Contax sells first FX-D after Nepcon launch for medical device production

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DEK's packaging innovations land two industry honours

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Selective soldering system from Contax meets Jaltek's requirements

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NBS Design expands its PCB layout business nationally

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Online auction offers new alternative

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Siemens honoured with Delphi Corporation's Pinnacle Award

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New appointments

Exerra appoints Don Beard Engineering Manager for North America

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New products

Lord Corporation announces advancements in flip chip underfill technology for lead-free component packaging

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Arka Technologies launches revolutionary Smartshield™ EMI shielding product

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Grove fuel cell symposium showcased DEK's enhanced fuel cell expertise

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“Adhere” diaphragm valve dispenses UV adhesives

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OK International launches new APR-5000-DZ array package rework system with dual convection bottom-side heating for lead-free rework and high-thermal demand applications

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