Issues

Appointments

DEK appoints new General Manager for the Americas

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ASML Chief Executive Officer Eric Meurice accepts extension of contract

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A procedure for determining the high‐speed stencil printing performance of solder pastes in an electronic service provider's environment

Christopher M. Greene; Krishnaswami Srihari
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Silver thick film pastes for low temperature co‐fired ceramics: impact of glass frit variation

Jayashri Bangali; Sunit Rane; Girish Phatak; Shashikala Gangal
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Characterization of Sn7In4.1Ag0.5Cu solder in lead‐free composite solder joints of LTCC/PWB assembly

O. Nousiainen; T. Kangasvieri; R. Rautioaho; J. Vähäkangas
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The comparison studies on growth kinetic of IMC of Cu/Sn3.0Ag0.5Cu (Sn0.4Co0.7Cu)/Cu joints during isothermal aging and their tensile strengths

Ju Guo‐kui; Wei Xi‐cheng; Sun Peng; Liu Johan
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Board level reliability of lead‐free designs of BGAs, CSPs, QFPs and TSOPs

Meng‐Kuang Huang; Chiapyng Lee
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Solder paste characterisation: towards the development of quality control (QC) tool

R. Durairaj; S. Mallik; N.N. Ekere
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Editorial

Editorial

Martin Goosey
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Industry news

OK International celebrates double awards in Asia

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OK International collects Service Excellence Award at APEX 2008

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HumiSeal® strengthens European presence with new Italian distribution agreement and signs new South African distribution agreement

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Economical high-volume Photo Etching is a reality

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Siplace even more flexible and customer focused

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KSR International chooses Genesis GC-120Q for high-volume assembly

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Technology partnership between Assembléon and Valor

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Contax Installs New Essemtec Line at Gemini 2000

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DEK celebrates its 40th year

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International diary

International diary

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New products

“ADHERE” LCD adhesives from make displays clear

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PDR launches accurate focussed IR rework in a handtool

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Enhanced software reduces setup time was introduced at APEX Stand 739 Step-by-step process improves efficiency

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Qualified stencils reduce setup errors DEK uses ScanCAD inspection system to certify stencil fabrication

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New Programmable Preheater lowers soldering and rework temperatures

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NEW MG-8R joined Assembléon’s A-Series Pick & Place machines at Nepcon Shanghai

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Soldertec Global offers new “Same Day” X-ray inspection service

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Computer-guided connector assembly

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New ATF Vapour Phase soldering from Contax

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DEK’s new InstinctivTM V9 software advances with HawkEyeTM control

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Award-winning ProFlow® technology from DEK evolves to broaden capability and expand process window

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New MPM stencil printer from Contax

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NPL-IPTM from NPL

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