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Issue
8 February - Volume 20, Issue 1, Pages 4 - 26
11 April - Volume 20, Issue 2, Pages 3 - 38
27 June - Volume 20, Issue 3, Pages 4 - 46
19 September - Volume 20, Issue 4, Pages 3 - 44
Volume 20, Issue 3
27 June 2008
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ISSN
0954-0911
EISSN
1758-6836
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In this Issue
Appointments
Editorial
Industry news
International diary
New products
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Appointments
DEK appoints new General Manager for the Americas
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ASML Chief Executive Officer Eric Meurice accepts extension of contract
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A procedure for determining the high‐speed stencil printing performance of solder pastes in an electronic service provider's environment
Christopher M. Greene
;
Krishnaswami Srihari
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Silver thick film pastes for low temperature co‐fired ceramics: impact of glass frit variation
Jayashri Bangali
;
Sunit Rane
;
Girish Phatak
;
Shashikala Gangal
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Characterization of Sn7In4.1Ag0.5Cu solder in lead‐free composite solder joints of LTCC/PWB assembly
O. Nousiainen
;
T. Kangasvieri
;
R. Rautioaho
;
J. Vähäkangas
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The comparison studies on growth kinetic of IMC of Cu/Sn3.0Ag0.5Cu (Sn0.4Co0.7Cu)/Cu joints during isothermal aging and their tensile strengths
Ju Guo‐kui
;
Wei Xi‐cheng
;
Sun Peng
;
Liu Johan
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Board level reliability of lead‐free designs of BGAs, CSPs, QFPs and TSOPs
Meng‐Kuang Huang
;
Chiapyng Lee
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Solder paste characterisation: towards the development of quality control (QC) tool
R. Durairaj
;
S. Mallik
;
N.N. Ekere
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Editorial
Editorial
Martin Goosey
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Industry news
OK International celebrates double awards in Asia
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OK International collects Service Excellence Award at APEX 2008
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HumiSeal® strengthens European presence with new Italian distribution agreement and signs new South African distribution agreement
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Economical high-volume Photo Etching is a reality
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Siplace even more flexible and customer focused
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KSR International chooses Genesis GC-120Q for high-volume assembly
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Technology partnership between Assembléon and Valor
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Contax Installs New Essemtec Line at Gemini 2000
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DEK celebrates its 40th year
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International diary
International diary
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New products
“ADHERE LCD adhesives from make displays clear
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PDR launches accurate focussed IR rework in a handtool
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Enhanced software reduces setup time was introduced at APEX Stand 739 Step-by-step process improves efficiency
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Qualified stencils reduce setup errors DEK uses ScanCAD inspection system to certify stencil fabrication
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New Programmable Preheater lowers soldering and rework temperatures
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NEW MG-8R joined Assembléons A-Series Pick & Place machines at Nepcon Shanghai
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Soldertec Global offers new “Same Day X-ray inspection service
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Computer-guided connector assembly
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New ATF Vapour Phase soldering from Contax
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DEKs new InstinctivTM V9 software advances with HawkEyeTM control
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Award-winning ProFlow® technology from DEK evolves to broaden capability and expand process window
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New MPM stencil printer from Contax
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NPL-IPTM from NPL
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