Issues

Appointments

Bob Black receives the IPC President’s Award

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Marantz appoints Eltraco to support Nordic customers

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Reliability evaluation of SnAgCu/SnAgCuCe solder joints based on finite element simulation and experiments

Guang Zeng; Songbai Xue; Liang Zhang; Zhong Sheng; Lili Gao
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Investigation of Sn‐Zn‐Bi solders – Part II: wetting measurements on Sn‐Zn7Bi solders on copper and on PCBs with lead‐free finishes by means of the wetting balance method

K. Bukat; J. Sitek; M. Kościelski; Z. Moser; W. Gąsior; J. Pstruś
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Evaluating solder paste behaviours through rheological test methods and their correlation to the printing performance

S. Mallik; M. Schmidt; R. Bauer; N.N. Ekere
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Effects of multiple BGA rework on strength of solder joints

N. Dariavach; J. Liang; G. Barr; D. Shangguan
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ACF curing process optimization based on degree of cure considering contact resistance degradation of joints

Bo Tao; Zhouping Yin; Youlun Xiong
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Creep properties of Sn‐0.7Cu composite solder joints reinforced with nano‐sized Ag particles

Feng Tai; Fu Guo; Jianping Liu; Zhidong Xia; Yaowu Shi; Yongping Lei; Xiaoyan Li
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An experimental and numerical investigation into the effects of the chip‐on‐film (COF) processing parameters on the Au‐Sn bonding temperature

De‐Shin Liu; Shu‐Shen Yeh; Chun‐Teh Kao; Pay‐Yau Huang; Chia‐I Tsai; An‐Hong Liu; Shu‐Ching Ho
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Editorial

Editorial

Martin Goosey
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Exhibitions and conferences

IMAPS-UK “Beyond Solder” Technical Seminar, National Physical Laboratory, Teddington, 30 June 2010

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Institute of Circuit Technology, 36th Annual Symposium, the Motorcycle Museum, Birmingham, 15 June 2010

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SMT/HYBRID/PACKAGING 2010

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EIPC Summer Conference 2010, June 7 and 8, 2010, CCN Congress Centre Nürnberg, Germany

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Industry news

See for yourself the benefits of solder jet printing

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Sanmina-SCI deploys Aegis Software globally

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NPL win best poster at APEX

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Aegis software selected by Makso Electronic BV

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Televés invests in innovative SIPLACE line

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OK International collects third consecutive Service Excellence Award at Apex

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Test protocols for evaluation of new lead-free alloys outlined in new white paper by IPC SPVC

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MYDATA does the lot for ZOT

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Solder jet printing becomes indispensable for STI

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MEPs flag potentially hazardous substances in electrical and electronic equipment

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First-ever power conversion standard IPC-9592 gets update

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IPC releases position statement on the trade of conflict metals

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DEK partners with Fuji Do Brasil to advance Brazilian market stronghold

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New products

Intertronics unveils specialist “green” cleaners

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Cookson Electronics launches ALPHA PV Ribbon™ for solar module assembly

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DEK’s ProFlow® ATx system meets real-world mass production and product complexity challenges

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Accurate bond-line inspection with red fluorescence adhesive from Intertronics

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SIPLACE and mentor graphics announce the new SIPLACE operations information broker (OIB)

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Cure-Point™ 9440-A/B UV silicone from Intertronics

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High-temperature electronics packaging solutions for 250°C applications

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