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Issue
9 February - Volume 22, Issue 1, Pages 4 - 57
13 April - Volume 22, Issue 2, Pages 3 - 48
29 June - Volume 22, Issue 3, Pages 4 - 48
21 September - Volume 22, Issue 4, Pages 4 - 64
Volume 22, Issue 4
21 September 2010
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ISSN
0954-0911
EISSN
1758-6836
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In this Issue
Appointments
Editorial
Exhibitions and conferences
Industry news
New products
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Appointments
Bob Black receives the IPC Presidents Award
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Marantz appoints Eltraco to support Nordic customers
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Reliability evaluation of SnAgCu/SnAgCuCe solder joints based on finite element simulation and experiments
Guang Zeng
;
Songbai Xue
;
Liang Zhang
;
Zhong Sheng
;
Lili Gao
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Investigation of Sn‐Zn‐Bi solders – Part II: wetting measurements on Sn‐Zn7Bi solders on copper and on PCBs with lead‐free finishes by means of the wetting balance method
K. Bukat
;
J. Sitek
;
M. Kościelski
;
Z. Moser
;
W. Gąsior
;
J. Pstruś
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Evaluating solder paste behaviours through rheological test methods and their correlation to the printing performance
S. Mallik
;
M. Schmidt
;
R. Bauer
;
N.N. Ekere
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Effects of multiple BGA rework on strength of solder joints
N. Dariavach
;
J. Liang
;
G. Barr
;
D. Shangguan
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ACF curing process optimization based on degree of cure considering contact resistance degradation of joints
Bo Tao
;
Zhouping Yin
;
Youlun Xiong
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Creep properties of Sn‐0.7Cu composite solder joints reinforced with nano‐sized Ag particles
Feng Tai
;
Fu Guo
;
Jianping Liu
;
Zhidong Xia
;
Yaowu Shi
;
Yongping Lei
;
Xiaoyan Li
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An experimental and numerical investigation into the effects of the chip‐on‐film (COF) processing parameters on the Au‐Sn bonding temperature
De‐Shin Liu
;
Shu‐Shen Yeh
;
Chun‐Teh Kao
;
Pay‐Yau Huang
;
Chia‐I Tsai
;
An‐Hong Liu
;
Shu‐Ching Ho
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Editorial
Editorial
Martin Goosey
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Exhibitions and conferences
IMAPS-UK “Beyond Solder Technical Seminar, National Physical Laboratory, Teddington, 30 June 2010
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Institute of Circuit Technology, 36th Annual Symposium, the Motorcycle Museum, Birmingham, 15 June 2010
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SMT/HYBRID/PACKAGING 2010
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EIPC Summer Conference 2010, June 7 and 8, 2010, CCN Congress Centre Nürnberg, Germany
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Industry news
See for yourself the benefits of solder jet printing
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Sanmina-SCI deploys Aegis Software globally
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NPL win best poster at APEX
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Aegis software selected by Makso Electronic BV
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Televés invests in innovative SIPLACE line
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OK International collects third consecutive Service Excellence Award at Apex
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Test protocols for evaluation of new lead-free alloys outlined in new white paper by IPC SPVC
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MYDATA does the lot for ZOT
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Solder jet printing becomes indispensable for STI
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MEPs flag potentially hazardous substances in electrical and electronic equipment
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First-ever power conversion standard IPC-9592 gets update
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IPC releases position statement on the trade of conflict metals
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DEK partners with Fuji Do Brasil to advance Brazilian market stronghold
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New products
Intertronics unveils specialist “green cleaners
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Cookson Electronics launches ALPHA PV Ribbon™ for solar module assembly
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DEKs ProFlow® ATx system meets real-world mass production and product complexity challenges
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Accurate bond-line inspection with red fluorescence adhesive from Intertronics
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SIPLACE and mentor graphics announce the new SIPLACE operations information broker (OIB)
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Cure-Point™ 9440-A/B UV silicone from Intertronics
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High-temperature electronics packaging solutions for 250°C applications
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Latest
Most Read
Most Cited
Nanocopper-based low-temperature interconnection technology: advances in material systems, sintering mechanisms and packaging applications
L-shaped epoxy reinforcement optimization for vibration reliability of microspring array pins in aerospace large-scale integrated circuits
Study on process optimization and suppression methods for wafer-level electroplated copper nodule defects
Simulation and structural optimization of key structural mechanical properties of TR modules with quasi-coaxial structure under high-impact loads
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