Skip to Main Content
Close
Journals
Books
Case Studies
Collections
Open Access
Citation Manager
Journals
Books
Case Studies
Collections
Open Access
Citation Manager
Search Dropdown Menu
header search
search input
Search input auto suggest
filter your search
All Content
All Journals
Soldering & Surface Mount Technology
Search
Advanced Search
Cart
User Tools Dropdown
Cart
Register
Sign In
Open Menu
Soldering & Surface Mount Technology
Toggle Menu
Menu
Journal Home
Issues
About this Journal
Open External Link
Earlycite Articles
Issues
Select Year
2026
2025
2024
2023
2022
2021
2020
2019
2018
2017
2016
2015
2014
2013
2012
2011
2010
2009
2008
2007
2006
2005
2004
2003
2002
2001
2000
1999
1998
1997
1996
1995
1994
1993
1992
1991
1990
1989
Issue
8 February - Volume 23, Issue 1, Pages 4 - 46
12 April - Volume 23, Issue 2, Pages 68 - 119
28 June - Volume 23, Issue 3, Pages 140 - 190
20 September - Volume 23, Issue 4, Pages 211 - 256
Volume 23, Issue 3
28 June 2011
All Issues
Cover Image
Cover Image
ISSN
0954-0911
EISSN
1758-6836
Close navigation menu
In this Issue
Appointments and awards
Editorial
Exhibitions and conferences
Industry news
International diary
New products
Issue Navigation
Appointments and awards
DEK appoints new quality assurance engineer
Extract
View article
titled, SCM.SharedControls.Infrastructure.TitleDisplayModel?.Text
Add to Citation Manager
for DEK appoints new quality assurance engineer
Don Dupriest inducted into IPC Hall of Fame
Extract
View article
titled, SCM.SharedControls.Infrastructure.TitleDisplayModel?.Text
Add to Citation Manager
for Don Dupriest inducted into IPC Hall of Fame
Modifications of the 85/85 test and the temperature cycling test for tantalum capacitors
Johanna Virkki
;
Lauri Sydänheimo
;
Pasi Raumonen
Abstract
View article
titled, SCM.SharedControls.Infrastructure.TitleDisplayModel?.Text
Open the
PDF
for in another window
Add to Citation Manager
for Modifications of the 85/85 test and the temperature cycling test for tantalum capacitors
Occurrence of tin pest on the surface of tin‐rich lead‐free alloys
Agata Skwarek
;
Marcin Sroda
;
Mariusz Pluska
;
Andrzej Czerwinski
;
Jacek Ratajczak
;
Krzysztof Witek
Abstract
View article
titled, SCM.SharedControls.Infrastructure.TitleDisplayModel?.Text
Open the
PDF
for in another window
Add to Citation Manager
for Occurrence of tin pest on the surface of tin‐rich lead‐free alloys
Tensile strength of fine pitch QFP lead‐free soldered joints with diode laser soldering
Peng Xue
;
Song‐bai Xue
;
Liang Zhang
;
Yi‐fu Shen
;
Li‐li Gao
;
Sheng‐lin Yu
;
Hong Zhu
;
Zongjie Han
;
Yan Chen
Abstract
View article
titled, SCM.SharedControls.Infrastructure.TitleDisplayModel?.Text
Open the
PDF
for in another window
Add to Citation Manager
for Tensile strength of fine pitch QFP lead‐free soldered joints with diode laser soldering
Interfacial reaction and dissolution behavior of Cu substrate in molten Sn‐3.8Ag‐0.7Cu in the presence of Mo nanoparticles
M.M. Arafat
;
A.S.M.A. Haseeb
;
Mohd Rafie Johan
Abstract
View article
titled, SCM.SharedControls.Infrastructure.TitleDisplayModel?.Text
Open the
PDF
for in another window
Add to Citation Manager
for Interfacial reaction and dissolution behavior of Cu substrate in molten Sn‐3.8Ag‐0.7Cu in the presence of Mo nanoparticles
Finite element analyses and lifetime predictions for SnAgCu solder interconnections in thermal shock tests
Jue Li
;
Hongbo Xu
;
Jussi Hokka
;
Toni T. Mattila
;
Hongtao Chen
;
Mervi Paulasto‐Kröckel
Abstract
View article
titled, SCM.SharedControls.Infrastructure.TitleDisplayModel?.Text
Open the
PDF
for in another window
Add to Citation Manager
for Finite element analyses and lifetime predictions for SnAgCu solder interconnections in thermal shock tests
Silver nanoparticles effect on the wettability of Sn‐Ag‐Cu solder pastes and solder joints microstructure on copper
K. Bukat
;
M. Kościelski
;
J. Sitek
;
M. Jakubowska
;
A. Młożniak
Abstract
View article
titled, SCM.SharedControls.Infrastructure.TitleDisplayModel?.Text
Open the
PDF
for in another window
Add to Citation Manager
for Silver nanoparticles effect on the wettability of Sn‐Ag‐Cu solder pastes and solder joints microstructure on copper
Editorial
Editorial
Martin Goosey
Extract
View article
titled, SCM.SharedControls.Infrastructure.TitleDisplayModel?.Text
Add to Citation Manager
for Editorial
Exhibitions and conferences
Summary
John Ling
Extract
View article
titled, SCM.SharedControls.Infrastructure.TitleDisplayModel?.Text
Add to Citation Manager
for Summary
IEEE Workshop on Reliability and SafetySupported by iMAPS UK and NMI, University of Greenwich14 April 2011
Extract
View article
titled, SCM.SharedControls.Infrastructure.TitleDisplayModel?.Text
Add to Citation Manager
for IEEE Workshop on Reliability and SafetySupported by iMAPS UK and NMI, University of Greenwich14 April 2011
Plastic Electronics: The Challenges for Low Temperature ManufacturingThe Hauser Forum, Cambridge15 March 2011
Martin Goosey
Extract
View article
titled, SCM.SharedControls.Infrastructure.TitleDisplayModel?.Text
Add to Citation Manager
for Plastic Electronics: The Challenges for Low Temperature ManufacturingThe Hauser Forum, Cambridge15 March 2011
Industry news
EFRA takes over from EBFRIP
Extract
View article
titled, SCM.SharedControls.Infrastructure.TitleDisplayModel?.Text
Add to Citation Manager
for EFRA takes over from EBFRIP
Variosystems to store components locally in production
Extract
View article
titled, SCM.SharedControls.Infrastructure.TitleDisplayModel?.Text
Add to Citation Manager
for Variosystems to store components locally in production
Cimar doubles SMD capacity with MYDATA
Extract
View article
titled, SCM.SharedControls.Infrastructure.TitleDisplayModel?.Text
Add to Citation Manager
for Cimar doubles SMD capacity with MYDATA
DEK expands relationship with Scanditron
Extract
View article
titled, SCM.SharedControls.Infrastructure.TitleDisplayModel?.Text
Add to Citation Manager
for DEK expands relationship with Scanditron
JUKI and AEGIS bridge platforms
Extract
View article
titled, SCM.SharedControls.Infrastructure.TitleDisplayModel?.Text
Add to Citation Manager
for JUKI and AEGIS bridge platforms
The PCB, a strategic and critical component of electronics
Extract
View article
titled, SCM.SharedControls.Infrastructure.TitleDisplayModel?.Text
Add to Citation Manager
for The PCB, a strategic and critical component of electronics
Europe: ready for changes?
Extract
View article
titled, SCM.SharedControls.Infrastructure.TitleDisplayModel?.Text
Add to Citation Manager
for Europe: ready for changes?
Essemtec wins an NPI Award for the Cobra Placer
Extract
View article
titled, SCM.SharedControls.Infrastructure.TitleDisplayModel?.Text
Add to Citation Manager
for Essemtec wins an NPI Award for the Cobra Placer
Advanced OK International technologies on show at SMT Germany 2011
Extract
View article
titled, SCM.SharedControls.Infrastructure.TitleDisplayModel?.Text
Add to Citation Manager
for Advanced OK International technologies on show at SMT Germany 2011
Indium Corporation expands sales efforts in Austria
Extract
View article
titled, SCM.SharedControls.Infrastructure.TitleDisplayModel?.Text
Add to Citation Manager
for Indium Corporation expands sales efforts in Austria
The PCB industry is a “Case study for European manufacturing
Extract
View article
titled, SCM.SharedControls.Infrastructure.TitleDisplayModel?.Text
Add to Citation Manager
for The PCB industry is a “Case study for European manufacturing
tbp electronics introduces DEK Horizon 03iX screen printers
Extract
View article
titled, SCM.SharedControls.Infrastructure.TitleDisplayModel?.Text
Add to Citation Manager
for tbp electronics introduces DEK Horizon 03iX screen printers
Ink with tin nanoparticles could print future circuit boards
Extract
View article
titled, SCM.SharedControls.Infrastructure.TitleDisplayModel?.Text
Add to Citation Manager
for Ink with tin nanoparticles could print future circuit boards
IPC honours best technical papers at IPC APEX EXPO 2011
Extract
View article
titled, SCM.SharedControls.Infrastructure.TitleDisplayModel?.Text
Add to Citation Manager
for IPC honours best technical papers at IPC APEX EXPO 2011
New IPC-9708 Standard fills the void in test methods for pad cratering
Extract
View article
titled, SCM.SharedControls.Infrastructure.TitleDisplayModel?.Text
Add to Citation Manager
for New IPC-9708 Standard fills the void in test methods for pad cratering
The state of the European PCB industry
Extract
View article
titled, SCM.SharedControls.Infrastructure.TitleDisplayModel?.Text
Add to Citation Manager
for The state of the European PCB industry
Orbotech celebrates 30 years of leadership
Extract
View article
titled, SCM.SharedControls.Infrastructure.TitleDisplayModel?.Text
Add to Citation Manager
for Orbotech celebrates 30 years of leadership
TechSearch International Founder and President highlights shift to Cu pillar in keynote address at ICEP in Japan
Extract
View article
titled, SCM.SharedControls.Infrastructure.TitleDisplayModel?.Text
Add to Citation Manager
for TechSearch International Founder and President highlights shift to Cu pillar in keynote address at ICEP in Japan
SMS Electronics selects SIPLACE for major UK investment
Extract
View article
titled, SCM.SharedControls.Infrastructure.TitleDisplayModel?.Text
Add to Citation Manager
for SMS Electronics selects SIPLACE for major UK investment
What general changes are necessary for the industry in European?
Extract
View article
titled, SCM.SharedControls.Infrastructure.TitleDisplayModel?.Text
Add to Citation Manager
for What general changes are necessary for the industry in European?
International diary
International diary
Extract
View article
titled, SCM.SharedControls.Infrastructure.TitleDisplayModel?.Text
Add to Citation Manager
for International diary
New products
New frameless stencil foil available on-line
Extract
View article
titled, SCM.SharedControls.Infrastructure.TitleDisplayModel?.Text
Add to Citation Manager
for New frameless stencil foil available on-line
Latest
Most Read
Most Cited
Robust low-temperature soldering of Cu plates via a novel Ni@Cu10Ni alloy mesh reinforced SAC305 composite solder
Reliability analysis for heterogeneous millimeter-wave RF front-end package using a hybrid FEA-machine learning model
Comparative study of tensile creep behaviour of lead-free solder alloys and conventional Sn–Pb solder
Experimental characterizations of the influence of sintering pressure on the high-temperature tensile behavior of sintered silver
Email alerts
Earlycite Alert
Closed Issue Alert
Latest Published Articles Alert
Close Modal
Recommended for you
These recommendations are informed by your reading behaviors and indicated interests.
RSS
Current Issue RSS Feed
RSS Feed - Advance Access
Open Issues RSS Feed
Close Modal
Close Modal
This Feature Is Available To Subscribers Only
Sign In
or
Create an Account
Close Modal
Close Modal
