Issues

Appointments

Cogiscan expands team with new application engineer for Europe

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Interfacial IMC layer growth and tensile properties of low‐silver Cu/SACBE/Cu solder joints

Wenzhen Bi; Guokui Ju; Fei Lin; Shifang Xie; Xicheng Wei
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Effect of Pr on properties and Sn whisker growth of Sn‐9Zn‐xPr solder

Peng Xue; Songbai Xue; Yifu Shen; Zhengxiang Xiao; Hong Zhu; Weimin Long; Xinquan Yu
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Surface finish effect on reliability of SAC 305 soldered chip resistors

Maurice N. Collins; Jeff Punch; Richard Coyle
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Effect of minor additions of Fe on bulk alloy microstructure and tensile properties of the low Ag‐content Sn‐1Ag‐0.5Cu solder alloy

Dhafer Abdul Ameer Shnawah; Suhana Binti Mohd Said; Mohd Faizul Bin Mohd Sabri; Irfan Anjum Badruddin; Fa Xing Che
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Evaluation of Cu/SnAg microbump bonding processes for 3D integration using wafer‐level underfill film

Tsung‐Fu Yang; Kuo‐Shu Kao; Ren‐Chin Cheng; Jing‐Yao Chang; Chau‐Jie Zhan
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SAC 305 solder paste with carbon nanotubes – part I: investigation of the influence of the carbon nanotubes on the SAC solder paste properties

K. Bukat; J. Sitek; M. Kościelski; M. Jakubowska; M. Słoma; A. Młożniak; W. Niedźwiedź
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Conferences and exhibitions

13TH JISSO International Council Meeting – Nurnberg, May 2012

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Research to Industry Electronics Conference: Connecting Research to Industry

Martin Goosey
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The Institute of Circuit Technology Annual Conference

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Editorial

Editorial

Martin Goosey
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Industry news

MIRTEC Europe announces impressive 30 per cent growth in first half of 2012

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Using Essemtec’s SMD Tower for IGBT storage in a clean room

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OnCore Manufacturing to attend Juki’s 25,000th shipment celebration and tour in Japan

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iNEMI releases guidelines to reduce risk of creep corrosion

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UVAX Concepts chooses SIPLACE SX

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PRIDE Industries reaches new level of cleanliness with its new Trident Trio from Aqueous Technologies

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Camtek receives repeated orders totalling approxamtely $5m from one of the world’s largest, US based, IDMs

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International diary

International diary

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New products

SEHO Systems introduces the cost-effective and energy efficient PowerWave N2

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Tamura develop a new solder paste

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New entry level computed tomography for electronics manufacture quality control

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Engineered Material Systems debuts UV cure adhesive for disk drive, camera module, optoelectronic and circuit assembly applications

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