Issues

Temperature cycling with Peltier elements of boards with SMD components and failure evaluation

Josef Šandera; Michal Nicák
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Reliability analysis of an ACA attached flex-on-board assembly for industrial application

Janne Kiilunen; Laura Frisk
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Statistical analysis of stencil technology for wafer-level bumping

Robert W. Kay; Gerard Cummins; Thomas Krebs; Richard Lathrop; Eitan Abraham; Marc Desmulliez
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Corrosion of Sn-3.0Ag-0.5Cu thin films on Cu substrates in alkaline solution

Liu Mei Lee; Muhammad Firdaus Mohd Nazeri; Habsah Haliman; Ahmad Azmin Mohamad
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Zn diffusion and reflow behaviour of Sn-9Zn and Sn-8.5Zn-0.5Ag-0.01Al-0.1Ga solders on a Ni/Cu substrate under IR reflow

J. Mittal; K.L. Lin
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