Issues

Special Issue: IMAPS Poland 2016. Guest Editor: Agata Skwarek

Guest editorial

Agata Skwarek
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New method for determining correction factors for pin-in-paste solder volumes

Oliver Krammer; Bertalan Varga; Karel Dušek
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Investigating the thixotropic behaviour of Type 4 solder paste during stencil printing

Oliver Krammer; Benjámin Gyarmati; András Szilágyi; Richárd Storcz; László Jakab; Balázs Illés; Attila Géczy; Karel Dušek
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Optimization of solder paste quantity considering the properties of solder joints

Martin Hirman; Frantisek Steiner
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The dependence of reliability and mechanical strength of the solder joints in 3D PoP structures from sizes of solder powders applied in soldering materials

Janusz Sitek; Marek Koscielski; Janusz Borecki; Tomasz Serzysko
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X-ray inspection and Six-Sigma in analysis of LED thermal pad coverage

Barbara Dziurdzia; Janusz Mikolajek
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Studying heat transfer on inclined printed circuit boards during vapour phase soldering

Attila Geczy; Daniel Nagy; Balazs Illes; Laszlo Fazekas; Oliver Krammer; David Busek
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Real-time profiling of reflow process in VPS chamber

Lubomir Livovsky; Alena Pietrikova
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Structure and thermal behavior of lead-free solders prepared by rapid solidification of their melt

Martin Durisin; Alena Pietrikova; Juraj Durisin; Karel Saksl
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Stability of electrical properties for mechanically exposed thick- and thin-film resistors on flexible substrates

Andrzej Dziedzic; Pawel Osypiuk; Wojciech Steplewski
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Corrosion-induced tin whisker growth in electronic devices: a review

Balázs Illés; Barbara Horváth; Attila Géczy; Olivér Krammer; Karel Dušek
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