Issues

24th International Conference on Electronic Packaging Technology

Guest editorial: 24th international conference on electronic packaging technology

Shuye Zhang; Qidong Wang; Mingliang Huang; Kyung W. Paik
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Effects of Ni addition on wettability and interfacial microstructure of Sn-0.7Cu-xNi solder alloy

Jinshuai Xie; Lei Tang; Pengfei Gao; Zhengquan Zhang; Liangfeng Li
View articletitled, Effects of Ni addition on wettability and interfacial microstructure of Sn-0.7Cu-xNi solder alloy
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Influence of doping Si3N4 nanoparticles on the properties and microstructure of Sn58Bi solder for connecting Cu substrate

Kai Deng; Liang Zhang; Chen Chen; Xiao Lu; Lei Sun; Xing-Yu Guo
View articletitled, Influence of doping Si<sub>3</sub>N<sub>4</sub> nanoparticles on the properties and microstructure of Sn58Bi solder for connecting Cu substrate
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Effects of soldering temperature and preheating temperature on the properties of Sn–Zn solder alloys using wave soldering

Songtao Qu; Qingyu Shi; Gong Zhang; Xinhua Dong; Xiaohua Xu
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Influences of hygrothermal conditions and structure parameters on moisture diffusion behavior in a system‐in‐package module by moisture-thermal-mechanical-coupled finite element modeling

Li Liu; Chunhua Zhang; Ping Hu; Sheng Liu; Zhiwen Chen
View articletitled, Influences of hygrothermal conditions and structure parameters on moisture diffusion behavior in a system‐in‐package module by moisture-thermal-mechanical-coupled finite element modeling
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Microstructure and mechanical behavior of Sn15Bi-xAg\Cu solder joints during isothermal aging

Fengjiang Wang; Dapeng Yang; Guoqing Yin
View articletitled, Microstructure and mechanical behavior of Sn15Bi-xAg\Cu solder joints during isothermal aging
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Effect of sintering temperature on ratcheting-fatigue behavior of nanosilver sintered lap shear joint

Danqing Fang; Chengjin Wu; Yansong Tan; Xin Li; Lilan Gao; Chunqiu Zhang; Bingjie Zhao
View articletitled, Effect of sintering temperature on ratcheting-fatigue behavior of nanosilver sintered lap shear joint
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Elastoplastic nanoindentation behaviors of sintered nano-silver under various sintering parameters

Yanwei Dai; Libo Zhao; Fei Qin; Si Chen
View articletitled, Elastoplastic nanoindentation behaviors of sintered nano-silver under various sintering parameters
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The preparation and wettability of the Sn-9Zn-2.5Bi-1.5In solder paste for SMT process and high shear ball performance

Bingyi Li; Songtao Qu; Gong Zhang
View articletitled, The preparation and wettability of the Sn-9Zn-2.5Bi-1.5In solder paste for SMT process and high shear ball performance
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A study on the effect of the geometric properties and surface defects on silicon chip flexibility for wearable electronics

Yan Pan; Taiyu Jin; Xiaohui Peng; Pengli Zhu; Kyung W. Paik
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