Issues

Diffusion behavior and microstructural evolution of bonding interface between AuSn20 and tungsten-copper alloy

Fei Ding; Qidong Wang; Chaoping Liang; Yu Zhang
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Electromigration-induced diffusion behavior of Zn and abnormal intermetallic growth in Cu/Sn-9Zn/Cu(Ni) interconnects

Qiang Zhou; Zuocheng Niu; Yuan Hong; Zhijie Zhang; Mingliang Huang
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Experiments on the effect of sintering pressure on the creep response of sintered silver material

Mohammad A. Gharaibeh; David Strahringer; Frank Fischer; Georg C. Ganzenmueller; Stefan Hiermaier
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Developing ILU dispensing parameter model void size predictor on asymmetrical BGA flip-chip underfilling process

Calvin Ling; Aizat Abas; Cheng Kai Chew; Muhammad Taufik Azahari
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Analysis of micromorphological evolution of lead-free solder joints under random vibration

Fusheng Wang; Hongying Gao; Zewen Xiao; Yajun Chen
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Reliability analysis based on modeling of POP packages under thermal-drop impact loads

Xuexia Yang; Yanxi Sun; Miao Zhu; Chao Wang; Erqiang Liu; Gesheng Xiao
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