...⁻¹, and these values are the highest. The possible reasons for the highest conductivity of AZO films were the formation of the globular structure and which forms the least defects in the structure. Microstructure Alloys Coatings Geometry control Nanomaterials have attracted much...

...Guang Ren; Maurice Collins Purpose This paper aims to investigate the creep behaviour of the recently developed Sn–8Zn–3Bi–xSb (x = 0, 0.5, 1.0 and 1.5) low temperature lead-free solder alloys. Design/methodology/approach An in-house compressive test rig was developed to perform creep...

.... , Chang , H.C. , Lee , C.J. and Duh , J.G. (2015), “ Retarding the Cu-Sn and Ag-Sn intermetallic compounds by applying Cu-xZn alloy on micro-bump in novel 3D-IC technologies ”, Journal of Materials Science: Materials in Electronics , Vol. 26 No. 4 , pp. 2357 - 2362 . Lee , C.C...

... other papers or journals. It is to create an understanding for the reader by discussion from the others research papers findings. Solder can also be defined as a low melting eutectic alloy (Zeng and Tu, 2002). In eutectic systems, the melting points of eutectic alloys are not only lower than the two...

... joints, especially as regards void formation. These features are less affected by the alloy composition. The paper aims to discuss these issues. Design/methodology/approach – The quality of solder joints made in two VPS options (with and without vacuum) was investigated in terms of voids formation...

... with lead‐free solders, while also keeping the solder as environmentally friendly (Shen and Chan, 2009b ; Tsao et al., 2010). Hence, nanoscale solder alloys have been identified as one potential route for yielding higher microstructural stability and better mechanical properties (Haseeb...

... 0.1‐5 wt.% of the RE element Nd into Sn‐Cu and Sn‐Pb alloys, large amounts of tin whiskers were observed in the bulk alloy. The most noteworthy evidence, presented by Chuang and Lin (2009) , was that the addition of RE elements (Ce and Lu) to Sn‐based alloys resulted in a spontaneous and rapid...

... turnaround time, and greater cost saving opportunities. © Emerald Group Publishing Limited 2013 Surface‐mount technology Laser‐cut stencil Electropolishing Tin Alloys Lead‐free solders 01005 chip components System‐in‐package System‐in‐package (SiP) modules are becoming increasingly...

...Yingxin Goh; A.S.M.A. Haseeb; Mohd Faizul Mohd Sabri Purpose The purpose of this paper is to enhance the understanding on the electrodeposition of various lead (Pb)‐free solder alloys, so that new studies can be carried out to solve processing issues. Design/methodology/approach The paper...

... solder reflow. Ahmad Azmin Mohamad can be contacted at: azmin@eng.usm.my © Emerald Group Publishing Limited 2013 Solders Alloys Thin films Intermetallics Thermal properties SAC305 Lead‐free Sn‐Ag‐Cu lead‐free solders have been extensively studied in recent years...

...Yong‐Won Lee; Keun‐Soo Kim; Katsuaki Suganuma Purpose The purpose of this paper is to propose a solution procedure to minimize/eliminate voiding and spattering defects in the assembly of 0201 chip components with micro via‐in pads and 95 wt.%Sn‐5 wt.%Sb solder alloy. Design/methodology/approach...

...Dhafer Abdul Ameer Shnawah; Suhana Binti Mohd Said; Mohd Faizul Bin Mohd Sabri; Irfan Anjum Badruddin; Fa Xing Che Purpose The purpose of this paper is to investigate the effects of small additions (0.1 and 0.3 wt%) of Fe on the bulk alloy microstructure and tensile properties of low Ag‐content Sn...

.... The cost of the solder with added Pr is limited to RMB 2 yuan/kg so it can be widely used in industry. Songbai Xue can be contacted at: xuesb@nuaa.edu.cn © Emerald Group Publishing Limited 2012 Mechanical properties of materials Metals Solders Alloys Tin‐Zinc Praseodymium...

...Wenzhen Bi; Guokui Ju; Fei Lin; Shifang Xie; Xicheng Wei Purpose In a previous study, the authors proposed a new low‐silver solder alloy Sn‐ x(1.0, 1.5, 2.0)Ag‐0.3Cu‐3.0Bi‐0.05Er (wt.%) (SACBE) and the purpose of this paper is to provide additional useful information for new solder alloy...

... The appropriate amount of Pr in Sn3.8Ag0.7Cu solder is about 0.05 wt%. It is found that SAC‐0.05Pr solder has an improvement in solder joint reliability in long aging processes. The results suggested the novel solder alloys can meet the requirements of high reliability application. Originality/value The paper...

... balance and dilatometric measurements. Wetting angles measured with wetting balance method were compared with the results of sessile drop measurements. Findings The results obtained indicate that increasing concentration of copper in the alloy results in higher density, surface tension and viscosity...

...) and Snimm finishes were investigated in the state “as received”. To establish the wetting properties of the SnCu (HASL) and Snimm finishes on the PCBs, wetted by the investigated SnZnBiIn alloys, the SEM and EDX analyses were performed. Findings The authors obtained very good wetting results of the PCBs...

...Agata Skwarek; Marcin Sroda; Mariusz Pluska; Andrzej Czerwinski; Jacek Ratajczak; Krzysztof Witek Purpose The purpose of this paper is to investigate tin pest formation in lead‐free alloys. Design/methodology/approach Samples of Sn99.5Ag3.0Cu0.5, Sn99Cu1 and Sn98Cu2 alloys were prepared...

...M.M. Arafat; A.S.M.A. Haseeb; Mohd Rafie Johan Purpose In electronic packaging, when solid copper comes in contact with liquid solder alloy, the former dissolves and intermetallic compounds (IMCs) form at the solid‐liquid interface. The purpose of this paper is to study the effect of the presence...

... and the amount and the grain size of the added silver nanoparticles, and also the microstructure and thickness of the IMCs of the “nano” solder joints. K. Bukat can be contacted at: krystynabukat@itr.org.pl © Emerald Group Publishing Limited 2011 Solder paste Wetting Silver Alloys...