... rights only Microstructure Alloys Coatings Geometry control Nanomaterials have attracted much attention because they have special characteristics in optical, photovoltaic and catalytic applications that differ from those of bulk materials (He et al., 2008). Zinc oxide has a wide...

...Guang Ren; Maurice Collins Purpose This paper aims to investigate the creep behaviour of the recently developed Sn–8Zn–3Bi–xSb (x = 0, 0.5, 1.0 and 1.5) low temperature lead-free solder alloys. Design/methodology/approach An in-house compressive test rig was developed to perform creep...

..., the smaller value of von Mises demonstrated that the more reliability of lead-free solder joints in 3D IC. Originality/value The Cu/SnAgCu/CuTLPbondingwithdifferentthicknessesfor3D IC was investigated. Liang Zhang can be contacted at: zhangliang@jsnu.edu.cn Sn3.8Ag0.7Cu alloys were prepared...

... Emerald Group Publishing Limited Licensed re-use rights only Alloys Wetting Solder Solder alloys Solders are the basis of many engineering materials (Zeng and Tu, 2002). Soldering is important to ensure the technology growth in these modern days, and especially in electronic packaging...

... joints, especially as regards void formation. These features are less affected by the alloy composition. The paper aims to discuss these issues. Design/methodology/approach – The quality of solder joints made in two VPS options (with and without vacuum) was investigated in terms of voids formation...

...‐Cu (SAC) solders, are recommended as being good candidates and are now widely used in the electronic assembly and packaging industry. Unfortunately, the high‐melting temperature of above 200°C can damage electronic components (Zou et al., 2010). Sn‐Zn solder alloy offers high shear...

... to enable the continuous formation and growth of tin whiskers during exposure until the driving force was exhausted. © Emerald Group Publishing Limited 2013 Solder alloys Tin whisker Growth behavior Growth mechanism Solders Alloys Because of concerns about environmental...

... Electropolishing Tin Alloys Lead‐free solders 01005 chip components System‐in‐package System‐in‐package (SiP) modules are becoming increasingly popular due to their ability to integrate functionality in a very small amount of space and in a very cost‐competitive manner. SiP modules take active...

...Yingxin Goh; A.S.M.A. Haseeb; Mohd Faizul Mohd Sabri Purpose The purpose of this paper is to enhance the understanding on the electrodeposition of various lead (Pb)‐free solder alloys, so that new studies can be carried out to solve processing issues. Design/methodology/approach The paper...

...Yong‐Won Lee; Keun‐Soo Kim; Katsuaki Suganuma Purpose The purpose of this paper is to propose a solution procedure to minimize/eliminate voiding and spattering defects in the assembly of 0201 chip components with micro via‐in pads and 95 wt.%Sn‐5 wt.%Sb solder alloy. Design/methodology/approach...

... Mohamad can be contacted at: azmin@eng.usm.my © Emerald Group Publishing Limited 2013 Solders Alloys Thin films Intermetallics Thermal properties SAC305 Lead‐free Sn‐Ag‐Cu lead‐free solders have been extensively studied in recent years as substitute materials for use...

...Dhafer Abdul Ameer Shnawah; Suhana Binti Mohd Said; Mohd Faizul Bin Mohd Sabri; Irfan Anjum Badruddin; Fa Xing Che Purpose The purpose of this paper is to investigate the effects of small additions (0.1 and 0.3 wt%) of Fe on the bulk alloy microstructure and tensile properties of low Ag‐content Sn...

...Wenzhen Bi; Guokui Ju; Fei Lin; Shifang Xie; Xicheng Wei Purpose In a previous study, the authors proposed a new low‐silver solder alloy Sn‐ x(1.0, 1.5, 2.0)Ag‐0.3Cu‐3.0Bi‐0.05Er (wt.%) (SACBE) and the purpose of this paper is to provide additional useful information for new solder alloy...

... factors for the variation of mechanical properties (Hu et al., 2011). Mechanical properties of materials Metals Solders Alloys Tin‐Zinc Praseodymium Wettability Sn whisker The most widely developed lead‐free solders include Sn−Ag, Sn−Cu, Sn−Bi and Sn−Zn binary alloys, and Sn...

... The appropriate amount of Pr in Sn3.8Ag0.7Cu solder is about 0.05 wt%. It is found that SAC‐0.05Pr solder has an improvement in solder joint reliability in long aging processes. The results suggested the novel solder alloys can meet the requirements of high reliability application. Originality/value The paper...

... balance and dilatometric measurements. Wetting angles measured with wetting balance method were compared with the results of sessile drop measurements. Findings The results obtained indicate that increasing concentration of copper in the alloy results in higher density, surface tension and viscosity...

...) and Snimm finishes were investigated in the state “as received”. To establish the wetting properties of the SnCu (HASL) and Snimm finishes on the PCBs, wetted by the investigated SnZnBiIn alloys, the SEM and EDX analyses were performed. Findings The authors obtained very good wetting results of the PCBs...

...Agata Skwarek; Marcin Sroda; Mariusz Pluska; Andrzej Czerwinski; Jacek Ratajczak; Krzysztof Witek Purpose The purpose of this paper is to investigate tin pest formation in lead‐free alloys. Design/methodology/approach Samples of Sn99.5Ag3.0Cu0.5, Sn99Cu1 and Sn98Cu2 alloys were prepared...

...M.M. Arafat; A.S.M.A. Haseeb; Mohd Rafie Johan Purpose In electronic packaging, when solid copper comes in contact with liquid solder alloy, the former dissolves and intermetallic compounds (IMCs) form at the solid‐liquid interface. The purpose of this paper is to study the effect of the presence...

... in the grain size of the silver nanoparticles added to the SAC solder paste, as well as an increase in the reflow temperature, caused a decrease of the contact angle, even to such low values as are characteristic for the tin‐lead alloys (KleinWassink, 1989). Also, the wetting results of the paste on PCBs...