... and economical than the board level test method. With the miniaturization of solder joints, solder joints were more prone to failure under thermal shock and more attention has been paid to the impact reliability of solder joint. But Pb-free solder joints may be paid too much attention and Sn-Pb solder joints may...

... cycles; 20.0 per cent of solder bumps at 1,500 cycles and 9.5 per cent of solder bumps at 2,000 cycles were failure respectively. Originality/value Compared with the board level test method, the impact shear test for the single solder bump is more convenient and economical and is actively pursued...

... analysis were performed in order to study the failure mechanism of lead‐free solder joint under drop impact. Findings The test results indicate that the combined effect of mechanical shock and PCB bending vibration is the root cause of solder joint failure under drop impact, and that the maximum...