... 2021 © Emerald Publishing Limited 2021 Emerald Publishing Limited Licensed re-use rights only Pb-free Sn-Ag-Cu Finite element modelling (FEM) Thermal fatigue Reliability Fatigue life Thermal interface materials SAC solders Modelling The schematic diagrams of the designed...

... Finite element modelling (FEM) Stress analysis Finite element analysis Taguchi method Solder joint reliability 3D IC package With the advent of the big data era, the Internet and information industries have entered a period of rapid development, which puts higher demands on electronic...

... the solder ball and the substrate were analyzed through changing the thickness of IMC in models. The values of IMC thickness were referred to results of the published work (Tsukamoto et al., 2011). Finite element modelling (FEM) Mechanical strength Diameter-reducing Pull test Shear test...

... only Finite element modelling (FEM) Reliability Ball grid array (BGA) Land grid array (LGA) Electronics nowadays come in smaller, thinner and lighter specifications, and they can be found in different applications, for example, computers, laptops and handheld devices. Therefore...

..., interest in mechanical bending of ball grid array (BGA) packaging has increased with the uptake in mobile device use. Interconnects Modelling Finite element modelling (FEM) BGA packaging Solder joint stress Mechanical bending © Emerald Publishing Limited 2017 Emerald Publishing Limited...

... Modelling Finite element modelling (FEM) Interconnections Thermal fatigue Fatigue Joint resistance Thermal management 3D IC package Coefficient thermal expansion Through-silicon-vias Finite element methodology Thermal failure Ministry of Science and Technology 104-2221-E-110 -023...

... assumed to be constant, for simpler calculation. Jae B. Kwak can be contacted at: jae.kwak@samsung.com © Emerald Group Publishing Limited 2015 Finite element modelling (FEM) Reflow soldering Board assembly Contact condition PCB warpage PBA (Printed board assembly...