... equipment ranges from 15 to 25 years. Agata Skwarek can be contacted at: askwarek@ite.waw.pl © Emerald Group Publishing Limited 2011 Tin Alloys Joint disintegration Lead‐free SAC SnCu Joining materials Pest resistance testing The wide use of tin finishes and tin‐rich lead...

... standard test boards. The round test board could take the place of the JEDEC standard test board when conducting drop testing. © Emerald Group Publishing Limited 2010 Failure modes and effects analysis Impact strength Printed circuits Solders Joining materials Portable electronic...

... 2009 Reliability management Failure (mechanical) Soldering Joining materials Solder joint reliability is one of the most critical issues for the structural integrity of surface mount electronics, especially for automotive and portable products. For micro‐ball grid array (μBGA...

... conductivity Materials with purpose Adhesives Joining materials In the future, implantable medical devices will have more and more electronics in them. Different measurements related to physiological functions and the operation of devices are made in real time, and portable and implantable...

... be contacted at: kati.kokko@tut.fi © Emerald Group Publishing Limited 2009 Coatings technology Adhesives Joining materials Flipchips The shielding of electronic devices from ambient conditions is important in many applications, including implantable medical devices. Moreover...

... of the substrate. It is also seen that the substrate used influences the failure mechanisms formed during thermal cycling testing. Laura Frisk can be contacted at: laura.frisk@tut.fi © Emerald Group Publishing Limited 2009 Adhesives Substrates Joining materials Reliability management Liquid...

... using X‐ray, scanning electron microscopy (SEM) and energy dispersive X‐ray (EDX) techniques. Solders Joining materials Substrates As integrated circuit (IC) fabrication advances rapidly, microelectronic packaging faces new challenges (Zhong, 1999 ; Palm et al., 2001). Solder...

... responsible, e.g. tensile or shear. Accurately interpreting the fracture microstructure reveals true root cause and enables implementation of effective and verifiable corrective actions. Failure (mechanical) Lead Solder Joining materials Root cause failure analysis plays an important part...

... thinned chips or reducing the thickness of the substrate. © Emerald Group Publishing Limited 2006 Adhesives Substrates Joining materials Reliability management The use of anisotropic conductive adhesives (ACA) in flip chip interconnection technology has gained a great deal...

... analysis Fatigue Joining materials Simulation Solders The eutectic tin lead alloy has been widely used in surface mount technology for the interconnection and mechanical attachment between electronic components and printed circuit boards (PCB). In real service conditions, thermal stresses arise...

... fillers and SAM treatments. © Emerald Group Publishing Limited 2006 Adhesives Joining materials Thermal stability Electronic engineering Three different types of thiol SAM solutions: octadecanethiol (ODT), mercpatoacetic acid (MAA) and 1,4‐benzendithiol (dithiol) were employed...