... equipment ranges from 15 to 25 years. Agata Skwarek can be contacted at: askwarek@ite.waw.pl © Emerald Group Publishing Limited 2011 Tin Alloys Joint disintegration Lead‐free SAC SnCu Joining materials Pest resistance testing The wide use of tin finishes and tin‐rich lead...

... standard test boards. The round test board could take the place of the JEDEC standard test board when conducting drop testing. © Emerald Group Publishing Limited 2010 Failure modes and effects analysis Impact strength Printed circuits Solders Joining materials Portable electronic...

... 2009 Reliability management Failure (mechanical) Soldering Joining materials Solder joint reliability is one of the most critical issues for the structural integrity of surface mount electronics, especially for automotive and portable products. For micro‐ball grid array (μBGA...

... with purpose Adhesives Joining materials In an implant environment, electronic devices need to be shielded against electrolytic body fluid that causes corrosion. Traditionally bioinert and biostable metal cases, such as titanium, have been used. If flexible materials in circuit boards were used...

... at: laura.frisk@tut.fi © Emerald Group Publishing Limited 2009 Adhesives Substrates Joining materials Reliability management Liquid crystal polymers The popularity of flip chip technology in electronics packaging has increased due to the trend for lower cost, finer pitch, higher electrical...

... joints, particularly important in medical applications. Kati Kokko can be contacted at: kati.kokko@tut.fi © Emerald Group Publishing Limited 2009 Coatings technology Adhesives Joining materials Flipchips The shielding of electronic devices from ambient conditions...

... in the lateral (X and Y) directions and 25 percent shrinkage in the thickness (Z) direction. Solders Joining materials Substrates As integrated circuit (IC) fabrication advances rapidly, microelectronic packaging faces new challenges (Zhong, 1999 ; Palm et al., 2001). Solder...

... chip attachment is their thermal cycling reliability (Kwon et al., 2005). Adhesives Substrates Joining materials Reliability management © Emerald Group Publishing Limited 2006 To study the reliability of the test lots a temperature cycling test was used. The test...

... difficult to view and document (Figure 9). Currently available X‐ray machines offer a suite of image analysis and image enhancement options that can often help in these instances. © Emerald Group Publishing Limited 2006 Failure (mechanical) Lead Solder Joining materials Root cause...

... quantitative 3D simulation work, data from several experiments was collected and an averaging method was adopted to improve the accuracy of the data. © Emerald Group Publishing Limited 2006 Finite element analysis Fatigue Joining materials Simulation Solders The eutectic tin lead alloy...

... thermally stable at 150°C than ODT or MAA. A possible explanation for the relative stability of this coating is the presence of a rigid benzene ring within its chemical structure, which is very thermally stable. Adhesives Joining materials Thermal stability Electronic engineering...