...Yanruoyue Li; Guicui Fu; Bo Wan; Zhaoxi Wu; Xiaojun Yan; Weifang Zhang Purpose The purpose of this study is to investigate the effect of electrical and thermal stresses on the void formation of the Sn3.0Ag0.5Cu (SAC305) lead-free ball grid array (BGA) solder joints and to propose a modified mean...

... experiment equipment and the production of the quinary lead-free solder alloy used in wetting tests belongs to us. The investigated Sn-5Sb-CuNiAg alloys exhibited higher melting point and preferable wettability, that was one of the candidates for high-temperature lead-free solders to replace high-Pb solders...

... at 175.8°C. © Emerald Publishing Limited 2018 Emerald Publishing Limited Licensed re-use rights only Microstructure Solder Mechanical properties Solder paste Lead-free Sn-20In-2.8Ag Because of human health and environmental issues, policy and legislation restrictions regarding...

...Ervina Efzan Mhd Noor; Ayodeji Samson Ogundipe Purpose This paper aims to investigate the effect different fluxes have on the mechanical properties of lead-free solders, specifically Sn-Zn-Bi solder alloy. The solder billets were soldered in between copper substrates and flux was applied...

... 2017 02 02 2017 © Emerald Publishing Limited 2017 Emerald Publishing Limited Licensed re-use rights only Sn-Ag-Cu 01005 components Lead-free Reflow atmosphere Solderability Solders are used for assembling electronic components to printed circuit boards and act...

...Chun Sean Lau; C.Y. Khor; D. Soares; J.C. Teixeira; M.Z. Abdullah Purpose The purpose of the present study was to review the thermo-mechanical challenges of reflowed lead-free solder joints in surface mount components (SMCs). The topics of the review include challenges in modelling of the reflow...

... Electronic components Lead-free Oxides Pure tin RoHS Tin oxide Tin whiskers The formation of tin oxide on the surface of pure tin whiskers is expected to be non-porous and very thin, as it is usually invisible to both electron beam and light microscopy. Because ion diffusion through the oxide...

... and other space hardware. The complete procedure for stripping and solder‐dipping will be of benefit to companies manufacturing products for industries that have exemption from the RoHS lead‐free directives. Excessive solder (including peaks, icicles and ridges). Flux residues on either the leads...

... with the higher reflow temperature and longer reflow times. Originality/value Up to now, studies on the thin film characteristics of SAC305 lead‐free solder have been very limited. Thus, this paper presents the deposition of SAC305 thin film by a thermal evaporation technique and its characteristics after...

... Solders Alloys Tensile strength Low‐silver IMC Thermal aging Thickness Fracture mode Lead‐free Packaging In conjunction with the increase in awareness of environmental issues, research on lead‐free solder alloys has entered the stage of industrial application (Zeng and Tu, 2002...

...Agata Skwarek; Marcin Sroda; Mariusz Pluska; Andrzej Czerwinski; Jacek Ratajczak; Krzysztof Witek Purpose The purpose of this paper is to investigate tin pest formation in lead‐free alloys. Design/methodology/approach Samples of Sn99.5Ag3.0Cu0.5, Sn99Cu1 and Sn98Cu2 alloys were prepared...

...,there is no standard set of tests that can accelerate whisker formation and growth and relate these tests to field conditions with any reasonable degree of certainty. These issues make it difficult for developers to safely specify tin-based lead-free finishes for components used in their products, particularly those...

...K.C. Chan; Z.W. Zhong; K.W. Ong The elimination of lead from solders for flip‐chip attachment has necessitated many new studies on the reliability of the resultant systems. There are many lead‐free solder material systems. However, most of them contain a large proportion of tin. The tin...

..., component qualification, and process optimisation, this study focused on the PCB assembly process for 0201 packages using Sn‐Ag‐Cu solder paste. The post‐reflow solder defects for a range of different spacings were examined for the different solder pastes. © MCB UP Limited 2003 Lead‐free Solder...

...S.T. Nurmi; J.J. Sundelin; E.O. Ristolainen; T. Lepistö Lead‐free soldering is becoming a common practice in the electronics industry because of the growing general opposition to lead‐containing solders. The reliability of lead‐free solders has been studied a lot recently, but knowledge...

... for the lead‐free alloys examined no such transition is observed within this timescale. Sometimes, deformation may be a more appropriate failure criterion than rupture, and it is shown that for Sn‐37Pb this may result in substantially shorter failure times than utilising a rupture criterion. The quality...

...Marc Dittes; Hermann Walter A new alloy for lead‐free solder balls is introduced combining the advantages of a smooth surface after production and a uniform reflectivity after the ball attach process. This property significantly simplifies the inspection process during ball grid array (BGA...

...Richard Ludwig; Ning‐Cheng Lee; Chonglun Fan; Yun Zhang Two new electrolytically plated lead‐free surface finishes are evaluated for their wettability, bond strength, and voiding performance, and are compared with electrolytic nickel gold and an OSP. The results indicate that Ni–Sn achieve...

...Y. Mutoh; J. Zhao; Y. Miyashita; C. Kanchanomai Fatigue crack growth (FCG) tests on lead‐containing solders and lead‐free solders have been carried out at frequencies ranging from 0.01 to 10 Hz and stress ratios in the range 0.1–0.7. The FCG resistance of lead‐free solders was found to be superior...

...Shi‐Wei Ricky Lee; Ben Hoi Wai Lui; Y.H. Kong; Bernard Baylon; Timothy Leung; Pompeo Umali; Hector Agtarap Evaluates the board level reliability of plastic ball grid array (PBGA) assemblies under thermal and mechanical loading, with the objective of characterizing the reliability of lead‐free...