... Cu for potential applications. Design/methodology/approach Crystallographic analysis was performed to assess the recrystallization degree and grain boundary characteristics. Nanoindentation testing was conducted to measure the Young’s modulus, work done and contact stiffness of sintered submicron...

... of this paper is to investigate the relationship between tensile and nanoindentation tests toward the mechanical properties and deformation behavior of Sn-3.0Ag-0.5Cu (SAC305) lead-free solder wire at room temperature. Design/methodology/approach Tensile test with different strain rates of 1.5 × 10-4 s-1...

... microhardness, Brinell microhardness and nanoindentation. Design/methodology/approach A brief introduction on lead-free solders and the concept of hardness testing has been described at the beginning of the review. Equipment setup, capabilities, test configuration and outcomes were presented for each...

...-Ni/Cu micro solder joints was discussed. Design/methodology/approach The creep properties of the bulks of low-Ag Cu/Sn-Ag-Cu-Bi-Ni/Cu micro solder joints from 298 to 358 K were investigated using the nanoindentation method. Findings The results of the experiments showed that the indentation...

... element method Bond parameter Material properties Nanoindentation Electronic control devices are exposed to large thermal and mechanical loads during operation. With regards to faster development cycles, electronic packaging and interconnection technology must be designed taking...