...Siang Miang Yeo; Ho Kwang Yow; Keat Hoe Yeoh Purpose Semiconductor packaging industry has in recent years tightened the tolerance criteria for acceptable solder void size in the semiconductor packages due to the high usage in automotive applications. Semiconductor packaging component makers have...

.../SACBE/Cu joints. Originality/value The paper implies that the addition of Bi and Er could complement effectively the effects of Ag, thereby reducing the cost of solder. The low‐silver SACBE solder is a potential alloy for electronic packaging production. During soldering, the solder alloy melts...

...Bo Tao; Zhouping Yin; Youlun Xiong Purpose From the viewpoint of degree of cure, the purpose of this paper is to find how to improve the reliability of flip‐chip packaging modules based on an anisotropically conductive adhesive film (ACF) interconnection process. Design/methodology/approach...

...Ming‐Chih Yew; Mars Tsai; Dyi‐Chung Hu; Wen‐Kun Yang; Kuo‐Ning Chiang Purpose The wafer level package (WLP) is a cost‐effective solution for electronic packaging and has been increasingly applied in recent years. The purpose of this paper is to propose a newly developed packaging technology, based...

...‐temperature packaging. Design/methodology/approach The thermal plastic strain distribution at the edge of the DBC substrate was analyzed by using a finite element method with the Chaboche model for copper. The parameters of the Chaboche model were verified by comparing with the three‐point bending test...

... of the solder joints were evaluated by several tests. The experiments included package shear, package pull, three‐point bending and accelerated thermal cycling testing for 2,000 cycles. The packages were examined by X‐ray and C‐SAM before the reliability tests were carried out. The maximum load...

... © Emerald Group Publishing Limited 2006 --> Packaging Component manufacturing Universal Instruments enhances package-on-package flexibility Keywords: Packaging, Component manufacturing In response to rising demand for Package-on-Package (PoP) applications...

...Bob Willis Fundamentals of Microsystems Packaging Rao R TummalaMcGraw Hill22 chapters, 923 pp., glossary,illustrations and photographs Keywords: Packaging, Microelectronics It has been over 10 years since the first microelectronics packaging handbook from the pen of Rao Tummala...

... © MCB UP Limited 2001 --> Surface mount technology Packaging SMT/HYBRID/PACKAGING 2001 remains strong Keywords: Surface mount technology, Packaging Despite the current gloom in the electronics industry, SMT/HYBRID/PACKAGING 2001 celebrated another highly successful...

... © MCB UP Limited 2000 --> Techspray Packaging Soldering Techspray^TM introduces new ESD-safe packaging for desoldering braid Keywords Techspray, Packaging, Soldering Techspray^TM introduces ESD-Safe, static dissipative, oversized bobbins...

... © MCB UP Limited 2000 --> Conferences Electronics Materials Packaging Keywords Conferences, Electronics, Materials, Packaging EMAP '99 was held in Singapore at the end of September and attracted 110 participants, mostly from Singapore and the surrounding region...

... © MCB UP Limited 1999 --> SMTA Packaging SMTA SMTA hosts talk on packaging future Keywords SMTA, Packaging The Surface Mount Technology Association invites members and non-members to attend the SMTA Annual Meeting and luncheon on Tuesday, September 14, 1999...

... © MCB UP Limited 1999 --> Packaging Packaging Solutions Packaging Solutions' technical division increases product range Keywords Packaging, Packaging Solutions The technical division within Packaging Solutions, Advantek's main UK distributor, has broadened its...