...Necdet Geren; Çağdaş Sarıgül; Melih Bayramoğlu Purpose The purpose of this paper is to apply the developed systematic mechanical design methodologies, that are obtained in part I, to investigate their success in designing mechanics of a flexible printed circuit board assembly (PCBA) rework cell...

...Necdet Geren; Çağdaş Sarıgül; Melih Bayramoğlu Purpose The generic design environment for a flexible printed‐circuit board assemblies (PCBA) remanufacturing cell contains four interrelated complex design domains. Mechanical design domains are really complex and the use of well‐proven mechanical...

... © Emerald Group Publishing Limited 2006 --> Television equipment,Electronics industry,Solder Printed-circuit boards Norcott EMS and Miranda Technologies conclude successful lead free PCB trials Keywords: Television equipment, Electronics industry,Solder, Printed...

... The results can be used to enhance the reliability of SnAgCu joints in demanding conditions, when special attention is paid to the choice of PCB surface finish and SnAgCu solder composition. © Emerald Group Publishing Limited 2005 Solder Printed‐circuit boards Creep Alloys Until now SnPb...

... PCB rework stencils deliver repeatable accuracy Keywords: Printed-circuit boards PCB rework stencils which ensure accurate and repeatable printed results, for single component footprints such as QFPs, PLCCs, BGAs, mBGAs and surface-mount connectors, are now available from Tecan...

...John Lau; Nick Hoo; Rob Horsley; Joe Smetana; Dongkai Shangguan; Walter Dauksher; Dave Love; Irv Menis; Bob Sullivan Temperature cycling tests, and statistical analysis of the results, for various high‐density packages on printed‐circuit boards with Sn‐Cu hot‐air solder levelling, electroless...

... on SnCu hot‐air solder levelling electroless nickel‐immersion gold or NiAu, and organic solderability preservative Entek printed circuit boards are presented. Emphasis is placed on determining the failure locations, failure modes, and intermetallic compound composition for these high‐density packages...

..., material, and assembly process aspects of the project are addressed in this paper. The components studied include many surface mount technology package types, various lead, and printed circuit board finishes and paste‐in‐hole assembly. © Emerald Group Publishing Limited 2004 Soldering Design...

...John Lau; Walter Dauksher; Joe Smetana; Rob Horsley; Dongkai Shangguan; Todd Castello; Irv Menis; Dave Love; Bob Sullivan The lead‐free solder joint reliability of several printed circuit board mounted high‐density packages, when subjected to temperature cycling was investigated by finite element...