...Rilwan Kayode Apalowo; Mohamad Aizat Abas; Fakhrozi Che Ani; Muhamed Abdul Fatah Muhamed Mukhtar; Mohamad Riduwan Ramli Purpose This study aims to investigate the thermal fracture mechanism of moisture-preconditioned SAC305 ball grid array (BGA) solder joints subjected to multiple reflow...

...Fei Chong Ng; Aizat Abas; Mohamad Riduwan Ramli; Mohamad Fikri Mohd Sharif; Fakhrozi Che Ani Purpose This paper aims to study the interfacial delamination found in the boundary of the copper/copper-epoxy layers of a multi-layer ceramic capacitor. Design/methodology/approach The thermal reflow...

...Yangyang Lai; Ke Pan; Yuqiao Cen; Junbo Yang; Chongyang Cai; Pengcheng Yin; Seungbae Park Purpose This paper aims to provide the proper preset temperatures of the convection reflow oven when reflowing a printed circuit board (PCB) assembly with varied sizes of components simultaneously. Design...

... reflow soldering (VPS), where – as it was found – different thermocouple constructions can affect the set parameters of the oven and resulting soldering profiles significantly. Design/methodology/approach The study experiments showed significant alteration of the heating profiles during the process...

...Lubomir Livovsky; Alena Pietrikova Purpose This paper aims to present a new method of real-time monitoring of thermal profiles applied in vapour phase soldering (VPS) reflow processes. The thermal profile setting is a significant variable that affects the quality of joints. The method allows rapid...

...Ye Tian; Justin Chow; Xi Liu; Suresh K. Sitaraman Purpose – The purpose of this paper is to study the intermetallic compound (IMC) thickness, composition and morphology in 100-μm pitch and 200-μm pitch Sn–Ag–Cu (SAC305) flip-chip assemblies after bump reflow and assembly reflow. In particular...

...Y.H. Chan; M.M. Arafat; A.S.M.A. Haseeb Purpose The purpose of this paper is to investigate the effects of zinc (Zn) nanoparticles on the interfacial intermetallic compounds (IMCs) between Sn‐3.8Ag‐0.7Cu (SAC) solder and Cu substrate during multiple reflow. Design/methodology/approach...

...Wei Liu; Yanhong Tian; Lei Yang; Chunqing Wang; Lining Sun Purpose The purpose of this paper is to investigate oxidation and the Au‐Sn reaction of laser reflowed (LR) micro‐solder joints when different protective atmospheres were applied. Design/methodology/approach A N2 atmosphere at room...

... be contacted at: siva@iitm.ac.in © Emerald Group Publishing Limited 2012 Soldering Flow Deformation Stress (materials) Flip‐chip Reflow Ball grid array Residual stresses Residual warpage Flip‐chip microelectronic assembly is the direct electrical connection of face down (flipped...

...Yanhong Tian; Chunqing Wang; Xiaodong Zhang; Deming Liu In this paper, the interaction kinetics between eutectic PbSn solder and Au/Ni/Cu metallisation of plastic ball grid array packages during laser reflow bumping were investigated. The effects of processing variables, including laser reflow...

... the curing process. In soldered flip chip techniques, the bonding time per assembly is shorter, because all the chips on the substrate can be soldered in a reflow oven at the same time. In this study, the minimum pre‐curing time needed to make a reliable adhesive joint was determined using one commercial...

... © MCB UP Limited 2003 --> Reflow Stencil Pin-in-hole reflow specialist proves fit-for-purpose stencils Keywords: Reflow, Stencil As the PCB manufacturing industry increasingly adopts the beneficial concept of pin-in-hole reflow (PIHR), Dorset based stencil...

... the highest wettability, one of the highest lap shear strengths, and the lowest levels of voiding. It also performs better under a long reflow profile. Under most instances, the soldering performance is comparable with, or better than, the reference OSP and Ni–Au surface finishes. Ni–PdCo–Au was found to give...

... nickel (Ni/Au) and an organic solderability preservative (OSP), were studied. Chip components with Sn/Pb coating and a gull‐wing type component with 100% Sn coating were used in these experiments. Different reflow profiles were tested, and the dependence of the wetting performance, intermetallic layer...

... © MCB UP Limited 2002 --> Reflow Keywords: Reflow New from DATAPAQ, Insight Software is the latest development in profiling software for the reflow industry. The user is guided step-by-step through the profiling process, and alerted by built- in, customised alarms when...

...J.G. Lee; F. Guo; K.N. Subramanian; J.P. Lucas The influence of the thermal reflow profile on the formation and resultant morphology of the intermetallic layer that developed at the Ni particle reinforcements within an eutectic Sn‐Ag composite solder matrix was investigated. The composite solder...

... © MCB UP Limited 2002 --> Soldering Reflow Keywords: Soldering, Reflow The new ATV reflow/vacuum inline furnace from PESL uses the proven ATV "no void" technology for soldering bump modules, wafers, power devices and similar components. This is of value where, perfect...

...David C. Whalley; Stuart M. Hyslop Previous models of temperature development during the reflow soldering process have typically used commercially available, general purpose, finite difference/finite element modelling tools to create detailed three dimensional representations of both the product...

...Hao Yu; Jorma Kivilathti Because of new requirements related to the employment of lead‐free manufacturing and the diversity of components and metal finishes on high density printed circuit boards, better understanding and control of the reflow process is required in order to achieve acceptable...

...M.R. Harrison; J.H. Vincent; H.A.H. Steen Results for reflow soldering are presented from a three‐year EC funded project “IDEALS” to develop lead‐free soldering solutions. On the basis of fundamental data from the literature, a shortlist of candidate lead‐free solders was selected, and results from...