... drop impact. This study led to some interesting conclusions, highlighting the advantage of introducing non-linear fracture mechanics into the numerical simulations of microelectronic components during a drop impact. FEM Crack J-integral Drop impact Flip-chip SAC Electronic...

... particles. The defects were three sources, oxide inclusion of solder particles, incomplete filling of the molten SAC particles because of vibration and incomplete fusion of globular Zn particles whose melting point was 419°C. With the increase of soldering temperature, a large amount of Sn solid solution...

... Publishing Limited 2021 Emerald Publishing Limited Licensed re-use rights only Solder joints Reliability Electronic assembly Vibration loading SAC 1 = k×1 ones column vector; E = Expected value/Mean time to failure occurrence...

... and liquid phases; and A_sl is the contact area between the droplet and the substrate. The gravity potential energy is involved as shown in the last term. Surface morphology Wettability SAC Lead-free solder Surface evolver V-shaped substrate National Nature Science...

...@hust.edu.cn 23 02 2016 26 04 2016 10 05 2016 © Emerald Group Publishing Limited 2016 Emerald Group Publishing Limited Licensed re-use rights only Solder Composite materials Retained ratio SAC Electronic materials Reflow cycles Lead-free solder Lead-containing...

... Sn3.0Ag0.5Cu (SAC305)-XAl₂O₃ (X = 0.2, 0.4, 0.6, 0.8 Wt. %) composite solders were prepared through the powder metallurgy route. The morphology of composite solder powders which consists of Al₂O₃ particles and SAC solder powders after ball milling was observed...

... element analysis Product reliability Lifetime prediction Reliability Solders Thermal testing Shock tests SAC SnAgCu Jue Li can be contacted at: juliusjueli@gmail.com © Emerald Group Publishing Limited 2011 According to the experimental and simulation results, the critical...

... equipment ranges from 15 to 25 years. Agata Skwarek can be contacted at: askwarek@ite.waw.pl © Emerald Group Publishing Limited 2011 Tin Alloys Joint disintegration Lead‐free SAC SnCu Joining materials Pest resistance testing The wide use of tin finishes and tin‐rich lead...