...K. Bukat; M. Kościelski; J. Sitek; M. Jakubowska; A. Młożniak Purpose The purpose of this paper is to investigate the influence of silver nanoparticle additions on the wetting properties of Sn‐Ag‐Cu (SAC) solder paste. In this investigation, the basic solder paste contained 85 wt.% of commercial...

... to many other alloy systems. P. Fima can be contacted at: nmfima@imim‐pan.krakow.pl © Emerald Group Publishing Limited 2011 Solders Tin Silver Copper Chemical elements and inorganic compounds Solders based on the Sn‐rich Sn‐Ag‐Cu alloys are widely used as substitutes...

... solders as well as reliability investigation of lead‐free soldered joints. Song‐bai Xue can be contacted at: xuesb@nuaa.edu.cn © Emerald Group Publishing Limited 2011 Finite element simulation Soldering Joining processes Stress (materials) Silver Copper Chemical elements...

...T.K. Yeh; K.L. Lin; B. Salam Purpose The purpose of this paper is to study the influence of silver on the high‐temperature oxidation behaviour of the Sn‐8.5Zn‐xAg‐0.01Al‐0.1Ga (x=0, 0.1, 0.3 and 0.5) solder alloys. Design/methodology/approach The weight gains of the studied...

...Jayashri Bangali; Sunit Rane; Girish Phatak; Shashikala Gangal Purpose The purpose of this paper is to investigate and report the impact of glass frit variation in silver thick film pastes used as surface conductors in low temperature co‐fired ceramics technology (LTCC), especially...

... their solidus temperature from 198.05°C to 190.20°C. A Ag content of 1.5 wt% increased the solidus temperature of the studied solder systems to 197.79°C. Furthermore, the study also found that the addition of silver lowered the wetting forces of the studied solders. The formation of multi‐intermetallic layers...