...Muhammad Firdaus Mohd Nazeri; Muhamad Zamri Yahaya; Ali Gursel; Fakhrozi Cheani; Mohamad Najmi Masri; Ahmad Azmin Mohamad Purpose The purpose of this paper is to review and examine three of the most common corrosion characterization techniques specifically on Sn-Zn solders. The discussion...

...Huan Ye; Songbai Xue; Cheng Chen; Yang Li Purpose The purpose of this paper is to investigate the growth behavior and mechanism of Sn whisker induced by RE addition in Sn‐Zn‐Ga‐Pr solder at ambient condition. Design/methodology/approach By means of aging treatment, FIB and SEM microstructure...

...Liu Mei Lee; Habsah Haliman; Ahmad Azmin Mohamad Purpose The purpose of this paper is to produce and investigate the interfacial reaction between Sn‐3.0Ag‐0.5Cu (SAC305) thin films and Cu substrates by solder reflow at various temperatures and times. Design/methodology/approach SAC305 thin...

...Yong‐Won Lee; Keun‐Soo Kim; Katsuaki Suganuma Purpose The purpose of this paper is to propose a solution procedure to minimize/eliminate voiding and spattering defects in the assembly of 0201 chip components with micro via‐in pads and 95 wt.%Sn‐5 wt.%Sb solder alloy. Design/methodology/approach...

...Xin Luo; Wenhui Du; Xiuzhen Lu; Toshikazu Yamaguchi; Gavin Jackson; Li lei Ye; Johan Liu Purpose The composition and thickness of surface oxide of solder particles is extremely important to the quality of interconnect and reliability of packaged system. The purpose of this paper is to develop...

...Maurice N. Collins; Jeff Punch; Richard Coyle Purpose The purpose of this paper is to assess the long‐term reliability of lead‐free Sn96.5Ag3.0Cu0.5 (SAC305) under accelerated temperature cycling (ATC) conditions. Test vehicles consisted of commercial 2512 ceramic chip resistors soldered...

...Peng Xue; Songbai Xue; Yifu Shen; Zhengxiang Xiao; Hong Zhu; Weimin Long; Xinquan Yu Purpose The purpose of this paper is to improve the properties of Sn−9Zn solder, so as to meet the requirements of industrial applications. Design/methodology/approach The effects of Praseodymium on property...

...Wenzhen Bi; Guokui Ju; Fei Lin; Shifang Xie; Xicheng Wei Purpose In a previous study, the authors proposed a new low‐silver solder alloy Sn‐ x(1.0, 1.5, 2.0)Ag‐0.3Cu‐3.0Bi‐0.05Er (wt.%) (SACBE) and the purpose of this paper is to provide additional useful information for new solder alloy...

... bump structure of 8 μm Cu/5 μm Sn2.5Ag Pb‐free solder. After wafer dicing, the chip with the WLUF was assembled on a substrate chip with the same bump structure using a high accuracy bonder. The substrate chip had metalisation (wiring) to enable evaluation of the electrical characteristics...

...Przemyslaw Fima; Tomasz Gancarz; Janusz Pstrus; Krystyna Bukat; Janusz Sitek Purpose The purpose of this paper is to study the effect of copper concentration in near‐eutectic liquid SAC solders on their thermophysical properties: viscosity, surface tension, density; as well as wetting behavior...

... with the SnCu and Snimm finishes, wetted by the SnZn7Bi3In4 alloys. By applying the SEM and EDX methods, it was possible to establish that the barrier layer which was created during the HASL process between the copper and the SnCu solder is efficient enough to protect the copper against the influence of the Zn...

...De‐Shin Liu; Chang‐Lin Hsu; Chia‐Yuan Kuo; Ya‐Ling Huang; Kwang‐Lung Lin; Geng‐Shin Shen Purpose The purpose of this paper is to present a novel high speed impact testing method for evaluating the effects of low temperatures on eutectic and lead‐free solder joints. Interfacial cracking failure...

... and users, and help to minimise adhesion failures in service. The test has been demonstrated to be sensitive to a number of process and material variables. Adhesion Conformal coating Peel force Solders Conformal coatings are increasingly being used across a wide range of applications to assure...

...Yong‐Won Lee; Keun‐Soo Kim; Katsuaki Suganuma Purpose The purpose of this paper is to optimize assembly processes in order to minimize defects in the assembly of 01005 chip components. Design/methodology/approach During the study, solder paste printing process‐related variables, such as solder...

...Peng Xue; Song‐bai Xue; Liang Zhang; Yi‐fu Shen; Li‐li Gao; Sheng‐lin Yu; Hong Zhu; Zongjie Han; Yan Chen Purpose The purpose of this paper is to investigate the laser soldering of fine pitch quad flat package (QFP) devices using lead‐free solders and solder joint reliability during thermal...

...Jue Li; Hongbo Xu; Jussi Hokka; Toni T. Mattila; Hongtao Chen; Mervi Paulasto‐Kröckel Purpose The purpose of this paper is to study the reliability of SnAgCu solder interconnections under different thermal shock (TS) loading conditions. Design/methodology/approach The finite element method...

...O. Nousiainen; O. Salmela; J. Putaala; T. Kangasvieri Purpose The purpose of this paper is to describe the effect of indium alloying on the thermal fatigue endurance of Sn3.8Ag0.7Cu solder in low‐temperature co‐fired ceramic (LTCC) modules with land grid array (LGA) joints and the feasibility...

... to the soldering of high indium alloys on printed circuit boards, with different finishes and qualities of the solder joint performance. Practical implications Taking into account the contact angle data from the WB and SD methods, the best results of the SAC‐In alloy on copper were obtained for the alloy...

...O. Nousiainen; T. Kangasvieri; R. Rautioaho; J. Vähäkangas Purpose The purpose of this paper is to investigate the thermal fatigue endurance of two lead‐free solders used in composite solder joints consisting of plastic core solder balls (PCSB) and different solder materials, in order to assess...

... finishes (SnCu, immersion Sn, Ni/Au, organic solderability preservative) in the presence of fluxes. The practical implications of the results is the main purpose of these investigations. Design/methodology/approach A wetting balance method was used for wetting measurements at 230 and 250°C in nitrogen...