...Ezzatul Farhain Azmi; Abdullah Aziz Saad; Yasemin Tabak; Fayaz Hussain; Ahmad Azmin Mohamad Purpose This study aims to compare wettability, interfacial morphology and mechanical properties of Sn-3.0Ag-0.5Cu (SAC305) solder on Cu substrate using conventional reflow ( CR ) and microwave hybrid...

... + (Cu, Ni)₆Sn₅. The maximum value of 12.1 HV is reached when the Ni content is 0.1 Wt.%. When the Ni content is 0.5 Wt.%, the wettability of the solder alloy increases by about 15%, the interface thickness increases by about 8.9% and the scallop-like structure is the most refined...

...Norliza Ismail; Azman Jalar; Maria Abu Bakar; Roslina Ismail; Najib Saedi Ibrahim Purpose The purpose of this paper is to investigate the wettability and intermetallic (IMC) layer formation of Sn-3.0Ag-0.5Cu (SAC305)/CNT/Cu solder joint according to the formulation of solder paste because...

... The current paper presents a comprehensive review of the tin-silver-copper solder series with possible solutions for improving their microstructure, melting point, mechanical properties and wettability through the addition of different elements/nanoparticles and other materials. Originality/value...

... samples were etched with 100 ml H₂O, 2 ml HCl, and 10 g FeCl₃ solution for 45 seconds and characterized by SEM+EDS and XRD analyses (Omaç et al., 2017). Contact angle Wettability IMC's Pb-free solder alloy Increasing concern about human health...

...Yu Tang; Shaoming Luo; Guoyuan Li; Zhou Yang; Chaojun Hou Purpose The purpose of this paper is to investigate of the effects of Mn nanoparticle addition on the wettability, microstructure and microhardness of SAC0307-xMn(np) (SAC: Sn–Ag–Cu; x = 0, 0.02, 0.05, 0.1 and 0.3 Wt...

...Yung-Sen Lin; Shiau-Min Lin; Jian-Yi Li; Min-Chih Liao Purpose An investigation has been performed on the improved solder wettability of oxidized aluminum (Al) with lead-free solder (96.5Sn-3.5Ag) using Ar-H₂ plasmas. The lead-free solder wettability was raised from 62.2 per cent...

... ; Yuan et al., 2002a). For molten solder on a V-shaped substrate reaching the stationary equilibrium state, it is worthwhile to investigate the morphological characteristics by means of accurately measuring the wettability related to geometrical and physical parameters and further discussing...

.... The retained ratio of Al₂O₃ nanoparticles in composite solder billets and solder joints were also quantitatively measured. Furthermore, the as-prepared composite solder alloys were studied extensively with regard to their microstructures, thermal property, wettability and mechanical...

... properties of wettability and spreadability on a Cu substrate were studied, and the effect of Al on the growth of intermetallic compounds (IMCs) was observed. The shear strength of soldered joints was assessed. For comparison, soldering and strength tests were carried out on SAC 405 and SAC 405+ Al solders...

... the melting point interval of experimental Bi‐11Ag solder, DSC analysis was performed. The contact angles were studied on a copper, nickel and silver substrate by use of a sessile drop method. Wettability tests were realised at a temperature of 380°C in a shielding atmosphere (90% N₂+10...

... and Sn whisker growth under aging treatment in Sn−9Zn lead‐free solder were investigated. Findings The results indicate that with the addition of rare earth Pr, the wettability and mechanical properties of Sn−9Zn solder were improved. The best wettability and comprehensive property of soldered joint...

...Y.S. Lin; W.J. Lin; L.Y. Chiu Purpose The purpose of this paper is to investigate the effects of H2 flow rate on improving the solder wettability of oxidized‐copper with liquid lead‐free solder (96.5Sn‐3Ag‐0.5Cu) by Ar‐H2 plasmas. The aim was to improve the solder wettability of oxidized copper...

...Roman Koleňák; Michal Chachula; Pavol Šebo; Monika Koleňáková Purpose The purpose of this paper is to investigate the wettability of an active Sn2Ti solder on an Al₂O₃ ceramic material at temperatures of 700°C and higher. Based on the results of the wettability study...

...C.C. Tu; M.E. Natishan A study was performed to develop a different experimental methodology to assess wettabilities of solders on various printed wiring board (PWB) finishes, based on a modified spreading test in which solder pastes were heated following temperature reflow profiles representative...

...P.T. Vianco; J.A. Rejent A test procedure was developed to assess the capillary flow wettability of solders inside a confined geometry. The test geometry comprised two parallel plates with a controlled gap of constant thickness (0.008 cm, 0.018 cm, 0.025 cm and 0.038 cm). Capillary flow...

...P.T. Vianco; A.C. Claghorn ** A study was performed which investigated the wettability of 63Sn‐37Pb and 96.5Sn‐3.5Ag solders on copper and gold ‐nickel plated Kovar ™ using a rosin ‐based, mildly activated (RMA) flux, a water soluble organic acid flux (WS ),and a low residue (LR) flux...