Issues

Association news

MIPI Alliance grows membership to 39 companies

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Book reviews

Bob Willis' top ten reference books 2004

Bob Willis
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The Design of CMOS Radio-Frequency Integrated Circuits

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The reliability assessment of flip chip components

C.Y. Huang
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Characterization of copper pastes for end termination application of base metal electrode MLCCs

Masyood Akhtar; Rupendra M. Anklekar
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Increasing placement capacity with area based optimization and line balancing

Timo Liukkonen; Aulis Tuominen
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2D analysis of functional stress degradations on power VDMOS transistor

B. Beydoun; M. Zoaeter; A. Alaeddine; I. Rachidi; F. Bahsoun; J‐J. Charlot; J‐P. Charles
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Inspection of electronics packages using the efficient perception technique

Z.W. Zhong; Y. Jiang
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Prediction of temperature in silicon chip with non‐uniform power: a Lagrangian interpolation approach

Teck Joo Goh; K.N. Seetharamu; G.A. Quadir; Z.A. Zainal; K. Jeevan
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Fourier and wavelet transform analysis of moire fringe patterns in electronic packaging

C.Y. Xiong; J. Zhang; M. Li; J. Fang; S. Yi
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Company profile

Mozaik Technology Ventures Ltd

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Exhibitions and conferences

MICROTECH 2004

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Industry news

Intel and Media Lario announce investment and commercial agreements

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Software provides easy access to embedded FPGAS

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Realistic solderability testing with lead-free solders

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IBM and Chartered extend manufacturing arrangement to include 90 nm SOI semiconductors

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Elite Electronics selects Komax Gamma 333PC

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WBI-FOX X-ray inspection system selected "Best in Test"

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Discretix partners with Texas Instruments on mobile security

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CEMCEX announces event schedule for 2004

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Agilent Technologies expects to exceed guidance for first quarter 2004 results

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Media Lario receives 12 million series – a funding led by TLcom Capital Partners and DFJ ePlanet Ventures

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International diary

International diary

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Internet commentary

Internet commentary

Brian Ellis
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Interview

All together now

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Letter to the Editor

The litmus test for speciality optical fibers

Dr Chris Emslie
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New products

iSYSTEM and PHYTEC launch combination rapid development kit

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DuPont Electronic Technologies new WB dry film photoresist for semiconductor wafer bumping

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GDS invests in new Taiwanese clean room to ensure optimum LCD display performance

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Telelog reduces cash drain from climate change levy

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Agilent Technologies introduces smaller FBAR transmit filter for US PCS band mobile phones, data cards

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New EPCOS antenna for Bluetooth and WLAN provides more power in less space

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New vacuum pickup

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New liquid crystal polymer reduces semiconductor packaging costs

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New rotary dispensing table

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New precision 50 ml twin-pack cartridge dispenser

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Soft EMI shielding gaskets cropped to any length from TBA ECP

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