... joints under coupled tensile and shear loading, thereby improving the overall reliability of electronic products. Design/methodology/approach A finite element model for CSP solder joints was established using ANSYS software. Stress−strain finite element analysis was performed under coupled...

... 02 2023 © Emerald Publishing Limited 2023 Emerald Publishing Limited Licensed re-use rights only Printed circuit board Modal analysis Fundamental natural frequency Optimization Finite element analysis Support locations A printed circuit board (PCB) normally used...

... of the energy release rate (ERR) for interfacial delamination on the via design and the thermal mismatch strain. Then, finite element analysis (FEA) is used to investigate the influence of detailed design and material factors, including the pitch distance, via aspect ratio, via geometry and the glass and via...

... temperature for the chip is also evaluated. Finite element analysis Pressure sensor Residual stress Accelerometer Shielding electrode From the literature (Hah et al., 2004 ; Lee et al., 2003 ; Li et al., 2002 ; Yıldırım et al., 2012), various...

... Publishing Limited Licensed re-use rights only Finite element analysis Electronics packaging Finite element model updating Modal analysis Vibration loading can be exerted on an electronic assembly during shipping, handling, manufacturing and end-use. Therefore, vibration-induced solder...

.../micro-bump is also examined. Yu-Lin Shen can be contacted at: shenyl@unm.edu © Emerald Group Publishing Limited 2014 Stress Deformation Solder Finite element analysis 3D Microelectronic package Through-silicon via Intermetallic Chip stack Three-dimensional (3D) stacking...

... was then be developed with finer element size of 0.02 mm around the solder joint region with triangular technique due to the feature size of the solder balls. Stress (materials) Finite element analysis ABAQUS Thermal analysis Flip chip Solder ball In small integrated circuit package such as flip...

...Muhammad Nubli Zulkifli; Zul Azhar Zahid Jamal; Ghulam Abdul Quadir Purpose The purpose of this paper is to discuss the capability of finite element analysis (FEA) in performing the virtual thermal cycling reliability test to evaluate the reliability of solder joints in a ball grid array (BGA...

... model, even if not an exact fit. Originality/value This paper focuses on a characterisation of PZT thick films screen‐printed on pre‐fired LTCC substrates. Marina Santo Zarnik can be contacted at: marina.santo@ijs.si © Emerald Group Publishing Limited 2008 Finite element analysis...

... optimization methods, the optimal wire shape is obtained. © Emerald Group Publishing Limited 2008 Optimization techniques Bonding Wires Finite element analysis Electronic engineering Using the developed FEM models, we have examined the occurrence of wire failures due to the following...

... widths and/or spacing of the printed circuit board. Originality/value The paper focuses on a tuning method to reduce warpage of microelectronic substrates. Finite element analysis Substrates Deformation There have been numerous attempts to reduce warpage in microelectronic substrates...

... configurations. Finite element analysis Thermal testing Tests and testing Printed circuits A top die surface area (cm^{2) A_heater heater area (mm2) A_RTD resistance temperature sensor/detector area (mm2) f number}...

... be easily implemented in the optimization procedure for obtaining the optimal chip/component placement based on thermal constraints. © Emerald Group Publishing Limited 2005 Finite element analysis Printed‐circuit boards Programming and algorithm theory A Surface area...

... board was used for model validation. A fan heat sink was attached to the die using ShinEtsu G‐749 thermal grease as the thermal interface material. © Emerald Group Publishing Limited 2004 Programming and algorithm theory Finite element analysis Regression analysis Dissipation factor...

... work. Finite element analysis Finite difference methods Resistors One of the most important tools available to practicing engineers that can be used to solve electrical potential problems in two dimensions (potential field does not vary with respect to the third dimension) is a method...