... joints under coupled tensile and shear loading, thereby improving the overall reliability of electronic products. Design/methodology/approach A finite element model for CSP solder joints was established using ANSYS software. Stress−strain finite element analysis was performed under coupled...

... of the model which have different support locating points (randomly selected) within the design space are chosen for the study. Printed circuit board Modal analysis Fundamental natural frequency Optimization Finite element analysis Support locations A printed circuit board (PCB) normally used...

... of the energy release rate (ERR) for interfacial delamination on the via design and the thermal mismatch strain. Then, finite element analysis (FEA) is used to investigate the influence of detailed design and material factors, including the pitch distance, via aspect ratio, via geometry and the glass and via...

... analyses is discussed in this work. Finite element analysis Pressure sensor Residual stress Accelerometer Shielding electrode Lishchynska et al. (2007) evaluated the effect of the die attachment process on the pull-in behavior of the MEMS structure by simulation...

... of this approach is to first test the effect of each material property on the package dynamic characteristics before starting the correlation process, then to automate the correlation algorithm using the built-in FE model updating feature available in ANSYS software. Finite element analysis Electronics...

... 400 MPa in Figure 7(b) . Yu-Lin Shen can be contacted at: shenyl@unm.edu © Emerald Group Publishing Limited 2014 Stress Deformation Solder Finite element analysis 3D Microelectronic package Through-silicon via Intermetallic Chip stack Three-dimensional (3D) stacking...

... for the manufacturers. The components also need to withstand higher soldering temperatures (typically 20‐35°C higher) and the solder joints should have at least the same life time as the conventional solder balls (expressed in number of thermal cycles). Stress (materials) Finite element analysis ABAQUS Thermal...

...Muhammad Nubli Zulkifli; Zul Azhar Zahid Jamal; Ghulam Abdul Quadir Purpose The purpose of this paper is to discuss the capability of finite element analysis (FEA) in performing the virtual thermal cycling reliability test to evaluate the reliability of solder joints in a ball grid array (BGA...

... overview on wire bonding techniques and process settings can be found in Harman (1989) and Harper (1991) . Optimization techniques Bonding Wires Finite element analysis Electronic engineering Thermo‐mechanical reliability of microelectronics is one of the major concerns...

... model, even if not an exact fit. Originality/value This paper focuses on a characterisation of PZT thick films screen‐printed on pre‐fired LTCC substrates. Marina Santo Zarnik can be contacted at: marina.santo@ijs.si © Emerald Group Publishing Limited 2008 Finite element analysis...

... curvatures, respectively. Parsaoran Hutapea can be contacted at: hutapea@temple.edu © Emerald Group Publishing Limited 2007 Finite element analysis Substrates Deformation There have been numerous attempts to reduce warpage in microelectronic substrates. A method that is commonly...

...@intel.com © Emerald Group Publishing Limited 2006 Finite element analysis Thermal testing Tests and testing Printed circuits A top die surface area (cm^{2) A_heater heater area (mm2) A_RTD resistance temperature sensor}...

... be easily implemented in the optimization procedure for obtaining the optimal chip/component placement based on thermal constraints. Finite element analysis Printed‐circuit boards Programming and algorithm theory A Surface area, m² a Half width of a rectangular...

.... The element defined using natural coordinate system is shown in Figure 2 where the coordinate variables ξ, η and ζ range from −1 to +1. © Emerald Group Publishing Limited 2004 Programming and algorithm theory Finite element analysis Regression analysis Dissipation...

... called elements, as shown in Figure 2 (Chapra and Canale, 1998 ; Stasa, 1985). © Emerald Group Publishing Limited 2004 Finite element analysis Finite difference methods Resistors One of the most important tools available to practicing engineers that can be used to solve...