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Issue
8 February - Volume 23, Issue 1, Pages 4 - 46
12 April - Volume 23, Issue 2, Pages 68 - 119
28 June - Volume 23, Issue 3, Pages 140 - 190
20 September - Volume 23, Issue 4, Pages 211 - 256
Volume 23, Issue 1
8 February 2011
All Issues
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ISSN
0954-0911
EISSN
1758-6836
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In this Issue
Conferences and exhibitions
Industry news
International diary
New products
Note from the publisher
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Addition of cobalt nanoparticles into Sn‐3.8Ag‐0.7Cu lead‐free solder by paste mixing
S.L. Tay
;
A.S.M.A. Haseeb
;
Mohd Rafie Johan
Abstract
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A comparative study of microstructure and mechanical properties among Cu/Sn/Cu, Ni/Sn/Ni and Cu/Sn/Ni solder joints
Bo Wang
;
Fengshun Wu
;
Yiping Wu
;
Bing An
;
Hui Liu
;
Jian Zou
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for A comparative study of microstructure and mechanical properties among Cu/Sn/Cu, Ni/Sn/Ni and Cu/Sn/Ni solder joints
Effects of bulk Cu
6
Sn
5
intermetallic compounds on the properties of Sn‐Ag‐Cu‐Ce soldered joints
Liang Zhang
;
Song‐bai Xue
;
Li‐li Gao
;
Zhong Sheng
;
Wei Dai
;
Feng Ji
;
Huan Ye
;
Yan Chen
;
Sheng‐lin Yu
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for Effects of bulk Cu<sub>6</sub>Sn<sub>5</sub> intermetallic compounds on the properties of Sn‐Ag‐Cu‐Ce soldered joints
Investigation of the effect of indium addition on wettability of Sn‐Ag‐Cu solders
Z. Moser
;
P. Fima
;
K. Bukat
;
J. Sitek
;
J. Pstruś
;
W. Gąsior
;
M. Kościelski
;
T. Gancarz
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for Investigation of the effect of indium addition on wettability of Sn‐Ag‐Cu solders
Thermal fatigue endurance of Sn3Ag0.5Cu0.5In0.05Ni and Sn2.5Ag0.8Cu0.5Sb solders in composite solder joints of LTCC/PWB assemblies
O. Nousiainen
;
T. Kangasvieri
;
R. Rautioaho
;
J. Vähäkangas
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for Thermal fatigue endurance of Sn3Ag0.5Cu0.5In0.05Ni and Sn2.5Ag0.8Cu0.5Sb solders in composite solder joints of LTCC/PWB assemblies
Development of a lead‐free solder: Sn‐4.0Bi‐3.7Ag‐0.9Zn
Xun Wang
;
Yongchang Liu
;
Liming Yu
;
Zhizhong Dong
;
Zhiming Gao
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Conferences and exhibitions
eFutures Academic Community Meeting, Glaziers Hall, London, 8 October 2010
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SMART GROUP 26th Annual Conference, The Oxfordshire Golf Club, Thame, Oxfordshire, October 6 and 7 2010
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Printed Electronics – Technologies and Applications, Electronics Yorkshire, 23 September 2010
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The 5th Annual IeMRC Conference, Holywell Park Conference Centre, Loughborough University, 21 September 2010
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Manufacturing Technology Centre – Electronics Manufacturing Launch, Ansty Park, Coventry, 19 August 2010
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Industry news
SisTech Manufacturing Inc. has installed a Europlacer iineo-II SMT platform at its facility in Bend, Oregon
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Prism staff pass lean manufacturing NVQs
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Alpha® Stencils in the movies
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MEC expands production capacity
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New IPC training video updates best practices for hand soldering terminals
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Italian weaving machine specialist ROJ upgrades its production with SIPLACE SX placement machines
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Essemtec books record sales in August
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Axis Electronics upgrades with MYDATA
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MYDATA turnover breaks all records
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Gaining flexibility in SMT production
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New DEK & Partnertec facility helps customers in Benelux “Expect More
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International diary
International diary
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New products
MYDATA boosts performance remotely
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DEK ProActiv rewrites printing rules to revolutionise paste transfer efficiency
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New software prevents unnecessary trips to and from inventory
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SIPLACE Line Monitor provides relevant production data at a glance
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Note from the publisher
A new company descriptor takes us into a new era
Rebecca Marsh
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