... be contacted at: ggs@cqut.edu.cn 30 12 2019 19 05 2020 27 06 2020 © Emerald Publishing Limited 2020 Emerald Publishing Limited Licensed re-use rights only Sn-37Pb Thermal shock Shear strength Failure Tearing crack Microstructure Solder bumps Fatigue Tensile testing...

... components in PCB equipment, a vibration test was carried out. Numerous studies reported that solder pad are the most resistless parts in an electronic assembly (Samavatian et al., 2018 ; Sasaki and Ohno, 2013; Ghaderi et al., 2018). Nevertheless, in fatigue lifetime evaluation, stress...

... (Ghaderi et al., 2018 ; Tsai et al., 2007 ; Gadalla et al., 2015 ; Fang et al., 2016). Along with finite element method (FEM) simulations, some experimental tests have been performed to discuss the mechanical fatigue lifetime of electronic packages. Fatigue life...

...Mohammad Gharaibeh Purpose This paper aims to investigate the fatigue life performance of SAC305 ball grid array solders under combined temperature and harmonic vibration loading conditions. Design/methodology/approach Fatigue tests were performed using a sine dwell with resonance tracking...

... Modelling Finite element modelling (FEM) Interconnections Thermal fatigue Fatigue Joint resistance Thermal management 3D IC package Coefficient thermal expansion Through-silicon-vias Finite element methodology Thermal failure Ministry of Science and Technology 104-2221-E-110 -023...

... [ Figure 2(a) ]. Board assembly Reliability Quality control Fatigue Aging Thermogenerators Seebeck coefficient Lead telluride Thermogenerators (TEGs, also called Seebeck generators) are devices which use the Seebeck effect to convert a heat flow stream directly into electrical energy...

... Publishing Limited 2014 Fatigue Thermal fatigue Assembly SMD Peltier elements are semiconductor components, the function of which is based on the Peltier effect described as follows: when an electric current passes through a semiconductor junction, one side is cooler and the opposite side...

... combined loading approach a promising and affective method for accelerated reliability tests. Both indentation and FRIS techniques by numerous possibilities of loading conditions seem to be appropriate in order to study the creep and fatigue behaviour. That kind of behaviours can be used by different...

... for the first time to evaluate the influence of crack length on RF impedance. Yao Bin can be contacted at: yaob@ceprei.com © Emerald Group Publishing Limited 2013 Solder Fatigue Mechanical properties of materials Solder joint Degradation DC resistance RF impedance Time domain High...

... deformation. The purpose of this paper is to look at the effect of soldering processes of Al₂‐O₃ DBC substrates to copper plates and power electronics, on their thermal fatigue life and warpage. Design/methodology/approach A numerical thermo‐mechanical finite element model, using...

...O. Nousiainen; O. Salmela; J. Putaala; T. Kangasvieri Purpose The purpose of this paper is to describe the effect of indium alloying on the thermal fatigue endurance of Sn3.8Ag0.7Cu solder in low‐temperature co‐fired ceramic (LTCC) modules with land grid array (LGA) joints and the feasibility...

...Mei-Ling Wu Purpose The purpose of this paper is to identify the critical parameters that influence ball grid array and chip size package fatigue life in a random vibration environment by using a design of experimental (DOE) approach using simulation results. Design/methodology/approach...

...Guangcheng Dong; Xu Chen; Xinjian Zhang; Khai D.T. Ngo; Guo-Quan Lu Purpose The purpose of this paper is to study the phenomenology of Al₂O₃-DBC substrate thermal-cracking under different high temperature cyclic loadings. The extremely low cycle fatigue (ELCF) life prediction...

... distribution on the weakest site and improving the thermal fatigue lifetime of DBC substrates under thermal cycling was proposed. In this study, thermal cycling experiments with a large temperature range (−55 ∼250°C) are conducted and the validity of the Chaboche constitutive model, which is used...

... (LTCC) modules and the thermal fatigue durability of the configuration. The purpose of using the Sn7In4.1Ag0.5Cu solder was to increase the creep/fatigue resistance of critical regions on the LTCC side of the joint. Design/methodology/approach Test LTCC module/printed wiring board (PWB) assemblies...

...Miloš Dušek; Christopher Hunt Purpose The purpose of this paper is to discuss a new method to measure the fatigue of single solder joints in shear, and hence calculate the joint strain energy density in each fatigue cycle. Design/methodology/approach There has been a step change...

...Michael Osterman; Michael Pecht Purpose The aim is to present temperature fatigue model constants for lead‐free tin‐silver‐copper solder derived from test data and demonstrate the validity of the model using published experimental results. Design/methodology/approach Temperature cycle fatigue...

...N. Barry; I.P. Jones; T. Hirst; I.M. Fox; J. Robins Purpose The research aims to explore the high‐cycle fatigue performance of Pb‐free alloys and compare them to Sn‐Pb. In doing this, it also aims to demonstrate the viability of a new testing method. Design/methodology/approach The method...

...Christopher Bailey; Johan Liu; Peng Sun; Cristina Andersson; Xicheng Wei; Zhaonian Cheng; Dongkai Shangguan; Johan Liu Purpose To determine the Coffin‐Manson (CM) equation constants for fatigue life estimation of Sn‐8Zn‐3Bi solder joints, since Sn‐8Zn‐3Bi solder has a melting temperature of around...

... soldering with Sn‐8Zn‐3Bi has already been used in the electronics assembly industry, it is necessary to study its low cycle fatigue properties since such data have not been reported up to now. Design/methodology/approach In this study, displacement‐controlled low cycle fatigue testing of Sn‐8Zn‐3Bi...