...,In)₅ and Ag₃(Sn,In) intermetallic compounds. Practical implications Indium doping offers a cost-effective strategy towards sustainable and high reliability solder materials for automotive and aerospace electronics, with potential to reduce lead dependence in compliance with RoHD...

... The intermetallic compound (IMC) layer of the solder joint has an initial thickness. Within the first 36 h of vibration, this thickness decreases due to changes in the growth mode of the IMCs. After 36 h, however, the thickness of the IMC in the solder joint begins to increase as the duration of vibration extends...

..., the interfacial intermetallic compound (IMC) layer in Sn-58Bi solder joints was thinner than that in Sn-3.0Ag-0.5Cu joints. IMC thickness increased with the solder size increasing. Ball shear test showed that the strength of Sn-58Bi solder joints was much higher than that in Sn-3.0Ag-0.5Cu solder joints...

... behavior of intermetallic compounds (IMCs) at the soldered Sn37Pb/Ni-xCu (x = 0, 20, 40, 60, 80 and 100 Wt.%) solid–liquid interface was investigated using electron probe microanalyzer and electron backscatter diffraction, the shear performance of the joints was conducted using a shear...

... mechanism of Pd element on Au-Al bonding reliability. Findings The addition of Pd element effectively reduces the thickness of intermetallic compounds (IMCs) layer and strengthens the fracture tension and reliability. Compared with the 4N specimen, the average thickness of the IMCs layer of the 2N...

...Zhang Liang Purpose The purpose of this study is the formation and growth of nanoscale intermetallic compounds (IMCs) when laser is used as a heat source to form solder joints. Design/methodology/approach This study investigates the Sn/Cu and Sn-0.1AlN/Cu structure using laser soldering under...

...Jiacheng Zhou; Jinglin Shi; Lei Xu; Fuwen Zhang; Zhigang Wang; Qiang Hu; Huijun He Purpose The reliability of solder joints is closely related to the growth of an intermetallic compound (IMC) layer between the lead-free solder and substrate interface. This paper aims to investigate the growth...

... 01 12 2023 01 12 2023 © Emerald Publishing Limited 2024 Emerald Publishing Limited Licensed re-use rights only Anand viscoplasticity Transient liquid phase Silver–tin bonds Power electronics Intermetallic compounds Anand model For the characterization...

... Publishing Limited Licensed re-use rights only Sn-Ag lead-free solder Holmium rare earth addition Mechanical properties Thermal stability electronic packaging Intermetallic compounds Microstructure Pb-free Alloy properties X-ray diffraction Low temperature solder Solders containing...

... © Emerald Publishing Limited 2021 Emerald Publishing Limited Licensed re-use rights only Intermetallic compounds Wetting Flux Lead-free High temperature solder In recent years, microelectronic components have become more and more miniaturized, intelligent and multifunctional...

...Xu Han; Xiaoyan Li; Peng Yao Purpose This study aims to investigate the effect of ultrasound on interfacial microstructures and growth kinetics of intermetallic compounds (IMCs) at different temperatures. Design/methodology/approach To investigate the effect of ultrasound on IMCs growth...

... 2020 30 11 2020 24 02 2021 28 02 2021 © Emerald Publishing Limited 2021 Emerald Publishing Limited Licensed re-use rights only Intermetallic compounds Microstructure Solder joints Growth kinetics With the development of electronic equipment toward...

... of electronics. SAC305 alloys are potential choices to use as lead-free solders because of their good properties as compared to the conventional Tin-Lead solder alloys. However, the presence of bulk intermetallic compounds (IMCs) in the microstructure of SAC305 alloys affects their overall performance. Therefore...

...Yun Liu; Weiyuan Yu; Xuemin Sun; Fengfeng Wang Purpose This paper aims to investigate the effect of ultrasonic vibration (USV) on the evolution of intermetallic compounds (IMCs), grain morphology and shear strength of soldered Ni/Sn/Ni samples. Design/methodology/approach The Ni/Sn/Ni joints...

... to examine microstructural characteristics, and mechanical properties of the joints were studied by applying microhardness and shear tests. The shear tests were conducted by a shear fixture which was mounted on the tensile machine. Findings The intermetallic compounds of the Cu₆Sn₅...

.... Findings The early cycle of CV exhibits only dissolution peaks of β-Sn until intermetallic compound (IMC) peaks emerged at a later cycle. CA performed for 24 h at selected potentials reveals that β-Sn can be removed completely from the sample without disrupting the IMC network at a suitable potential...

...Mengjiao Guo; F. Sun; Zuozhu Yin Purpose This paper used a novel technique, which is thermo-compression bonding, and Sn-1.0Ag-0.5Cu solder to form a full intermetallic compound (IMC) Cu₃Sn joints (Cu/Cu₃Sn/Cu joints). The purpose of the study is to form high-melting-point IMC...

... atmosphere. Agata Skwarek can be contacted at: askwarek@ite.waw.pl 06 10 2017 23 01 2018 10 04 2018 13 04 2018 © Emerald Publishing Limited 2018 Emerald Publishing Limited Licensed re-use rights only Intermetallic compounds Solder alloys Reliability Mechanical...

...Jagjiwan Mittal; Kwang-Lung Lin Purpose This paper aims to study the diffusion of Zn, Ni and Sn in the liquid state during the reflow ageing of the Sn-Zn solder above its melting point on an Ni/Cu substrate in relation to the formation of intermetallic compounds (IMCs). Design/methodology...

... of the structure. Findings Successful low-temperature (115°C) bonding with intact PZT polarization was demonstrated. The bondlines show a layered structure of Au/Au–In intermetallic compounds (with Bi inclusions)/Au, capable of withstanding temperatures as high as 271°C before remelting occurs. For bonded...