... Soldering Mechanical properties of materials Shear strength Bi‐11Ag solder Wettability The work presented here deals with the study of high‐temperature solders. In spite of the success achieved in the study of lead‐free solders, there still remains a need to investigate solders used for higher...

... for the first time to evaluate the influence of crack length on RF impedance. Yao Bin can be contacted at: yaob@ceprei.com © Emerald Group Publishing Limited 2013 Solder Fatigue Mechanical properties of materials Solder joint Degradation DC resistance RF impedance Time domain High...

.... The cost of the solder with added Pr is limited to RMB 2 yuan/kg so it can be widely used in industry. Songbai Xue can be contacted at: xuesb@nuaa.edu.cn © Emerald Group Publishing Limited 2012 Mechanical properties of materials Metals Solders Alloys Tin‐Zinc Praseodymium...

... Janeczek can be contacted at: kamil.janeczek@itr.org.pl © Emerald Group Publishing Limited 2012 Mechanical properties of materials Stress (materials) Joining processes Additives RFID Chip assembly Carbon nanotubes Flexible substrate Mechanical durability CNT Radio‐frequency...

... different loading rates and temperatures. Gang Chen can be contacted at: agang@tju.edu.cn © Emerald Group Publishing Limited 2012 Joining processes Sintering Mechanical properties of materials Shear strength Nano‐silver paste Interconnect Single lap shear Temperature dependent...

... nanocomposite solders in a planetary ball mill process, and the data are compared with related researches done. A.S.M.A. Haseeb can be contacted at: haseeb@um.edu.my © Emerald Group Publishing Limited 2011 Mechanical properties of materials Solder Composite materials Copper Nanotechnology...

... and mechanical properties of solder joints. Soldering Metals Mechanical properties of materials Joining processes In electronic assembly and electronic packaging, solder joints are commonly used to connect the electronic components with the substrate. In order to obtain good interconnections...

... a high performance, lead‐free solder was developed. © Emerald Group Publishing Limited 2011 Solder Mechanical properties of materials Metals Tensile strength Although conventional Sn‐Pb solder has been used in electronic packaging for many years due to its good properties, its use...

... 2010 Solders Lead Mechanical properties of materials Metals Tensile strength Because of the environmental issues of lead, lead‐free solders are taking the place of Sn−Pb solders (Zeng and Tu, 2002 ; Deng et al., 2005, 2003 ; He et al., 2005). However...

... − ln ⁡ α S n C u 6 S n 5 − S o l d e r ] 02 05 2009 17 08 2009 27 09 2009 29 09 2009 © Emerald Publishing Limited 2010 Emerald Publishing Limited Licensed re-use rights only Solders Alloys Mechanical properties of materials...

...‐sectioned samples using a scanning electron microscope. Furthermore, the wetting of the leads by the solder and thickness of the IMC layers were studied. © Emerald Group Publishing Limited 2004 Solders Soldering Mechanical properties of materials Drop‐point determination Tin‐lead Surface...

... of rate of simple shear‐strain and testing temperature, and creep parameters were evaluated to gain a better understanding of the parameters contributing to thermomechanical fatigue. © MCB UP Limited 2003 Soldering Joining processes Deformation Fatigue Mechanical properties of materials...