..., 2010). Mechanical testing Reliability management Standards Capacitors Metals © Emerald Group Publishing Limited 2011 This test includes numerous temperature cycling conditions, cycle times, and also many options for soak mode conditions. The test usually lasts 500 or 1,000...

...@npl.co.uk © Emerald Group Publishing Limited 2009 Adhesives Surface conductivity Solders Lead Reliability management Parts Tin‐lead solder has been used as the primary interconnection material by the electronics production industry for over 60 years. The introduction of European...

... 2009 Reliability management Failure (mechanical) Soldering Joining materials Solder joint reliability is one of the most critical issues for the structural integrity of surface mount electronics, especially for automotive and portable products. For micro‐ball grid array (μBGA...

... at: laura.frisk@tut.fi © Emerald Group Publishing Limited 2009 Adhesives Substrates Joining materials Reliability management Liquid crystal polymers The popularity of flip chip technology in electronics packaging has increased due to the trend for lower cost, finer pitch, higher electrical...

... Finite element analysis Reliability management Stress (materials) Predictive process The important factors for packaging technology are the cost of the integrated circuit (IC) package, and the impact of the package on the circuit and system performance and on the reliability of the package...

... the reliability as they act as a site for crack propagation. M. Reid can be contacted at: michael.reid@ul.ie © Emerald Group Publishing Limited 2008 Solder Alloys Reliability management Figure 1 The Sn‐rich portion of the currently accepted ternary phase diagram showing...

... for second‐level solder interconnections of LTCC module are given. Olli Nousiainen can be contacted at: olli.nousiainen@me.oulu.fi © Emerald Group Publishing Limited 2007 Solders Reliability management Low temperature co‐fired ceramic (LTCC) technology is nowadays an essential part...

... Soldering Reliability management Applications of lead‐free solders are increasing in electronics assembly and packaging due to environmental concerns. Sn‐Ag‐Cu‐based solders are especially popular for the replacement of conventional Sn‐37 wt%Pb (hereafter, Sn‐37%Pb) alloy. Considerable research...

... Limited 2006 Adhesives Polymers Substrates Reliability management No delamination was found in the test samples showing failure at high temperatures. An increase in resistance at high temperatures during a temperature cycling test may be caused by relaxation of the compressive forces...

... chip attachment is their thermal cycling reliability (Kwon et al., 2005). Adhesives Substrates Joining materials Reliability management © Emerald Group Publishing Limited 2006 To study the reliability of the test lots a temperature cycling test was used. The test...

... with the initial structure and the fatigue life can be greatly enhanced. Originality/value The suggested approach is very useful for fleXBGA assembly design. The reliability of the package can be greatly improved by using the modified geometric parameters. Finite element analysis Reliability management...

... of the underlying core material. Such failure is going to be more prevalent with decreasing pad size and is potentially a limiting factor to decreasing interconnection pitch. Solders Joining processes Reliability management Electronic engineering With portable and hand‐held electronic products...

... Stress (materials) Reliability management Ball grid array (BGA) packages are used widely for electronic devices due to their numerous advantages, such as higher pin count, smaller size, lower switching noise, larger pitch, higher assembly yield, etc. However, reliability problems can still occur...

... be eliminated almost completely by using AgPt metallization instead of AgPd metallization in the present test module structure. © Emerald Group Publishing Limited 2005 Solders Joining processes Modelling Ceramics Reliability management Low temperature co‐fired ceramic (LTCC) modules...

... on the PCB and component sides was found to be relatively high in all cases. Soldering Strength of materials Surface properties of materials Fatigue Reliability management In recent years, responding to the demands of the market, portable electronic products, such as cellular phones...

...) with an ENIG finish. © Emerald Group Publishing Limited 2005 Solders Joining processes Reliability management Strength of materials The USS for the two alloys after 1,200 cycles of each of the six thermal cycling regimes are given in Table IV . The numbers in brackets...

... is largely determined by its prior thermal history. The mechanical properties that influence performance are the following. Reliability Reliability management Solders Modelling The die is cast! Lead‐free solders are being introduced at different rates across the world. Japan is ahead...

... solder bumps. In addition, a novel idea to increase the joint reliability is studied. © MCB UP Limited 2003 Solder Substrates Reliability management Flip chip (FC) components on organic substrates require the use of an epoxy encapsulant (underfill) to guarantee thermomechanical...