... and humidity stress test, according to standard JESD22‐A110 C (JEDEC Standard, 2009a), would be another possibility, since it usually activates the same failure mechanisms as the 85/85 test: © Emerald Group Publishing Limited 2011 Mechanical testing Reliability management Standards Capacitors...

... 2009 Reliability management Failure (mechanical) Soldering Joining materials Solder joint reliability is one of the most critical issues for the structural integrity of surface mount electronics, especially for automotive and portable products. For micro‐ball grid array (μBGA...

... in Table II . Ling Zou can be contacted at: ling.zou@npl.co.uk © Emerald Group Publishing Limited 2009 Adhesives Surface conductivity Solders Lead Reliability management Parts Tin‐lead solder has been used as the primary interconnection material by the electronics...

... of the traditional WLP and enhance its reliability, the restriction of the WLP with high I/O density during the assembly remains. Kuo‐Ning Chiang can be contacted at: knchiang@pme.nthu.edu.tw © Emerald Group Publishing Limited 2009 Packaging Finite element analysis Reliability management...

... of the substrate. It is also seen that the substrate used influences the failure mechanisms formed during thermal cycling testing. Laura Frisk can be contacted at: laura.frisk@tut.fi © Emerald Group Publishing Limited 2009 Adhesives Substrates Joining materials Reliability management Liquid...

... the reliability as they act as a site for crack propagation. M. Reid can be contacted at: michael.reid@ul.ie © Emerald Group Publishing Limited 2008 Solder Alloys Reliability management Figure 2(a) and (d) shows DSC curves for both heating and cooling for SAC105, SAC205, SAC305...

... Reliability management Figure 8 shows the shear strength of 1608 capacitor joints bonded with Sn‐Bi plated Sn‐3.5%Ag solder. The thermal cycling exposure was – 40/+125°C, and the electroplated layer was Sn‐95.7%Bi which was plated at 2 A/dm² for between 1 and 3 min. The shear strength...

... for second‐level solder interconnections of LTCC module are given. Olli Nousiainen can be contacted at: olli.nousiainen@me.oulu.fi © Emerald Group Publishing Limited 2007 Solders Reliability management Low temperature co‐fired ceramic (LTCC) technology is nowadays an essential part...

... continue very long before the test samples also failed at high temperatures. © Emerald Group Publishing Limited 2006 Adhesives Polymers Substrates Reliability management Typically melt processable main chain thermotropic LCPs are used in flexible printed circuit board applications...

... thinned chips or reducing the thickness of the substrate. © Emerald Group Publishing Limited 2006 Adhesives Substrates Joining materials Reliability management The use of anisotropic conductive adhesives (ACA) in flip chip interconnection technology has gained a great deal...

..., temperature ramp rate and dwell time. Finite element analysis Reliability management Solders Electronics industry Optimization techniques fleXBGA™ (Darveaux and Mawer, 1998) is a chip scale package introduced by Amkor. An assembled height of 1.0 mm and a ball pitch of 0.8 mm make this package...

..., both graphically on the screen, and as printed reports. © Emerald Group Publishing Limited 2006 Solders Joining processes Reliability management Electronic engineering With portable and hand‐held electronic products advancing rapidly towards miniaturization and lightweight...

... Limited 2005 Soldering Strength of materials Surface properties of materials Fatigue Reliability management In recent years, responding to the demands of the market, portable electronic products, such as cellular phones, camcorders, and pagers, have been noticeably miniaturized, while...

... test conditions (i.e. cycling temperature range: −40‐125°C). These failure modes can be characterised as: Solders Joining processes Modelling Ceramics Reliability management © Emerald Group Publishing Limited 2005 Mode I: cracking in the ceramic module. Mode...

... are rectangular coordinates which have their origin at the crack tip. © Emerald Group Publishing Limited 2005 Soldering Stress (materials) Reliability management Ball grid array (BGA) packages are used widely for electronic devices due to their numerous advantages, such as higher pin count...

.... Therefore, this work concentrated on failures and failure modes within these component types, as these are the structures most likely to fail first in field use. Solders Joining processes Reliability management Strength of materials Electronics assemblies are manufactured from a range...

... Reliability Reliability management Solders Modelling The die is cast! Lead‐free solders are being introduced at different rates across the world. Japan is ahead; for Europe, 1 July 2006 has been set as the deadline for the transition, and the US is making rapid progress towards this goal...

... there is also practically no change in the solder bump reliability. © MCB UP Limited 2003 Solder Substrates Reliability management Flip chip (FC) components on organic substrates require the use of an epoxy encapsulant (underfill) to guarantee thermomechanical reliability. Nowadays...