... of high integration and low-temperature packaging of devices and provide references for the application of composite solder joints. Design/methodology/approach Sn58Bi and SAC0307 solder paste was mechanically mixed in different proportions to prepare Sn58Bi-xSAC0307/ENIG solder joints. The thermal...

...Chun-Sheng Chen; Hai Wang; Yung-Chin Kao; Po-Jen Lu; Wei-Ren Chen Purpose This paper aims to establish the predictive equations of height, area and volume of printed solder paste during solder paste stencil printing (SPSP) process in surface mount technology (SMT) to better understand the effect...

... to simulating solder paste in the jetting regime, no previous work could be found. In this study, a novel simulation framework was used with the aim of simulating the deposition of individual and multiple solder paste deposits in the aggregate on a substrate. This manner of modelling could not only be used...

... solder pastes. Design/methodology/approach The solder pastes investigated are of SAC305 type, Innolot type or they are especially formulated by the manufacturers on the base of (SnAgCu) alloys with addition of some alloying elements such as Bi, In, Sb and Ti to provide low-void contents. The SnPb...

...Norliza Ismail; Azman Jalar; Maria Abu Bakar; Roslina Ismail; Najib Saedi Ibrahim Purpose The purpose of this paper is to investigate the wettability and intermetallic (IMC) layer formation of Sn-3.0Ag-0.5Cu (SAC305)/CNT/Cu solder joint according to the formulation of solder paste because...

... at interface or shortcoming of the reflow process. The voids hinder the heat conduction path and subsequently, the thermal resistance will increase. The purpose of this paper is to investigate the influence of lead-free water-washable Sn96.5Ag3.0Cu0.5 (SAC305) solder paste (SP) voids on the thermal and optical...

...Tareq I. Al-Ma’aiteh; Oliver Krammer Purpose The purpose of this paper is to present the establishment of a computational fluid dynamics model for investigating different non-Newtonian rheological models of solder pastes by simulating solder paste viscosity measurement. A combined material model...

... 9.55 54.87 Yunzhu Ma can be contacted at: zhuzipm@csu.edu.cn Microstructure Solder Mechanical properties Solder paste Lead-free Sn-20In-2.8Ag Because of human health and environmental issues, policy and legislation restrictions regarding the use of certain hazardous...

... on the rheology of the solder paste. The data obtained experimentally are fundamental for the development of numerical models that allow the simulation of the printing process of printed circuit boards (PCB). Design/methodology/approach Rheological tests were performed using the Malvern rheometer Bohlin CVO...

... and reliability. The purpose of this paper is to study thermal and optical characteristics of ThinGaN (UX:3) white LED mounted on SinkPAD by three types of solder paste (SP): No-Clean SAC305 (SP1), Water-Washable SAC305 (SP2) and No-Clean Sn42/Bi57.6/Ag0.4 (SP3). Design/methodology/approach Thermal transient...

...Kurian J. Vachaparambil; Gustaf Mårtensson; Lars Essén Purpose The purpose of the paper is to develop a methodology to characterize the rheological behaviour of macroscopic non-Brownian suspensions, like solder paste, based on microstructural evolution. Design/methodology/approach A structure...

... after 1.0 per cent nano-Cu added. Originality/value The paper demonstrates a method of nano-composite solder paste preparation by means of mechanical mixing and a comparison study of the microstructure evolution of composite solder with the basic SAC solder. Figure 2 shows the SEM micrographs...

...Oliver Krammer; Benjámin Gyarmati; András Szilágyi; Richárd Storcz; László Jakab; Balázs Illés; Attila Géczy; Karel Dušek Purpose A measurement method has been developed to reveal the viscosity change of solder pastes during stencil printing. This paper aimed to investigate thixotropic behaviour...

...Martin Hirman; Frantisek Steiner Purpose The purpose of this paper is to find an optimum between the quantity of solder paste and the desired properties of the soldered joint. A reduction of solder paste quantity is recognized as an opportunity to save money. On the other hand, the quantity...

...Oliver Krammer; Bertalan Varga; Karel Dušek Purpose This paper aims to present a new method to calculate the appropriate volume of solder paste necessary for the pin-in-paste (PIP) technology. By the aid of this volume calculation, correction factors have been determined, which can be used...

... in the production of the fluxes. It was found that WSRF 09 and WSRF 04 gave the best performance with the lead-free Sn-0.7Cu solder alloy in terms of good solderability, low halide content (less than 1,500 ppm), high insulation resistance and low corrosion. These fluxes were applied to produce solder pastes with Sn...

... performance of solder paste in the stencil printing process is highly dependent on material properties such as viscosity and surface tension together with process parameters such as squeegee angle and squeegee speed. In order to investigate the effects of process parameters on the filling performance...

...K. Bukat; J. Sitek; M. Kościelski; M. Jakubowska; M. Słoma; A. Młożniak; W. Niedźwiedź Purpose The purpose of this paper is to study the manufacturing of SAC 305 solder paste with multiwall carbon nanotubes (MWCNT) before and after structure modification and also to investigate the added carbon...

...Chien‐Yi Huang; Yueh‐Hsun Lin; Kuo‐Ching Ying; Chen‐Liang Ku Purpose The purpose of this paper is to comprehensively explore the effects of critical parameters on solder deposition and to establish a systematic approach for determining guidelines for solder paste inspection (SPI) workstations...

...K. Bukat; M. Kościelski; J. Sitek; M. Jakubowska; A. Młożniak Purpose The purpose of this paper is to investigate the influence of silver nanoparticle additions on the wetting properties of Sn‐Ag‐Cu (SAC) solder paste. In this investigation, the basic solder paste contained 85 wt.% of commercial...