...Duncan Camilleri Purpose Power electronics are usually soldered to Al₂‐O₃ direct‐bond‐copper (DBC) substrates to increase thermal diffusivity, while at the same time increasing electrical isolation. However, soldering gives rise to inherent residual stresses and out‐of‐plane...

... into the Sn‐3.8Ag‐0.7Cu (SAC) solder paste. The dissolution behavior of Cu substrate is studied for SAC and Mo nanoparticles added SAC solders. The IMCs and its microstructure between the solder and substrate are analyzed by using conventional scanning electron microscope (SEM) and field emission SEM...

...K. Bukat; J. Sitek; M. Kościelski; Z. Moser; W. Gąsior; J. Pstruś Purpose The purpose of this paper is to investigate the influence of Bi additions on the wetting properties of SnZn7Bi alloys (Bi=1 and 3 per cent by mass) on a copper substrate and printed circuit boards (PCBs) with lead‐free...

...Kati Kokko; Laura Frisk; Pekka Heino Purpose The purpose of this paper is to study the effect of conformal coating on the thermal cycling reliability of anisotropically conductive adhesive film (ACF) joined flip chip components on FR‐4 and polyimide (PI) substrates. Design/methodology/approach...

...Guangcheng Dong; Xu Chen; Xinjian Zhang; Khai D.T. Ngo; Guo-Quan Lu Purpose The purpose of this paper is to study the phenomenology of Al₂O₃-DBC substrate thermal-cracking under different high temperature cyclic loadings. The extremely low cycle fatigue (ELCF) life prediction...

...Laura Frisk; Anne Cumini Purpose The purpose of this paper is to investigate the effect of substrate material and thickness on the thermal cycling reliability of flip chip joints assembled with anisotropic conductive adhesives (ACA). Design/methodology/approach Four test lots are assembled...

...Guangcheng Dong; Guangyin (Thomas) Lei; Xu Chen; Khai Ngo; Guo‐Quan Lu Purpose Direct‐bond‐copper (DBC) substrates crack after about 15 thermal cycles from −55 to 250°C. The purpose of this paper is to study the phenomenology of thermal‐cracking to determine the suitability of DBC for high...

...Z.W. Zhong; P. Arulvanan; Hla Phone Maw; C.W.A. Lu Purpose The purpose of this paper is to present the results of experiments performed to attach silicon dies (chips) to low‐temperature co‐fired ceramic (LTCC) substrates with Ag or AgPd pads using SnAgCu or SnPb solder and the results...

... © Emerald Group Publishing Limited 2006 --> Substrates Solders DEK develops solution for high throughput singulated substrate processing Keywords: Substrates, Solders Once again, DEK has developed a mass imaging solution that delivers higher throughput, amazing...

...Laura Frisk; Anne Cumini Purpose The purpose of this study is to investigate the reliability of flip chip joints made with anisotropic conductive adhesives (ACA) on flexible polyimide (PI) and liquid crystal polymer (LCP) substrates. Design/methodology/approach Six test series using two ACAs...

...Laura Frisk; Kati Kokko Purpose The purpose of this study is to investigate the effect of chip and substrate thickness on the thermal cycling reliability of flip chip joints assembled with anisotropic conductive adhesives (ACA) on FR‐4 substrates. Design/methodology/approach Four test lots...

...T. Alander; I. Suominen; P. Heino; E. Ristolainen The solder joint reliability of FC components on organic substrates is questionable unless underfill is used to relieve the thermal strains. Besides the mechanical protection, underfill provides the solder and I.C. surface with protection against...