... tensile strength at high operating power, 40 s (45.5 MPa), was 44.9% greater than that at medium operating power, 80 s (31.4 MPa). Originality/value Microwave parameters with the influence of Si wafer in MHH in soldering have been developed and optimized. A microwave temperature profile...

... the mechanical properties of the eutectic tin–silver (Sn-Ag) such as tensile strength, plasticity and creep resistance by adding different concentrations of Ni content. Design/methodology/approach Ternary melt-spun Sn-Ag-Ni alloys were investigated using x-ray diffractions, scanning electron microscope...

... and thermal cycling reliability compared with the standard SAC105 alloy. Dhafer Abdul Ameer Shnawah can be contacted at: dhafer_eng@yahoo.com © Emerald Group Publishing Limited 2012 Alloys Tensile strength Iron SAC105 alloy Fe addition Bulk alloy Microstructure Tensile properties...

..., and their tensile properties, were also characterized and discussed. © Emerald Group Publishing Limited 2012 Solders Alloys Tensile strength Low‐silver IMC Thermal aging Thickness Fracture mode Lead‐free Packaging In conjunction with the increase in awareness of environmental issues...

... (SnAg), as determined on the boards. Pull testing was adopted to evaluate the tensile strength of the four solders using an STR–1000 micro‐joint strength tester. Findings The tensile force of the QFP micro‐joints increased as laser intensity increased when it was less than an “optimal” value...

.../approach The solder was prepared by a vacuum arc furnace. Scanning electron microscopy (SEM) and X‐ray diffraction were used to identify the microstructure and composition. The melting temperature, microhardness and tensile strength were measured. Solder joints were prepared by reflowing at 250°C for 1...

...M. He; N. De Leon; V.L. Acoff Purpose The purpose of this paper is to investigate a Pb‐free solder alternative, specifically the effect of Bi on the microstructure and tensile strength of Sn‐3.7Ag solders casted under different cooling rates. Design/methodology/approach Sn‐3.7Ag solder paste...

... experiences a marked increase, and the dissolved Cu exists in the forms of a solid solution and Cu‐rich particles at the grain boundary. Because of the higher strain rate and more dissolved Cu in the solder bulk with the reducing SOH, the ultimate tensile strength of solder joints is enhanced. When the SOH...

...Ju Guo‐kui; Wei Xi‐cheng; Sun Peng; Liu Johan Purpose The purpose of this paper is to compare the growth kinetics of interfacial intermetallic compound (IMC) layer and its effect on the tensile strength of two solder (Sn3.0Ag0.5Cu and Sn0.4Co0.7Cu) joints. Design/methodology/approach...