...Le Lei; Bing Lei; Lingbo Li Purpose This study aims to investigate the reliability of solder joints in a NOR Flash device with joint errors under thermal cycling loads. Design/methodology/approach A numerical analysis using the finite element method was conducted in this study. Four...

...Fang Liu; Zhongwei Duan; Runze Gong; Jiacheng Zhou; Zhi Wu; Nu Yan Purpose Ball grid array (BGA) package is prone to failure issues in a thermal vibration-coupled environment, such as deformation and fracture of solder joints. To predict the minimum equivalent stress of solder joints more...

...Zhang Liang Purpose The purpose of this study is the formation and growth of nanoscale intermetallic compounds (IMCs) when laser is used as a heat source to form solder joints. Design/methodology/approach This study investigates the Sn/Cu and Sn-0.1AlN/Cu structure using laser soldering under...

...Jiacheng Zhou; Jinglin Shi; Lei Xu; Fuwen Zhang; Zhigang Wang; Qiang Hu; Huijun He Purpose The reliability of solder joints is closely related to the growth of an intermetallic compound (IMC) layer between the lead-free solder and substrate interface. This paper aims to investigate the growth...

...Paulina Araújo Capela; Maria Sabrina Souza; Sharlane Costa; Jose C. Teixeira; Miguel Fernandes; Hugo Figueiredo; Isabel Delgado; Delfim Soares Purpose In a printed circuit board assembly (PCBA), the coefficient of thermal expansion (CTE) mismatch between the solder joint materials has...

... network are used to validate the accuracy of ML models. Findings Integrated physical and ML models synergistically can accurately predict reflow profiles of solder joints and alleviate the expense of repeated trials. Using this system, the reflow oven temperature settings to achieve the desired reflow...

...Supriyono; Tzu-Chia Chen; Lis M. Yapanto; Zagir Azgarovich Latipov; Angelina Olegovna Zekiy; Lyubov A. Melnikova; Lakshmi Thangavelu; A. Surendar; Nikolay I. Repnikov; Zeinab Arzehgar Purpose In this paper, a lifetime estimation model for the solder joint is proposed which is capable...

... to form full Cu₃Sn joint. After bonding, the samples were cooled to room temperature in the air. To observe the microstructure evolution of interfacial IMC at the liquid Sn/solid Cu metallization interface, the cross-sectional Cu/IMC-Cu/Cu solder joints were deeply etched with 5 mL vol.% HCl...

...Hao Zou; Fang Xie; Bo Du; G. Kavithaa Purpose The purpose of this paper is to find the optimum inverter type as the solder joint reliability point of view. Design/methodology/approach In this paper, finite element model(ing) simulations supported with power cycling aging experiments were used...

...). In addition to the electrical aspect of the BGA electronic package such as minimizing electrical parasitic components, mechanical fatigue reliability of the BGA solder joints under several and severe random vibrations caused by road roughness was paramount of importance and has to be considered in lifetime...

... solder was a better choice under simultaneous application of thermal and power loadings. The experimental results also confirmed the finite element simulation and indicated that the solder joint reliability strongly depends on the geometry of interconnection in different operating conditions...

...Maciej Sobolewski; Barbara Dziurdzia Purpose The purpose of the paper is to experimentally evaluate the impact of voids on thermal conductivity of a macro solder joint formed between a copper cylinder and a copper plate by using reflow soldering. Design/methodology/approach A model...

...Fang Liu; Jiacheng Zhou; Nu Yan Purpose The purpose of this paper is to study the drop reliability of ball-grid array (BGA) solder joints affected by thermal cycling. Design/methodology/approach The drop test was made with the two kinds of chip samples with the thermal cycling...

...Barbara Dziurdzia; Janusz Mikolajek Purpose The purpose of this paper is to evaluate selected methods of reduction voidings in lead-free solder joints underneath thermal pads of light-emitting diodes (LEDs), using X-ray inspection and Six Sigma methodology. Design/methodology/approach...

...Dr Agata Skwarek; Janusz Borecki; Tomasz Serzysko Purpose – The purpose of this paper is to determine the dependence of mechanical strength of solder joints on printed circuit boards from the soldering process parameters and operating conditions of the electronic device. Design/methodology...

..., the issues that have to be taken into consideration during the planning of a PoP system assembly procedure are presented. Solder joints PoP technology SMT Soldering profiles It was observed that the temperature differences, ΔT, below PoP and TMV PoP components were only around 6°C for the same...

...Dr Agata Skwarek; Janusz Sitek; Aneta Araźna; Kamil Janeczek; Wojciech Stęplewski; Krzysztof Lipiec; Konrad Futera; Piotr Ciszewski Purpose – The purpose of this paper is to evaluate the reliability of solder joints made on long FR-4 and metal core printed circuit boards using the accelerated...

...Jibing Chen; Yanfang Yin; Jianping Ye; Yiping Wu Purpose – The purpose of this paper is to investigate the thermal fatigue behavior of a single Sn-3.0Ag-0.5Cu (SAC) lead-free and 63Sn-37Pb (SnPb) solder joint treated by rapidly alternating heating and cooling cycles. Design/methodology...

...Huihuang Zhao; Yaonan Wang; Zhijun Qiao; Bin Fu Purpose – The purpose of this paper is to develop an improved compressive sensing algorithm for solder joint imagery compressing and recovery. The improved algorithm can improve the performance in terms of peak signal to noise ratio (PSNR) of solder...

... miniaturization, meanwhile, requires much smaller solder joints and fine-pitch interconnections for microelectronic packaging in electronic devices which demand better solder joint reliability of SAC solder Although many studies have been done based on the SAC solder, a review based on the important...