Issues

Appointments

Kent Ang to lead DEK's electroform and platinum stencil production in Asia

View articletitled, Kent Ang to lead DEK's electroform and platinum stencil production in Asia
Add to Citation Manager for Kent Ang to lead DEK's electroform and platinum stencil production in Asia

David Byrd appointed Global Manager for Engineered Products

View articletitled, David Byrd appointed Global Manager for Engineered Products
Add to Citation Manager for David Byrd appointed Global Manager for Engineered Products

Exerra appoints four North American reps

View articletitled, Exerra appoints four North American reps
Add to Citation Manager for Exerra appoints four North American reps

An investigation into the rheological properties of different lead‐free solder pastes for surface mount applications

S. Mallik; N.N. Ekere; R. Durairaj; A.E. Marks
View articletitled, An investigation into the rheological properties of different lead‐free solder pastes for surface mount applications
Open the PDF for in another window
Add to Citation Manager for An investigation into the rheological properties of different lead‐free solder pastes for surface mount applications

Reliability test and failure analysis of high‐density packages assembled with a low‐temperature lead‐free solder (SnBiAg)

John Lau; Jerry Gleason; Valeska Schroeder; Gregory Henshall; Walter Dauksher; Bob Sullivan
View articletitled, Reliability test and failure analysis of high‐density packages assembled with a low‐temperature lead‐free solder (SnBiAg)
Open the PDF for in another window
Add to Citation Manager for Reliability test and failure analysis of high‐density packages assembled with a low‐temperature lead‐free solder (SnBiAg)

Design, materials, and assembly process of high‐density packages with a low‐temperature lead‐free solder (SnBiAg)

John Lau; Jerry Gleason; Valeska Schroeder; Gregory Henshall; Walter Dauksher; Bob Sullivan
View articletitled, Design, materials, and assembly process of high‐density packages with a low‐temperature lead‐free solder (SnBiAg)
Open the PDF for in another window
Add to Citation Manager for Design, materials, and assembly process of high‐density packages with a low‐temperature lead‐free solder (SnBiAg)

Reliability study of surface mount printed circuit board assemblies with lead‐free solder joints

Jeffery C.C. Lo; B.F. Jia; Z. Liu; J. Zhu; S.W. Ricky Lee
View articletitled, Reliability study of surface mount printed circuit board assemblies with lead‐free solder joints
Open the PDF for in another window
Add to Citation Manager for Reliability study of surface mount printed circuit board assemblies with lead‐free solder joints

Exhibition and conferences

EIPC Conference Rome 24 and 25 January 2008

John Ling
View articletitled, EIPC Conference Rome 24 and 25 January 2008
Add to Citation Manager for EIPC Conference Rome 24 and 25 January 2008

Industry news

Marantz UK user group meeting puts new AOI software through its paces

View articletitled, Marantz UK user group meeting puts new AOI software through its paces
Add to Citation Manager for Marantz UK user group meeting puts new AOI software through its paces

Successful campaign for BSI committee members

View articletitled, Successful campaign for BSI committee members
Add to Citation Manager for Successful campaign for BSI committee members

A technology road map for the PCB industry

View articletitled, A technology road map for the PCB industry
Add to Citation Manager for A technology road map for the PCB industry

IPC releases Revision B of IPC-7711/7721

View articletitled, IPC releases Revision B of IPC-7711/7721
Add to Citation Manager for IPC releases Revision B of IPC-7711/7721

OK International announces European price reductions

View articletitled, OK International announces European price reductions
Add to Citation Manager for OK International announces European price reductions

Siplace future proofs TTems UK growth

View articletitled, Siplace future proofs TTems UK growth
Add to Citation Manager for Siplace future proofs TTems UK growth

Conductive Inkjet Technology to install first Metaljet 6000 system and offer a contract manufacturing service from Cambridge UK

View articletitled, Conductive Inkjet Technology to install first Metaljet 6000 system and offer a contract manufacturing service from Cambridge UK
Add to Citation Manager for Conductive Inkjet Technology to install first Metaljet 6000 system and offer a contract manufacturing service from Cambridge UK

International diary

International diary

View articletitled, International diary
Add to Citation Manager for International diary

New products

Automated Bonded Wafer Inspection Tool from Sonoscan

View articletitled, Automated Bonded Wafer Inspection Tool from Sonoscan
Add to Citation Manager for Automated Bonded Wafer Inspection Tool from Sonoscan