... exhibits significant axial protrusion under high-temperature storage, with protrusion height increasing continuously with holding time. Finite element analysis indicates that TSV protrusion is caused by the combined effects of plastic deformation during heating and time-dependent creep deformation during...

... Finite element modelling (FEM) Stress analysis Finite element analysis Taguchi method Solder joint reliability 3D IC package With the advent of the big data era, the Internet and information industries have entered a period of rapid development, which puts higher demands on electronic...

... cyclic loading Substrate soldering processes Finite element analysis © Emerald Group Publishing Limited 2012 The soldering process was modelled via an uncoupled thermo‐elastoplastic analysis. It was assumed that the temperature across the assembly was uniform and that every point...

... the cross‐sections of the solder interconnections cut along the diagonal of the packages. As each sample contained eight solder interconnections on the diagonal of the package, each reported crack length measurement is an average value of 32 measurements. Finite element analysis (FEA) was conducted...

... in practical electronics industry applications. In the meantime, the reason for the superior reliability of SnAgCuCe solder joints can be explained from the property and microstructural point‐of‐view. Solder Alloys Finite element analysis Creep Metals Mechanical behaviour of materials Many...

... an appropriate bonding temperature at the Au‐Sn interface, it is necessary to obtain an appropriate balance between the temperature of the bonding tool and the temperature of the stage, respectively. Bonding Finite element analysis Temperature distribution Joining processes Recent years have...

... of the traditional WLP and enhance its reliability, the restriction of the WLP with high I/O density during the assembly remains. Kuo‐Ning Chiang can be contacted at: knchiang@pme.nthu.edu.tw © Emerald Group Publishing Limited 2009 Packaging Finite element analysis Reliability management...

...Johan Liu; Daoqiang Lu; Cristina Andersson; S. Chen; P. Sun; X.C. Wei; Z.N. Cheng; J. Liu Purpose The purpose of this paper is to fit Coffin‐Manson equation of Sn‐4.0Ag‐0.5Cu lead free solder joint by using results of solders joint reliability test and finite element analysis. Also to present...

... alloys. J. Liu can be contacted at: jliu@chalmers.se © Emerald Group Publishing Limited 2009 Lead Solders Thermal testing Stress (materials) Finite element analysis Modelling Owing to environmental concerns, the requirement for lead‐free manufacturing is now a worldwide...

... with Pb‐free solder joints. © Emerald Group Publishing Limited 2009 Joining processes Solder Finite element analysis In the surface mount technology developed for electronic packaging, eutectic Sn‐Pb alloy has been widely adopted in the assembly of devices to the substrate. However...

...Christopher Bailey; Johan Liu; Gang Chen; Xu Chen Purpose To provide an approach to fleXBGA design and reliability analysis. Design/methodology/approach A two‐dimensional (2D) plane strain finite element analysis model is established to simulate the thermo‐mechanical behaviour of fleXBGAs...

... loops for individual samples measured in the experimental process. For this more quantitative 3D simulation work, data from several experiments was collected and an averaging method was adopted to improve the accuracy of the data. © Emerald Group Publishing Limited 2006 Finite element...

... temperature profiles and locations directly affect the stress level and hence, the reliability of the ACF in the FC assembly. Figure 1 (a) The ACF and SMT components assembly; and (b) the aluminium protective cover with cavity Stress (materials) Finite element analysis Electronic...

... of cracks in the ICA joints were investigated with scanning electron microscopy. A linear elastic finite element analysis has been performed to analyse the stress distribution in the ICA joint and correlate the critical stress concentrations with the observed crack initiation sites. The effect of joint...

... Group Publishing Limited 2004 Solder Soldering Tin‐lead Design for quality Printed‐circuit boards Finite element analysis On 10 October 2002, the European Union (EU) Parliament and the EU Council of Ministers reached an agreement on a text for the Waste Electrical and Electronic...

... for the package centre, and Uz=0 for all of the nodes in the z‐symmetrical plane. © MCB UP Limited 2003 Flip chip Fatigue Solder joints Finite element analysis Most future electronics applications will require increased reliability and performance as well as lower cost...

... strength of plastic ball grid array (PBGA) packages. An effective thickness is identified for the 2‐D finite element analysis. By using this effective thickness as a scale factor, it is shown that the 2D model is feasible for the study of 3‐D problems. The computational model is validated by experimental...

... and/or the service environment. © MCB UP Limited 2001 Conductive film Solder bumps Flip chip on board Finite element analysis Anisotropic conductive film (ACF) is a form of conductive adhesive with conductive particles carefully arranged in a suitable array on a resin film. The usual...

... by thermal cycling of actual components. © MCB UP Limited 1997 Solder joint CAM Reliability Finite element analysis Strain The aim of the current research is to develop a methodology to enable the service lives of soldered joints in electronic assemblies to be predicted under different...