...) and deposition time (EP) significantly affected surface roughness. Additionally, the intermetallic compound (IMC) thickness for NAC305/ENEPImAg was found to be thinner (0.6 µm) than that of SAC305/ENImAg (1.6 µm), which correlates with improved solder joint quality. Originality/value This research presents...

...Asyraf Abdullah; Siti Rabiatull Aisha Idris Purpose This study aims to review the effect of copper percentage in Sn-based solder alloys (Sn-xCu, x = 0–5 Wt.%) on intermetallic compound (IMC) formation and growth after laser soldering. Design/methodology/approach This study...

... content, the interfacial intermetallic compounds (IMCs) of the upper and lower interfaces of joints gradually changed from scallop-shaped Cu₆Sn₅ to wavy-shaped Cu₅Zn₈. Moreover, the IMC thickness of the upper/lower interface of joints first decreased...

... Electronic packaging IMC Thermal aging In this study, microstructural evolution and grain orientation of the full Cu₃Sn solder joint during isothermal aging at 420°C were systematically investigated. The following conclusions could be drawn: The original Cu₃Sn solder joint...

... is distributed with the fine (Cu,Ni)6Sn5 and Ag3Sn intermetallic compounds (IMCs), whereas the Cu6Sn5 and Sn3Sb2 in Cu/Sn–5Sb/Cu is larger and far more less. This investigation reveals that the addition of the Cu, Ni and Ag elements reinforced mechanical properties and provided a technical basis...

...Muhamad Zamri Yahaya; Nor Azmira Salleh; Soorathep Kheawhom; Balazs Illes; Muhammad Firdaus Mohd Nazeri; Ahmad Azmin Mohamad Purpose The purpose of this paper is to investigate the morphology of intermetallic (IMC) compounds and the mechanical properties of SAC305 solder alloy under different...

... using X-ray diffractions, scanning electron microscope, dynamic resonance technique, instron machine, Vickers hardness tester and differential scanning calorimetry. Findings The results revealed that the Ag₃Sn intermetallic compound (IMC) and ß-Sn have been refined because...

...Yun Liu; Weiyuan Yu; Xuemin Sun; Fengfeng Wang Purpose This paper aims to investigate the effect of ultrasonic vibration (USV) on the evolution of intermetallic compounds (IMCs), grain morphology and shear strength of soldered Ni/Sn/Ni samples. Design/methodology/approach The Ni/Sn/Ni joints...

...Jagjiwan Mittal; Kwang-Lung Lin Purpose This paper aims to study the diffusion of Zn, Ni and Sn in the liquid state during the reflow ageing of the Sn-Zn solder above its melting point on an Ni/Cu substrate in relation to the formation of intermetallic compounds (IMCs). Design/methodology...

...Zuozhu Yin; Fenglian Sun; Yang Liu; Yang Liu Purpose The purpose of this paper is to investigate growth kinetics of interfacial Cu-Sn intermetallic compound (IMC) at the solid Cu/liquid Sn interface. Design/methodology/approach The Sn/Cu solid–liquid interfacial IMCs are fabricated under...

...Xingchen Yan; Kexin Xu; Junjie Wang; Xicheng Wei; Wurong Wang Purpose The purpose of this paper is to comparatively investigate the microstructure and interfacial intermetallic compound (IMC) layer of Cu/SACPG/Ni and Cu/SAC0307/Ni solder joints after thermal aging. Design/methodology/approach...

... for intermetallic compound (IMC) characterization. The type of IMC formed was confirmed by field emission scanning electron microscope-energy-dispersive X-ray spectroscopy (FESEM-EDX). Findings The results showed that the IMC type changed from the combination of Ni₃Sn4 and (Ni, Cu)₃Sn4...

... peeling stress of the critical solder joint could be considered to be the dominant failure factor. On the other hand, the fracture of BGA lead‐free solder joints occurs at intermetallic compound (IMC) interface near the package side, and failure mode is brittle fracture. Originality/value...

... development. The growth behaviour of the interfacial IMC layers for Cu/SACBE/Cu and Cu/SAC/Cu joints and their bonding strengths after thermal aging at 150°C for 0, 24, 168 and 500 hours are investigated and the effects of adding elemental Bi and Er on the growth of interfacial IMC layers in the joints...