.... The microstructure, phase and thickness of the intermetallic compounds (IMCs) formed were determined after cross‐sectional metallographic preparation. Findings Cu₆Sn₅ and Cu₃Sn were observed at the as‐reflowed SAC305/Cu interfacial region. The IMC thicknesses increased...

... intermetallic compounds (IMCs) formed at the interfaces of the solder and the pads. As the temperature of the N2 atmosphere was increased above 100°C, almost all of the Au‐rich phases disappeared. More needle‐like AuSn4 IMCs formed at the interfaces, as compared with that in joints protected by a N2 atmosphere...

.... It was found that the Sn–4Ag–0.5Cu solder gave the worst results in terms of shear strength. The poor performance of the Sn–4Ag–0.5Cu solder can be explained based on its microstructure. The types of intermetallic compounds formed at the interface were different for different solder compositions. When...

... stage. The deterioration of solder ball shear strength was found to be mainly caused by the formation of intermetallic compound layers, together with microstructural coarsening and diffusion related porosity at the interface. For the ball pad metallurgy, two distinct intermetallic compound layer...

...J.G. Lee; F. Guo; K.N. Subramanian; J.P. Lucas The influence of the thermal reflow profile on the formation and resultant morphology of the intermetallic layer that developed at the Ni particle reinforcements within an eutectic Sn‐Ag composite solder matrix was investigated. The composite solder...

...Minna Arra; Dongkai Shangguan; Eero Ristolainen; Toivo Lepistö The wetting performance and intermetallic formation of a Sn/Ag/Cu alloy on printed circuit board (PCB) surfaces and on component terminations were studied in this work. Two different PCB surface finishes, immersion gold over electroless...

... of rework techniques is available, degradation in assembly reliability may accompany the process. The formation of brittle secondary intermetallic compounds following CSP rework can adversely affect the mechanical properties of the joint, particularly when they make up a significant proportion of its...

...I.K. Hui; H.W. Law In a properly wetted joining system, with tin/lead solder as the filler and copper as the base metals, a layer of intermetallic compounds is usually found at the interface of these two metals. This layer, mainly copper and tin, has profound effects on the joint’s properties...

..., 1996, 1997). © MCB UP Limited 1999 Reliability Lead‐free soldering Fatigue Intermetallics Crack propagation In electronic modules, solder joints are commonly used to interconnect electronic components to the electronic circuitry on the substrate. Solder interconnects perform...

...Chong Hua Zhong; Sung Yi Presents the results of a study of the effects of solder ball pad metallurgy, intermetallic compound (IMC) thickness and thermal cycling on the shear strengths of PBGA package solder balls. The study of the microstructures of solder balls revealed that only a very thin...

...Paul G. Harris; Kaldev S. Chaggar The role of intermetallics in soldered joints is ambivalent. They are an essential part of joints to common basis materials and at low levels they have a strengthening effect on solder alloys. At higher levels, however, it is well known that they can cause joint...