... temperature Joining processes Soldering Atmosphere Gold Tin Laser soldering Micro‐solder joints AuSn4 Intermetallics N2 atmosphere Reflow ...

... Janeczek can be contacted at: kamil.janeczek@itr.org.pl © Emerald Group Publishing Limited 2012 Mechanical properties of materials Stress (materials) Joining processes Additives RFID Chip assembly Carbon nanotubes Flexible substrate Mechanical durability CNT Radio‐frequency...

... is an alternative process with significant disadvantages regarding the robustness of the process and the resulting joint connection. © Emerald Group Publishing Limited 2012 Robots Soldering Assembly Optics Joining processes Resistance soldering Optics assembly Assembly automation Laser Self...

... different loading rates and temperatures. Gang Chen can be contacted at: agang@tju.edu.cn © Emerald Group Publishing Limited 2012 Joining processes Sintering Mechanical properties of materials Shear strength Nano‐silver paste Interconnect Single lap shear Temperature dependent...

... Soldering Joining processes Metals In order to meet the requirements of high I/O counts in high‐performance and high‐bandwidth applications, interconnect pitches have been continuously narrowed over time. The International Technology Roadmap for Semiconductor (ITRS, 2009) forecasts that fine...

... and mechanical properties of solder joints. Soldering Metals Mechanical properties of materials Joining processes In electronic assembly and electronic packaging, solder joints are commonly used to connect the electronic components with the substrate. In order to obtain good interconnections...

... solders as well as reliability investigation of lead‐free soldered joints. Song‐bai Xue can be contacted at: xuesb@nuaa.edu.cn © Emerald Group Publishing Limited 2011 Finite element simulation Soldering Joining processes Stress (materials) Silver Copper Chemical elements...

... does exist near 85 per cent in the range of 80‐95 per cent. The optimum degree of cure needs to be investigated further according to the mean time to degradation of joints in the following section. Flipchips Packaging Films (states of matter) Joining processes Nowadays, jointing...

... analysis Temperature distribution Joining processes Recent years have witnessed a continuous trend toward device miniaturization and enhanced product functionality in the consumer electronics field. Flat‐panel displays of various shapes and sizes are now used in a variety of portable, handheld...

... bond thickness variation in ACA assemblies. Guangbin Dou can be contacted at: g.dou@imperial.ac.uk © Emerald Group Publishing Limited 2010 Adhesives Assembly Bonding Joining processes Flipchips In Figures 7 and 8 , it can be seen that all of the resistance measurable...

.... This is because of the inherent deviation from the clamping apparatus and the consumption of the copper base by interfacial reactions in the reflow process. © Emerald Group Publishing Limited 2010 Tensile strength Mechanical behaviour of materials Soldering Joining processes...

... discoloured or mottled, with only a few retaining their original pristine condition (Figure 4). Lead Solder Joining processes Alloys Tin pest is the product of the allotropic transition that occurs in tin at 13°C when the body‐centred tetragonal structure (white tin) changes to the grey form...

... Group Publishing Limited 2010 Adhesion Moisture Joining processes Electronic engineering Product reliability Personal and portable electronic devices are constantly becoming more common. In this situation, miniaturization techniques are extremely important. One problem...

... of the soldering pads, grew into the solders, forming these large, thin plates. Yi‐Shao Lai can be contacted at: yishao_lai@aseglobal.com © Emerald Group Publishing Limited 2009 Soldering Joining processes Impact strength Surface tension Figure 2 Typical measured impact force...

...‐Manson equation of Sn‐4.0Ag‐0.5Cu solder joint with two‐points bending test. An effective and economical device was designed and applied. Finite element analysis Joining processes Soldering Stress (materials) Shear strength The mesh of the finite element model for test sample is shown...

... Group Publishing Limited 2009 Lead Soldering Joining processes Waves Hole‐fill and voiding have raised many concerns on the solder joint reliability (Shangguan, 2005) of the pin through‐hole components using lead‐free wave soldering processes (Arra et al., 2002...

... Figure 5 (a) The distribution of the incremental equivalent plastic strain for lead‐free solder joints within one temperature cycle; (b) curve of numerical convergence for the numbers of Pb‐free bumps in the local model of FE simulation Joining processes Solder Finite element analysis...

... temperature of the order of 100‐200°C and pressure in the range 1‐100 MPa for bonding (Seppala et al., 2003 , Frisk et al., 2006 , Wu et al., 2001). Printed circuits Joining processes Bonding Interfacial IMCs formed between the FPCB and the Sn‐layer were observed...

... © Emerald Group Publishing Limited 2008 Solders Tensile strength Surface mount technology Joining processes In 2000, the International Electronics Manufacturing Initiative recommended the ternary eutectic SnAgCu alloy as a representative of the eutectic Sn‐Pb alloy in surface...

... OK International announces four new soldering/ desoldering equipment packages Keywords: Soldering, Joining processes There are as additions to its MFR Series, and set new standards for flexibility, capability, reliability and value in high-performance rework equipment. Unique...