.... Specimens underwent isothermal aging treatment up to 500 h. Comparisons on IMC layer thickness, Bi microstructure evolution and shear strength evolution were systematically characterized and measured for pristine and In-doped solder joints. Findings IMC thickness rises with aging time for two...

... composed of Sn–Ag–Cu ( SAC )0307 and Zn mixed powder. Design/methodology/approach Cu/Al joints were fabricated using SAC0307-Zn composite solder under different ultrasonic loading durations. The interfacial microstructure, fracture morphology and shear strength of the joints were systematically...

... results, the optimal sintering layer thickness is determined, while also considering printing yield and economic feasibility. Subsequently, shear strength tests were conducted on shear specimen model and thermal shock testing ( TST ) along with C SAM (scanning acoustic microscopy) analysis were...

... in IMC grain refinement; further extension of the soldering time induced IMC coarsening. Correspondingly, the shear strength initially increases and then decreases, reaching a maximum of 79.0 MPa at 5 min, representing a 50.5% improvement compared to joints using pure Ni mesh/SAC305 composite solder...

..., incorporating in situ current stressing demonstrates that greater joint height leads to greater heat accumulation at identical current densities, resulting in monotonic degradation of shear strength with greater joint height. Simultaneously, greater joint height intensifies current crowding and strain...

... through shear strength testing at intervals up to 500 cycles. Fracture behavior and interfacial characteristics were examined. Finite element analysis ( FEA ) was used to model stress (von Mises), plastic strain and strain energy distribution within the solder joints, particularly focusing on the joint...

.... Design/methodology/approach In this study, ball solder joints with solder size ranging from 300 to 760 µm were prepared with solder compositions of Sn-58Bi and Sn-3.0Ag-0.5Cu by reflow soldering. The shear strength of solder joints was evaluated by bonding shear tester. The solder matrix and interfacial...

.... Among them, the shear strength of SnBi-20SAC solder joints at a reflow temperature of 150°C is approximately 37 MPa. As the reflow temperature increases to 250°C, the shear strength of solder joints increases to approximately 67 MPa. Originality/value This study provides a reference...

... Licensed re-use rights only MOSFET Thermal characteristics Soldering Reinforcements Titanium oxide Reliability Shear strength In the electronics sector, soldering technology is the most widely used way to make mechanical and electrical connections. Therefore, the quality of the solder...

... substrate, using AgCuTi and AgCu filler metals, has been conducted to elucidate the influence of brazing temperature and alloy composition on the shear strength of the brazed joints. Design/methodology/approach Brazing SLMed-Ti/TiB₂ in a vacuum using AgCuTi and AgCu filler metals, this study...

... were subjected to isothermal aging for 0, 200, 500, 1,000 and 2,000 h. The Sn–xCu solder alloy was fabricated through a powder metallurgy process. Findings Microstructure characterization showed that Cu addition resulted in fine and rounded shape of Cu–Sn–Ni particles. Shear strength of Sn...

..., there was no IMC layer at the Al interface, but there might be a Zn–Al solid solution layer. The shear strength of Cu/Al joints soldered at 180°C was only 15.01 MPa, but as the soldering temperature continued to increase, the shear strength of the Cu/Al joints increased rapidly. When the soldering temperature...

... to increase, and the shear strength of the Cu/Al joints decreased with increasing aging temperature and time. Compared with the as-received samples, the IMC thickness of the Cu interface of joints increased by 371.8% and the shear strength of the Cu/Al joints was reduced by 83.2% when the joints were aged...

... and then increased with increasing Zn-particle content. The shear strengths of joints increased with Zn-particle content, the shear strength of joints went to a maximum of 29.76 MPa when the Zn-particle content was 40%, an increase of 62.6% compared to joints without Zn particles. However, as the Zn-particle content...

... temperature, the shear strength of Cu/SACZ/Cu joints did not change significantly at first before 150ºC. When the aging temperature reached 150ºC, the shear strength of the joints decreased significantly; the shear strength of the joints was the smallest at 150ºC for 24 h, which was 39.4% lower than...

... for the research of micro solder joint reliability. This paper also aims to provide guidance for the selection of solder for third-generation semiconductor power device packaging. Design/methodology/approach The shear strength, plasticity, bulk solder hardness and creep performance of three kinds of micro...

...Lina Syazwana Kamaruzzaman; Yingxin Goh Purpose This paper aims to review recent reports on mechanical properties of Sn-Bi and Sn-Bi-X solders (where X is an additional alloying element), in terms of the tensile properties, hardness and shear strength. Then, the effects of alloying in Sn-Bi solder...

..., and the physical properties of composite solder, the microstructure and mechanical properties were evaluated. Design/methodology/approach In this study, the effect of different aging conditions on the intermetallic compound (IMC) layer growth and shear strength of Ni-modified MWCNTs reinforced SAC composite...

...Zhen Pan; Fenglian Sun Purpose The purpose of this paper is to design a novel die-attach composite joint for high-temperature die-attach applications based on transient liquid phase bonding. Moreover, the microstructure, shear strength, electrical property, thermal conductivity and aging property...

... and ball diameter on the mechanical property and fracture behavior of Sn-37Pb solder bumps were discussed. Findings With the increase of ball size, the same change tendency of shear strength with thermal shock cycles. The shear strength of the solder bumps was the highest after reflow...