.... Tensile creep behavior Lead-free solder Creep resistance Tin-lead solder Steady-state creep rate Alternative Pb-free solders such as Sn–0.7Cu, Sn–9Zn and tin-zinc-copper (Sn–Zn–Cu) alloy provide viable options with distinct advantages and limitations. Sn–0.7Cu is cost-effective and suitable...

...-use rights only Lead-free solder Microstructure Mechanical properties Indium addition Fuwen Zhang can be contacted at: zhangfuwen@aliyun.com and Qiang Hu can be contacted at: hqgrinm@163.com 11 11 2024 05 12 2024 09 12 2024 Figure 6 Enlarged...

...-use rights only Lead-free solder Strain rates Tensile properties Thermal aging Intermetallic compound (IMC) Universiti Malaya Faculty Research GPF001A-2023 Lead-free Sn-based solder alloys have been actively studied to replace lead-containing solder alloys. Lead-containing...

...Songtao Qu; Qingyu Shi; Gong Zhang; Xinhua Dong; Xiaohua Xu Purpose This study aims to address the problem of low-temperature wave soldering in industry production with Sn-9Zn-2.5 Bi-1.5In alloys and develop qualified process parameters. Sn–Zn eutectic alloys are lead-free solders applied...

... Publishing Limited Licensed re-use rights only Microstructure Mechanical properties Lead-free solder Isothermal aging Sn–Bi alloy National Natural Science Foundation of China 51875269 Postgraduate Research and Practice Innovation Program of Jiangsu Province SJCX23_2178...

...Fang Liu; Zilong Wang; JiaCheng Zhou; Yuqin Wu; Zhen Wang Purpose The purpose of this study is to investigate the effects of Ce and Sb doping on the microstructure and thermal mechanical properties of Sn-1.0Ag-0.5Cu lead-free solder. The effects of 0.5%Sb and 0.07%Ce doping on microstructure...

... Publishing Limited 2024 Emerald Publishing Limited Licensed re-use rights only Sn-Zn solder SMT Lead-free solder Industrial applications Restrictions on the use of leaded solders in many countries have led to numerous lead-free solders as alternatives for electronic chip packaging...

... 02 11 2023 21 11 2023 22 11 2023 © Emerald Publishing Limited 2023 Emerald Publishing Limited Licensed re-use rights only Optical module Self-propagating exothermic reaction Lead-free solder Residual stress Microstructure Thermal resistance With the rapid...

... Lead-free solder Interfacial reaction Sn–Bi–Zn Spreading phenomena Wetting kinetics For a long time, Sn–37Pb eutectic alloy solder has been widely used in the automotive industry, electronic industry and other fields because of its low cost, good mechanical properties, strong conductivity...

...Zilong Wang; JiaCheng Zhou; Fang Liu; Yuqin Wu; Nu Yan Purpose The purpose of this paper is to study the microstructure and properties of Sn-3.5Ag and Sn-3.5Ag-0.5Sb lead-free solder alloys with and without a rotating magnetic field (RMF). Design/methodology/approach Optical microscopy...

... mechanical properties. Yingxin Goh can be contacted at: gohyingxin@um.edu.my 24 06 2021 14 01 2022 09 03 2022 © Emerald Publishing Limited 2022 Emerald Publishing Limited Licensed re-use rights only Lead-free solder Tensile Fracture mode Shear strength Hardness Sn...

...Guang Chen; Yao-Feng Wu Purpose The purpose of this paper is to investigate the effect of titanium nitride (TiN) on microstructure and composition of 96.5Sn3Ag0.5Cu (SAC305) lead-free solder joints under a large temperature gradient. Design/methodology/approach In this paper, SAC305 lead-free...

... for the shear test is almost similar to the initial shear strength identification using the international standard IEC 62137-1-2 to determine the force or shear strength needed to break the solder joint (IEC, 2007). In the experiment, four types of lead-free solder paste were used. Table I shows...

... of applications in electronic industries. Due to the toxicity of the lead in the solder, lead-free solders were proposed to replace the lead-based solders. Sn-Ag-Cu solder family is one of the lead-free solders, which are proposed and considered as a potential replacement. Unfortunately, the Sn-Ag-Cu solder faces...

...Guang Chen; Jiqiang Li; Xinwen Kuang; Yaofeng Wu; Fengshun Wu Purpose The purpose of this paper is to investigate the effect of nickel-plated graphene (Ni-GNS) on the microstructure and mechanical properties of 96.5Sn3Ag0.5Cu (SAC305) lead-free solder joints before and after an electro-migration...

... Emerald Publishing Limited Licensed re-use rights only Microstructure Wettability Lead-free solder Microhardness Mn nanoparticles Sn–Ag–Cu (SAC) solders have been regarded as the most promising Pb-free solders for microelectronic packaging applications because of their environmental...

... of this paper is to investigate the relationship between tensile and nanoindentation tests toward the mechanical properties and deformation behavior of Sn-3.0Ag-0.5Cu (SAC305) lead-free solder wire at room temperature. Design/methodology/approach Tensile test with different strain rates of 1.5 × 10-4 s-1...

...Yung-Sen Lin; Shiau-Min Lin; Jian-Yi Li; Min-Chih Liao Purpose An investigation has been performed on the improved solder wettability of oxidized aluminum (Al) with lead-free solder (96.5Sn-3.5Ag) using Ar-H₂ plasmas. The lead-free solder wettability was raised from 62.2 per cent...

...Izhan Abdullah; Muhammad Nubli Zulkifli; Azman Jalar; Roslina Ismail Purpose The purpose of this paper is to investigate the relationship between microstructure and varied strain rates towards the mechanical properties and deformation behaviour of Sn-3.0Ag-0.5Cu (SAC305) lead-free solder wire...

... 30 10 2016 24 11 2016 © Emerald Publishing Limited 2017 Emerald Publishing Limited Licensed re-use rights only Lead-free solder Intermetallic compound Differential scanning calorimetry X-ray diffraction To form a quality joint between soldered components...