... author Ravikantha Prabhu prabhuravikantha@gmail.com 10 03 2026 04 04 2026 12 04 2026 © 2026 Emerald Publishing Limited 2026 Emerald Publishing Limited Licensed re-use rights only Tensile creep behavior Lead-free solder Creep resistance Tin-lead solder Steady-state...

... results in a gradual deviation from the eutectic point, thereby expanding the melting range of the solder. Consequently, the melting range widens with the increase of In content. According to the National Center for Manufacturing Science (NCMS) lead-free solder project, the acceptable melting range...

... 2024 19 06 2024 © Emerald Publishing Limited 2024 Emerald Publishing Limited Licensed re-use rights only Lead-free solder Strain rates Tensile properties Thermal aging Intermetallic compound (IMC) Universiti Malaya Faculty Research GPF001A-2023 Lead-free Sn...

...Songtao Qu; Qingyu Shi; Gong Zhang; Xinhua Dong; Xiaohua Xu Purpose This study aims to address the problem of low-temperature wave soldering in industry production with Sn-9Zn-2.5 Bi-1.5In alloys and develop qualified process parameters. Sn–Zn eutectic alloys are lead-free solders applied...

.... Microstructure Mechanical properties Lead-free solder Isothermal aging Sn–Bi alloy National Natural Science Foundation of China 51875269 Postgraduate Research and Practice Innovation Program of Jiangsu Province SJCX23_2178 Fengjiang Wang can be contacted at: fjwang@just.edu.cn...

...Fang Liu; Zilong Wang; JiaCheng Zhou; Yuqin Wu; Zhen Wang Purpose The purpose of this study is to investigate the effects of Ce and Sb doping on the microstructure and thermal mechanical properties of Sn-1.0Ag-0.5Cu lead-free solder. The effects of 0.5%Sb and 0.07%Ce doping on microstructure...

... countries have led to numerous lead-free solders as alternatives for electronic chip packaging and printed circuit board (PCB) connections (Ren et al., 2016). Sn-Ag (Cui et al., 2023), Sn-Ag-Cu (Kim and Yoon, 2023 ; Ma et al., 2024), Sn-Cu (Abdullah and Idris, 2023 ; Paixão...

... Limited 2023 Emerald Publishing Limited Licensed re-use rights only Optical module Self-propagating exothermic reaction Lead-free solder Residual stress Microstructure Thermal resistance With the rapid development of space technology, data-intensive technologies in aerospace...

.... 15 2.0 Source: Authors’ own work 02 02 2023 10 03 2023 10 03 2023 © Emerald Publishing Limited 2023 Emerald Publishing Limited Licensed re-use rights only Lead-free solder Interfacial reaction Sn–Bi–Zn Spreading phenomena Wetting kinetics...

...Zilong Wang; JiaCheng Zhou; Fang Liu; Yuqin Wu; Nu Yan Purpose The purpose of this paper is to study the microstructure and properties of Sn-3.5Ag and Sn-3.5Ag-0.5Sb lead-free solder alloys with and without a rotating magnetic field (RMF). Design/methodology/approach Optical microscopy...

... mechanical properties. Yingxin Goh can be contacted at: gohyingxin@um.edu.my 24 06 2021 14 01 2022 09 03 2022 © Emerald Publishing Limited 2022 Emerald Publishing Limited Licensed re-use rights only Lead-free solder Tensile Fracture mode Shear strength Hardness Sn...

...Guang Chen; Yao-Feng Wu Purpose The purpose of this paper is to investigate the effect of titanium nitride (TiN) on microstructure and composition of 96.5Sn3Ag0.5Cu (SAC305) lead-free solder joints under a large temperature gradient. Design/methodology/approach In this paper, SAC305 lead-free...

.... Hence, lead-free solder has become obligatory in the electronic industry, and in-depth study of behaviour is now more important than ever, including in the reliability aspects. One of the reliability aspects of solder joints is mechanical strength. The mechanical strength of solder alloys can...

... of applications in electronic industries. Due to the toxicity of the lead in the solder, lead-free solders were proposed to replace the lead-based solders. Sn-Ag-Cu solder family is one of the lead-free solders, which are proposed and considered as a potential replacement. Unfortunately, the Sn-Ag-Cu solder faces...

...Guang Chen; Jiqiang Li; Xinwen Kuang; Yaofeng Wu; Fengshun Wu Purpose The purpose of this paper is to investigate the effect of nickel-plated graphene (Ni-GNS) on the microstructure and mechanical properties of 96.5Sn3Ag0.5Cu (SAC305) lead-free solder joints before and after an electro-migration...

... can be contacted at: tangyu_mycauc@163.com Microstructure Wettability Lead-free solder Microhardness Mn nanoparticles To accurately observe the microstructure of the SAC0307-xMn(np) composite solders, the samples were sectioned along the axis and ground by using different...

... of this paper is to investigate the relationship between tensile and nanoindentation tests toward the mechanical properties and deformation behavior of Sn-3.0Ag-0.5Cu (SAC305) lead-free solder wire at room temperature. Design/methodology/approach Tensile test with different strain rates of 1.5 × 10-4 s-1...

...Yung-Sen Lin; Shiau-Min Lin; Jian-Yi Li; Min-Chih Liao Purpose An investigation has been performed on the improved solder wettability of oxidized aluminum (Al) with lead-free solder (96.5Sn-3.5Ag) using Ar-H₂ plasmas. The lead-free solder wettability was raised from 62.2 per cent...

...Izhan Abdullah; Muhammad Nubli Zulkifli; Azman Jalar; Roslina Ismail Purpose The purpose of this paper is to investigate the relationship between microstructure and varied strain rates towards the mechanical properties and deformation behaviour of Sn-3.0Ag-0.5Cu (SAC305) lead-free solder wire...

... temperature-time-dependent transitions in materials ”, American Laboratory , Vol. 33 No. 1 , pp. 26 - 31 . © Emerald Publishing Limited 2017 Emerald Publishing Limited Licensed re-use rights only Lead-free solder Intermetallic compound Differential scanning calorimetry X-ray...