...Quanyi Liu; Zhicheng Ding; Hongsheng Sun; Biao Liu; Yang Liu Purpose This study aims to investigate the effects of die-attaching temperature, force and time on the paste overflow behavior, microstructure and shear strength of Cu-Cu sintered joints. Design/methodology/approach The dried Cu...

...Jiacheng Zhou; Jinglin Shi; Dongfan Yin; Lei Xu; Fuwen Zhang; Zhigang Wang; Qiang Hu; Huijun He Purpose This study aims to investigate the impact of indium (In) content on the thermal properties, microstructure and mechanical properties of Sn-3Ag-3Sb-xIn (x = 0, 1, 2, 3, 4, 5 Wt...

... atmosphere, the high oxygen content in the reaction layer hinders the formation of the TiY2O5 reaction layer, thereby impeding the wetting of AgCuTi on YAG; in the vacuum, a contact angle (?=16.6°) is obtained by wetting AgCuTi filler alloy on the YAG substrate; the microstructure of the YAG/AgCuTi/kovar...

..., nickel nanoparticles (Ni NPs) were doped into Sn58Bi solder as a reinforcing agent to prepare a composite solder. The wettability of composite solder, melting characteristics of solder alloy, microstructure of joints, mechanical properties and intermetallics growth at the interface were investigated...

... 2 Cross-sectional BSE showing the interfacial microstructures of (a) Sn-3Ag-3Sb/Cu, (b) Sn-3Ag-3Sb-1In/Cu, (c) Sn-3Ag-3Sb-2In/Cu, (d) Sn-3Ag-3Sb-3In/Cu, (e) Sn-3Ag-3Sb-4In/Cu, (f) Sn-3Ag-3Sb-5In/Cu and (g) Sn-3Ag-0.5Cu/Cu During the soldering process, the molten solder and Cu pad undergo...

...Fengjiang Wang; Dapeng Yang; Guoqing Yin Purpose This paper aims to focus on the reliability of Sn15Bi–xAg and Sn15Bi–xCu solder joints during isothermal aging. Design/methodology/approach The effects of Ag or Cu additions on the microstructure, interfacial metallic compound...

...Danqing Fang; Chengjin Wu; Yansong Tan; Xin Li; Lilan Gao; Chunqiu Zhang; Bingjie Zhao Purpose The paper aims to study the effect of sintering temperature on the microstructure, shear strength and ratcheting fatigue life of nanosilver sintered lap shear joint. In addition, the Gerber model is used...

...Fang Liu; Zilong Wang; JiaCheng Zhou; Yuqin Wu; Zhen Wang Purpose The purpose of this study is to investigate the effects of Ce and Sb doping on the microstructure and thermal mechanical properties of Sn-1.0Ag-0.5Cu lead-free solder. The effects of 0.5%Sb and 0.07%Ce doping on microstructure...

... effect by design optimization. Zhiwen Chen can be contacted at: zwchen_lu@163.com 13 10 2023 30 12 2023 20 01 2024 © Emerald Publishing Limited 2024 Emerald Publishing Limited Licensed re-use rights only Microstructure Reliability Modeling Moisture...

... industry. Design/methodology/approach In this paper, Sn58Bi-xSi₃N₄ (x = 0, 0.2, 0.4, 0.6, 0.8, 1.0 Wt.%) was prepared for bonding Cu substrate, and the changes in thermal properties, wettability, microstructure, interfacial intermetallic compound and mechanical properties...

... of rapid solidification processing on structural, thermal and mechanical properties of Bi-Ag lead-free solder reinforced Tb rare-earth element. Findings The obtained results indicated that the microstructure consists of rhombohedral Bi-rich phase and Ag99.5Bi0.5 intermetallic compound (IMC...

... 2.82 ms. The maximum temperature in the PIC operating area during the process is 368.5°C. The maximum heating and cooling rates of the solder were 1.39 × 107°C/s and −5.15 × 106°C/s, respectively. The microstructure of SAC305 under self-propagating reaction heating is more refined than...

... was carried out to investigate the reliability of nano-silver sintered joints. Combining the evolution of the microstructure and shear strength of the joints, the degradation mechanisms of joints performance were characterized. Findings The results indicated that the degradation of the shear properties...

... characteristics and wettability of solder, as well as the microstructure, interfacial intermetallic compound (IMC) and mechanical properties of joint were evaluated. Findings The crystal plane spacing and lattice constant of Sn and Bi phase increase slightly. A minor variation in the Sn58Bi solder melting...

... rights only Microstructure Alloys Coatings Geometry control Nanomaterials have attracted much attention because they have special characteristics in optical, photovoltaic and catalytic applications that differ from those of bulk materials (He et al., 2008). Zinc oxide has a wide...

...Zilong Wang; JiaCheng Zhou; Fang Liu; Yuqin Wu; Nu Yan Purpose The purpose of this paper is to study the microstructure and properties of Sn-3.5Ag and Sn-3.5Ag-0.5Sb lead-free solder alloys with and without a rotating magnetic field (RMF). Design/methodology/approach Optical microscopy...

...–0.5Ag/Cu and Cu/Sn–5Sb/Cu were conducted, and its microstructure was analysed. The scanning electron microscope and the metallographic microscope characterized the microstructure of the Sn5Sb–0.5Cu–0.1Ni–0.5Ag/Cu and Sn–5Sb/Cu joints. Findings The microstructure of Cu/Sn5Sb–0.5Cu–0.1Ni–0.5Ag/Cu...

... of a small amount of holmium addition on the microstructure, thermal stability, mechanical behaviour and wettability of environmentally friendly eutectic melt-spun process Sn – Ag solder alloys. Dynamic resonance technique, X-ray diffraction (XRD) and scanning electron microscopy were carried to study...

...Xinmeng Zhai; Yue Chen; Yuefeng Li Purpose The purpose of this paper is to develop a new composite solder to improve the reliability of composite solder joints. Nano-particles modified multi-walled carbon nanotubes (Ni-MWCNTs) can indeed improve the microstructure of composite solder joints...

...). © Emerald Publishing Limited 2021 Emerald Publishing Limited Licensed re-use rights only Chip-on-board light source Microstructure Reliability Soldering temperature Vacuum reflow soldering As the chip-on-board (COB) packaging technology can provide higher lumen output...