...@gmail.com © Emerald Group Publishing Limited 2011 Crack growth Fracture Finite element analysis Product reliability Lifetime prediction Reliability Solders Thermal testing Shock tests SAC SnAgCu Electronic products have become a necessity in everyday life due to their wide use...

... Publishing Limited 2010 Circuits Product reliability Shear strength Soldering Ball grid array (BGA) removal and replacement are required during product development, and for manufacturing and field returns. In general, a single rework on a specific location is permitted without causing...

... Group Publishing Limited 2010 Adhesion Moisture Joining processes Electronic engineering Product reliability Personal and portable electronic devices are constantly becoming more common. In this situation, miniaturization techniques are extremely important. One problem...

... for power amplifier modules. M. Norén can be contacted at: markus.noren@epcos.com © Emerald Group Publishing Limited 2009 Temperature measurement Ceramics Product reliability Electronics industry Low temperature cofired ceramic (LTCC) technology is a multilayer ceramic...

... and the bottom side of the copper column as shown in Figure 5 ; and the maximum in‐plane cross‐section diameter D_s of the joint. © Emerald Group Publishing Limited 2009 Optimization Techniques Prototypes Product reliability Driven by market forces and legislation...

... to influence the solder ball mechanical strength, as well as the bonding strength of the solder joints to the metallic substrates. © Emerald Group Publishing Limited 2007 Soldering Product reliability Circuits Shear strength Intermetallic formation and kinetics at the solid‐liquid...

...) Product reliability A surface mount assembly is basically a composite structure consisting of three major parts: the printed circuit board (PCB), the solder joints and the components. In a surface mount assembly, materials with different thermal and mechanical properties are bonded together...

... made under various conditions. The process variables studied include solder pad diameters, solder paste volume and reflow peak temperatures. © Emerald Group Publishing Limited 2005 Solders Soldering Fatigue Product reliability SnPb solders have been widely used to make...

... attachment area (connectors are not populated) and ribbon cable are uppermost. © Emerald Group Publishing Limited 2004 Solders Product reliability Printed‐circuit boards As mentioned by Smetana et al. (2004) , one of the critical issues for lead‐free products is solder joint...

... elements such as Sn, Ag, Cu, Bi, In, and Zn have been identified as promising replacements for standard 63Sn‐37Pb eutectic solder. © Emerald Group Publishing Limited 2004 Soldering Joining processes Product reliability The compositions of the five alloys (four lead‐free and standard...

... for comparison. Furthermore, some specimens are subjected to multiple reflows to investigate the thermal aging effect. © Emerald Group Publishing Limited 2004 Product reliability Solders Shear strength Semiconductor technology The plastic ball grid array (PBGA) package has attracted...

...). Solders Product reliability Joining processes Printed‐circuit boards 1. Using a chemomet cloth, polish with 0.05 μm alumina slurry. 2. Rinse sample on the polishing cloth with water. 3. Using a chemomet cloth, polish with 0.06 μm colloidal silica. 4. Rinse...

... obvious adverse effects on the solder joint lifetime. Different material/process combinations (underfill, flux, reflow atmospheres) were designed in order to understand the role of material/process factors on the solder joint lifetime and the results are discussed. Solder Joining processes Product...