... matrix, the grain size of β-Sn phases in Sn-58Bi solder matrix was finer than that in Sn-3.0Ag-0.5Cu solder. Meanwhile, statistics on the grain size of β-Sn and Bi-rich phases in Sn-Bi solder and β-Sn phases in Sn-Ag-Cu solder increased with solder size increasing. At the interface of solder joints...

... Emerald Publishing Limited 2024 Emerald Publishing Limited Licensed re-use rights only Solder paste Sn-Bi Sn-Ag-Cu Shear strength The process of preparing hybrid solder joints is shown in Figure 1(a) . Firstly, Sn58Bi and SAC0307 were mechanically mixed in the ratios of 8:2, 6:4, 4:6...

... has rarely been reported, especially for Sn-Ag-Cu lead-free solder. Thus, this research provides a fundamental understanding of the micromechanical response (hardness and creep behaviour) of solder, especially lead-free solder alloy, to gamma irradiation. Wan Yusmawati Wan Yusoff can be contacted...

... 12,993 10 12 2020 13 03 2021 19 03 2021 © 2021 Emerald Publishing Limited 2021 Emerald Publishing Limited Licensed re-use rights only Sn–Ag–Cu Solder alloys Electronic assembly Thermo-mechanical fatigue Solder joint Electronic assemblies are extensively...

... 2021 © Emerald Publishing Limited 2021 Emerald Publishing Limited Licensed re-use rights only Pb-free Sn-Ag-Cu Finite element modelling (FEM) Thermal fatigue Reliability Fatigue life Thermal interface materials SAC solders Modelling The schematic diagrams of the designed...

...@163.com and G. Kavithaa can be contacted at: gkavithaa1980@gmail.com 14 05 2020 02 08 2020 19 08 2020 © Emerald Publishing Limited 2020 Emerald Publishing Limited Licensed re-use rights only Sn-Ag-Cu Solder joints Thermal fatigue Useful lifetime Nowadays...

... condition Jicong Zhao can be contacted at: jczhao@ntu.edu.cn 11 06 2020 26 09 2020 07 10 2020 © Emerald Publishing Limited 2020 Emerald Publishing Limited Licensed re-use rights only Sn-Ag-Cu Thermal fatigue Solder bumps Wafer-level package (WLP...

... scanning calorimetry (DSC) Microstructure Pb-free Sn-Ag-Cu Solder alloys Due to health and environmental concerns, the electronic industry is trying to replace the Sn-Pb solder with appropriate lead-free solder (LFS) alloys. More than 70 LFS alloys have been reported in the literature, most...

... properties of Sn-3.0Ag-0.5Cu (SAC305)/CNT/Cu solder joint under blast wave condition. This work is an extension from the previous study of microstructural evolution and hardness properties of Sn-Ag-Cu (SAC) solder under blast wave condition. Design/methodology/approach SAC/CNT solder pastes were...

... Emerald Publishing Limited Licensed re-use rights only Azman Jalar can be contacted at: azmn@ukm.edu.my 17 07 2019 09 10 2019 05 12 2019 Sn-Ag-Cu Solder paste CNT Flux Wettability IMC layer thickness Functional group Solders and soldering processes...

... 2017 02 02 2017 © Emerald Publishing Limited 2017 Emerald Publishing Limited Licensed re-use rights only Sn-Ag-Cu 01005 components Lead-free Reflow atmosphere Solderability Solders are used for assembling electronic components to printed circuit boards and act...

... Limited 2017 Emerald Publishing Limited Licensed re-use rights only Alloys Sn-Ag-Cu Finite element modeling (FEM) Reliability The three-dimensional (3D) integrated circuit (IC) package has attracted considerable attention because of the expected physical limitations in the fabrication...

... at: weltsch.zoltan@gamf.kefo.hu 24 01 2016 11 05 2016 27 07 2016 28 07 2016 © Emerald Publishing Limited 2017 Emerald Publishing Limited Licensed re-use rights only Microstructure Sn-Ag-Cu Solder Wetting Laser treatment Soldering is the most popular joint technique...

... Publishing Limited 2016 Emerald Group Publishing Limited Licensed re-use rights only Flux Sn-Ag-Cu Solder Solder paste PEG-rosin Polyethylene glycol Rosin Sn-Cu The production of electronic products via soldering has shifted to more environmentally friendly processes, for example...

... by the heat deformation theory and the function of temperature distribution in materials physics. Jibing Chen can be contacted at: chenjb64@163.com © Emerald Group Publishing Limited 2015 Intermetallic compounds Solder joints Thermal fatigue Microstructure Sn-Ag-Cu Figure 1...

.... G. Takyi can be contacted at: gtakyi.soe@knust.edu.gh © Emerald Group Publishing Limited 2015 Intermetallic compounds Sn-Ag-Cu Solder Shear strength In the twenty-first century, 1206 chip resistors have been widely used in automotive electronics in applications such as air...

... material selection was established by understanding its affection to thermo-mechanical reliability of this particular flip chip package structure. Flip chips Sn-Ag-Cu Thermal fatigue Reliability Interconnects Solder bumps In Controlled Collapse Chip Connection (C4 flip chip interconnection...

...Ervina Efzan Mhd Noor; Amares Singh Purpose – The aim of the present study was to gather and review all the important properties of the Sn–Ag–Cu (SAC) solder alloy. The SAC solder alloy has been proposed as the alternative solder to overcome the environmental concern of lead (Pb) solder. Many...

... 2014 Intermetallic compounds Sn-Ag-Cu Microstructure Oxidation Reflow soldering The drive for Sn-3.0Ag-0.5Cu (SAC305) lead-free solder in the microelectronics industry has presented a number of new reliability challenges, especially from failure due to corrosion. Moreover...

... significant voids elimination. Beata Kinga Synkiewicz can be contacted at: synkiewicz@ite.waw.pl © Emerald Group Publishing Limited 2014 Alloys Pb-free Solder joints Sn-Ag-Cu When the void content is not at a high level, their presence is commonly acceptable, but the main...