... matrix, the grain size of β-Sn phases in Sn-58Bi solder matrix was finer than that in Sn-3.0Ag-0.5Cu solder. Meanwhile, statistics on the grain size of β-Sn and Bi-rich phases in Sn-Bi solder and β-Sn phases in Sn-Ag-Cu solder increased with solder size increasing. At the interface of solder joints...

... for the optimization of low-temperature solder composition and soldering process under different package designs. 22 03 2024 06 06 2024 07 07 2024 07 07 2024 © Emerald Publishing Limited 2024 Emerald Publishing Limited Licensed re-use rights only Solder paste Sn-Bi Sn-Ag-Cu...

... has rarely been reported, especially for Sn-Ag-Cu lead-free solder. Thus, this research provides a fundamental understanding of the micromechanical response (hardness and creep behaviour) of solder, especially lead-free solder alloy, to gamma irradiation. Electronic devices are frequently exposed...

... can be contacted at: nisith.geetha@gmail.com 10 12 2020 13 03 2021 19 03 2021 © Emerald Publishing Limited 2021 Emerald Publishing Limited Licensed re-use rights only Sn–Ag–Cu Solder alloys Electronic assembly Thermo-mechanical fatigue Solder joint...

... rights only Pb-free Sn-Ag-Cu Finite element modelling (FEM) Thermal fatigue Reliability Fatigue life Thermal interface materials SAC solders Modelling The operation of microelectronic devices in a wide range of environments has led to different types of failures, and this is a major...

...@163.com and G. Kavithaa can be contacted at: gkavithaa1980@gmail.com 14 05 2020 02 08 2020 19 08 2020 © Emerald Publishing Limited 2020 Emerald Publishing Limited Licensed re-use rights only Sn-Ag-Cu Solder joints Thermal fatigue Useful lifetime Kavithaa...

... reaction occurs with the copper post below to form a solder joint that can be bonded with the base plate pad. Figure 2 Package process flow Sn-Ag-Cu Thermal fatigue Solder bumps Wafer-level package (WLP) Copper post bump technology is a new generation of chip interconnection...

... alloys Microstructural and microhardness change Thermal properties Differential scanning calorimetry (DSC) Microstructure Pb-free Sn-Ag-Cu Solder alloys Osvaldo Fornaro can be contacted at: ofornaro@exa.unicen.edu.ar 26 03 2020 19 05 2020 02 06 2020 ©...

... properties of Sn-3.0Ag-0.5Cu (SAC305)/CNT/Cu solder joint under blast wave condition. This work is an extension from the previous study of microstructural evolution and hardness properties of Sn-Ag-Cu (SAC) solder under blast wave condition. Design/methodology/approach SAC/CNT solder pastes were...

... properties. Azman Jalar can be contacted at: azmn@ukm.edu.my 17 07 2019 09 10 2019 05 12 2019 © Emerald Publishing Limited 2020 Emerald Publishing Limited Licensed re-use rights only Sn-Ag-Cu Solder paste CNT Flux Wettability IMC layer thickness Functional group...

... 8 Comparison of the defect ratios for different placement systems Dongyan Ding can be contacted at: dyding@sjtu.edu.cn 17 10 2016 09 01 2017 02 02 2017 © Emerald Publishing Limited 2017 Emerald Publishing Limited Licensed re-use rights only Sn-Ag-Cu...

...), “ Reliability study of Sn-Ag-Cu-Ce soldered joints in quad flat packages ”, Microelectronics Reliability , Vol. 50 No. 12 , pp. 2071 - 2077 . Alloys Sn-Ag-Cu Finite element modeling (FEM) Reliability The three-dimensional (3D) integrated circuit (IC) package has attracted considerable...

... Microstructure Sn-Ag-Cu Solder Wetting Laser treatment Soldering is the most popular joint technique in microelectronic and optoelectronic industries, the technologies of which are widely used in the vehicle industry (Baumli, 2015a , 2015b ; Judd and Brindley, 1999 ; Lau, 1997 ; Tu, 2007...

... into more detail, as well as field test. Flux Sn-Ag-Cu Solder Solder paste PEG-rosin Polyethylene glycol Rosin Sn-Cu Kanlaya Phaphon is the corresponding author and can be contacted at: Kanlaya.P@Student.chula.ac.th 27 08 2015 20 12 2015 25 05 2016 31 05 2016...

... by the heat deformation theory and the function of temperature distribution in materials physics. Jibing Chen can be contacted at: chenjb64@163.com © Emerald Group Publishing Limited 2015 Intermetallic compounds Solder joints Thermal fatigue Microstructure Sn-Ag-Cu Lead-free...

... chip resistors with tin-silver-copper (SAC)305 solder joints because the wetting was better, and therefore, the joint area was larger for Sn-Pb than for Sn-Ag-Cu. The results of experiments carried out on the effect of thermal cycling and shear force on 1206, 0805 and 0603 chip resistors in the work...

... material selection was established by understanding its affection to thermo-mechanical reliability of this particular flip chip package structure. Jae B. Kwak can be contacted at: jae.kwak@samsung.com © Emerald Group Publishing Limited 2015 Flip chips Sn-Ag-Cu Thermal fatigue...

...Ervina Efzan Mhd Noor; Amares Singh Purpose – The aim of the present study was to gather and review all the important properties of the Sn–Ag–Cu (SAC) solder alloy. The SAC solder alloy has been proposed as the alternative solder to overcome the environmental concern of lead (Pb) solder. Many...

..., 2008), who evaluated the interfacial reactions of Cu/eutectic Sn-Ag-Cu/Cu sandwich solder joints during isothermal aging at 150°C. The dissolved Cu atoms precipitated to form IMCs in the solder matrix. The Cu₆Sn₅ phase has a high growth rate at the SAC305/Cu interface (Tu and Zeng...

.... Beata Kinga Synkiewicz can be contacted at: synkiewicz@ite.waw.pl © Emerald Group Publishing Limited 2014 Alloys Pb-free Solder joints Sn-Ag-Cu Recent research has proposed an approach for minimizing void density and size. It was established that with a vacuum of < 2 kPa, free...