Issues

Appointments

Asymtek/Nordson appoints Smart Technology (SmartTec) as new distributor in Europe

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Universal announces new management appointments

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Universal appoints distributor for German territories

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Association news

SMART Group AOI seminar at Haldex Brakes, Redditch

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SMART Group Web site and PPM-monitoring updates

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SMTA and Asymtek partner at first inaugural meeting of SMTA, Costa Rica

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Book reviews

Area Array Packaging Handbook

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Bebop to the Boolean Boogie

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Interactive Guide to Flexible Circuit Technology

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Understanding Automotive Electronics

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Chip Scale Packaging for Modern Electronics

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Call for papers

The 7th VLSI Packaging Workshop of Japan 30 November-2 December 2004

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The effect of lead‐free solder paste on component placement accuracy and self‐alignment during reflow

Timo Liukkonen; Pekka Nummenpää; Aulis Tuominen
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Thermal fatigue cracking of surface mount conductive adhesive joints

Zhimin Mo; Zonghe Lai; Shiming Li; Johan Liu
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Characterization of mechanical performance of Sn/Ag/Cu solder joints with different component lead coatings

Minna Arra; Todd Castello; Dongkai Shangguan; Eero Ristolainen
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Reflow profile study of the Sn‐Ag‐Cu solder

B. Salam; C. Virseda; H. Da; N.N. Ekere; R. Durairaj
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Design, materials and process for lead‐free assembly of high‐density packages

Joe Smetana; Rob Horsley; John Lau; Ken Snowdon; Dongkai Shangguan; Jerry Gleason; Irv Memis; Dave Love; Walter Dauksher; Bob Sullivan
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Design for lead‐free solder joint reliability of high‐density packages

John Lau; Walter Dauksher; Joe Smetana; Rob Horsley; Dongkai Shangguan; Todd Castello; Irv Menis; Dave Love; Bob Sullivan
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Exhibitions and conferences

Exhibitions and conferences

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Industry news

DEK rewarded by Frost and Sullivan

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DEK launches stencil renaissance with VectorGuard™ at Productronica 2003

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Asymtek launches new high-speed DispenseJet® DJ-9000Jet

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Siemens Dimatic places new Siplace managers in Asia

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Universal Instruments appoints distributor for United Kingdom

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Universal Instruments and Heraeus join forces to share knowledge with customers

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NPL releases stencil and aperture design report

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Electrolube dances to the Samba beat

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Celestica’s kidsgrove facility accredited to medical devices standard ISO13488:1996 and compliant to ISO13485:2003

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DEK steps into the future with Galaxy

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Asymtek’s new SC-300 Swirl Coat™ applicator features three modes of operation for flexibility and control

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New studies will uncover mechanisms of protection for electronic conformal coatings

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Nanomix and DuPont Electronic Technologies sign exclusive licensing agreement for the use of carbon nanotubes in field emission displays

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Karl Seelig of AIM honoured with IPC President’s Award

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Ion chromatography available at NPL, £30K invested

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AIM opens office in Suzhou, China

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Small reflow oven for lead-free SMT

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International diary

International diary

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Internet commentary

Internet commentary

Brian Ellis
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Message from the Associate Editor

Message from the Associate Editor

John Ling
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New products

Fisnar benchtop dispenser is feature-packed at low cost

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TBA launch latest range of test instrumentation

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New potting compound for RF circuits

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Siemens Dematic unveils Siplace HF/3 placement machine at Productronica

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New Advantis™ raises entry-level performance, reduces cost-per-placement

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Highly versatile optical inspection system produces outstanding results on large boards measuring up to 914 × 914 mm

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New range of static-safe desoldering guns from TBA ECP

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Concoat introduce the latest MUST System II Plus solderability tester for analysing the smallest surface mount devices

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HawkEye: a new breed of automatic print verification

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ProFlex™ heralds high throughput printing at ultra-fine resolution

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Greener conformal coating aerosol from Concoat

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New mass imaging process enhances TIM at a stroke

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DEK enhances stencil manufacturing capabilities and installs Next Generation Inspection System

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DuPont Microcircuit Materials announces commercially available thick film material system for aluminum nitride

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Burr and stress free precision components by chemical techniques

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Speedprint launches new 29 in. large area printer

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DEK’s technology for the ePrinter age

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Ready for lead-free

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Introducing the APR-5000-XLS array package rework system: Metcal makes its innovative rework system bigger and better

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Tombstoning is laid to rest!

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Autosplice expands SMiT shield clip family with introduction of the maxi-clip for handling larger, thicker RF shields

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New Europlacer product – a flexible "all in one" placement solution

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New Horizon 03 (ELA) featured for convenience and rapid changeovers

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Note from the publisher

Note from the publisher

John Peters
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Reports

The SMART Group lead-free assembly and soldering workshop

John Ling
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Productronica 2003

John Ling
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