... for 72 h. Mechanical properties, including yield strength ( YS ) and ultimate tensile strength ( UTS ), were evaluated using a universal testing machine. Microstructural evolution was examined through scanning electron microscopy ( SEM ), and elemental composition was confirmed via energy-dispersive X...

... Publishing Limited 2025 Emerald Publishing Limited Licensed re-use rights only Sn37Pb/Ni-xCu solder joint Interfacial reaction Intermetallic compounds Grain characteristics Mechanical properties The Sn37Pb eutectic solder has been extensively used in high-power device...

...Jiacheng Zhou; Jinglin Shi; Dongfan Yin; Lei Xu; Fuwen Zhang; Zhigang Wang; Qiang Hu; Huijun He Purpose This study aims to investigate the impact of indium (In) content on the thermal properties, microstructure and mechanical properties of Sn-3Ag-3Sb-xIn (x = 0, 1, 2, 3, 4, 5 Wt...

..., nickel nanoparticles (Ni NPs) were doped into Sn58Bi solder as a reinforcing agent to prepare a composite solder. The wettability of composite solder, melting characteristics of solder alloy, microstructure of joints, mechanical properties and intermetallics growth at the interface were investigated...

... ( Liu et al., 2019 , 2020a , 2021 ) and so on. These experiments have been shown to refine the microstructure, improve wettability and enhance mechanical properties. In recent years, the electronic industries banned the use of Pb-based solders due to the hazards of Pb to human health...

...Fang Liu; Zilong Wang; JiaCheng Zhou; Yuqin Wu; Zhen Wang Purpose The purpose of this study is to investigate the effects of Ce and Sb doping on the microstructure and thermal mechanical properties of Sn-1.0Ag-0.5Cu lead-free solder. The effects of 0.5%Sb and 0.07%Ce doping on microstructure...

... characteristics and wettability of solder, as well as the microstructure, interfacial intermetallic compound (IMC) and mechanical properties of joint were evaluated. Findings The crystal plane spacing and lattice constant of Sn and Bi phase increase slightly. A minor variation in the Sn58Bi solder melting...

..., scanning electron microscopy and X-ray diffraction were used to analyze the effect of an RMF on the microstructure of the solders. Differential scanning calorimetry was used to study the influence of the RMF on the thermal characteristics of the solders. The mechanical properties of the alloys were...

... in reducing and refines the crystallite size as well as the Ag3Sn IMC which reinforced the strength of plain solder alloy. The mechanical properties values such as Young’s modulus, Vickers microhardness of Sn-3.5Ag solder alloy can be significantly improved by adding a trace amount of Ho particles compared...

...Madhuri Chandrashekhar Deshpande; Rajesh Chaudhari; Ramesh Narayanan; Harishwar Kale Purpose This study aims to develop indium-based solders for cryogenic applications. Design/methodology/approach This paper aims to investigate mechanical properties of indium-based solder formulations at room...

...Guang Chen; Xinzhan Cui; Yaofeng Wu; Wei Li; Fengshun Wu Purpose The purpose of this paper is to investigate the effect of fullerene (FNS) reinforcements on the microstructure and mechanical properties of 96.5Sn3Ag0.5Cu (SAC305) lead-free solder joints under isothermal ageing and electrical...

... The current paper presents a comprehensive review of the tin-silver-copper solder series with possible solutions for improving their microstructure, melting point, mechanical properties and wettability through the addition of different elements/nanoparticles and other materials. Originality/value...

... to its microstructure and in turn, its mechanical properties at high temperature, the addition of different elements into Tin-Silver-Copper is important for investigations. The purpose of this paper is to analyse the effect of lanthanum doping on the microstructure, microhardness and tensile properties...

...Guang Chen; Jiqiang Li; Xinwen Kuang; Yaofeng Wu; Fengshun Wu Purpose The purpose of this paper is to investigate the effect of nickel-plated graphene (Ni-GNS) on the microstructure and mechanical properties of 96.5Sn3Ag0.5Cu (SAC305) lead-free solder joints before and after an electro-migration...

... properties of Sn-20In-2.8Ag were not satisfactory. The reason for the poor mechanical properties of the Sn-20In-2.8Ag/Cu joint was revealed, and a way to solve the problem was found. Design/methodology/approach The microstructure evolution, characteristics of melting and solidification and joining...

...Muhammad Aamir; Izhar; Muhammad Waqas; Muhammad Iqbal; Muhammad Imran Hanif; Riaz Muhammad Purpose This paper aims to develop a fuzzy logic-based algorithm to predict the intermetallic compound (IMC) size and mechanical properties of soldering material, Sn96.5-Ag3.0-Cu0.5 (SAC305) alloy...

...Izhan Abdullah; Muhammad Nubli Zulkifli; Azman Jalar; Roslina Ismail Purpose The purpose of this paper is to investigate the relationship between microstructure and varied strain rates towards the mechanical properties and deformation behaviour of Sn-3.0Ag-0.5Cu (SAC305) lead-free solder wire...

.... Microstructure Mechanical properties Wettability Al₂O₃ nanoparticles Composite solder Retained ratio SAC In recent years, environmental and health concerns caused by the use of lead in the electronic industry have motivated the development of lead-free solders (Han et al...

...Huan Wang; Yongchang Liu; Huixia Gao; Zhiming Gao Purpose – This paper aims to investigate the transformations during aging at 200°C for different periods on microstructure and mechanical properties of high-temperature Zn-4Al-3Mg solders. Design/methodology/approach – The solder was melted...

...W.J. Plumbridge While the implementation of lead‐free solder technology has been the focus of much recent research, the challenge of joint structural integrity should not be overlooked. The paper summarises the significant variability in the mechanical properties of solders, both in terms...